Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
108 words
A chuck for cooling a planar electronic substrate which comprises a body having a planar upper surface, a plurality of micro-channels extending into said body from said planar upper surface, said plurality of micro-channels being separated from one another by individual ones of a plurality of cooling fins, a liquid coolant circulation system including at least one liquid coolant supply manifold positioned in said body to supply liquid coolant to said plurality of micro-channels and at least one liquid coolant exit manifold positioned in said body to remove liquid coolant from said plurality of micro-channels, and a source of a vacuum connected to said liquid coolant circulation system.
Claim 2
Dependent Claim
108 words
A chuck for cooling a planar electronic substrate which comprises a body having a planar upper surface, a plurality of micro-channels extending into said body from said planar upper surface, said plurality of micro-channels being separated from one another by individual ones of a plurality of cooling fins, a liquid coolant circulation system including at least one liquid coolant supply manifold positioned in said body to supply liquid coolant to said plurality of micro-channels and at least one liquid coolant exit manifold positioned in said body to remove liquid coolant from said plurality of micro-channels, and a source of a vacuum connected to said liquid coolant circulation system.
Claim 3
Dependent Claim
58 words
The chuck for cooling a planar electronic substrate of claim 1 in which said at least one liquid coolant supply manifold is connected to said plurality of micro-channels by at least one liquid supply slot and said at least one liquid coolant exit manifold is connected to said plurality of micro-channels by at least one liquid exit slot.
Claim 4
Dependent Claim
44 words
The chuck for cooling a planar electronic substrate of claim 2 in which said at least one liquid supply slot and said at least one liquid exit slot extend from a bottom surface of said body into said body to said plurality of micro-channels.
Claim 5
Dependent Claim
38 words
The chuck for cooling a planar electronic substrate of claim 1 in which said at least one liquid coolant supply manifold and said at least one liquid coolant exit manifold are directly connected to said plurality of micro-channels.
Claim 6
Dependent Claim
27 words
The chuck for cooling a planar electronic substrate of claim 1 in which said chuck is configured to hold a semiconductor wafer as the planar electronic substrate.
Claim 7
Dependent Claim
32 words
The chuck for cooling a planar electronic substrate of claim 1 in which said at least one liquid coolant supply manifold is connected to a source of water as the liquid coolant.
Claim 8
Independent Claim
71 words
A method for cooling a planar electronic substrate, which comprises positioning the planar electronic substrate on a cooling chuck having a body and a planar upper surface with a plurality of micro-channels extending from the planar upper surface into the body, circulating liquid coolant in the micro-channels, and applying a vacuum to the liquid coolant in the micro-channels to apply force for holding the planar electronic substrate on the cooling chuck.
Claim 9
Independent Claim
71 words
A method for cooling a planar electronic substrate, which comprises positioning the planar electronic substrate on a cooling chuck having a body and a planar upper surface with a plurality of micro-channels extending from the planar upper surface into the body, circulating liquid coolant in the micro-channels, and applying a vacuum to the liquid coolant in the micro-channels to apply force for holding the planar electronic substrate on the cooling chuck.
Claim 10
Dependent Claim
28 words
The method for cooling a planar electronic substrate of claim 7 in which the plurality of micro-channels are connected to a source of water as the liquid coolant.
Claim 11
Dependent Claim
34 words
The method for cooling a planar electronic substrate of claim 7 additionally comprising the step of applying continuous operating power to the planar electronic substrate while the liquid coolant is circulated in the micro-channels.