Heat block of wire bonding machine

Claim 2

A heat block of a wire bonding machine comprising: an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame; a chip heating part for bonding the other ends of said wires to a semiconductor chip; and heating means comprising at least a pair of heaters and a pair of thermocouples provided with a thermal insulation member to differentially heat said inner lead heating part and said chip heating part such that said inner lead heating part has a relatively higher temperature than that of said chip heating part.

Claim 3

A heat block of a wire bonding machine according to claim 1, wherein said differentially heating means comprises: a pair of second heaters and a pair of second thermocouples each of which is crossly provided in an upper heating block under said inner lead heating part, said upper heating block having said chip heating part and said inner lead heating part thereon; a first heater and a first thermocouple which are disposed in a lower heating block, on which lower heating block said upper heating block is supported; and thermal insulation members each of which is provided in said upper heating block in order to surround one of said heaters and one of said second thermocouples; whereby said heating means differentially heating the inner lead heating part and the chip heating part by using the thermal insulation between the inner lead heating part and the chip heating part.

Claim 4

A heat block of a wire bonding machine according to claim 1, wherein said differentially heating means comprises: a first heater and a first thermocouple which are crossly disposed in an upper heating block under said chip heating part, said upper heating block having said chip heating part and said inner lead heating part thereon; a pair of second heaters and a pair of second thermocouples each crossly provided in each side of said upper heating block under the inner lead heating part; and thermal insulation members each of which is provided in said upper heating block in order to surround one second heater and one second thermocouple, whereby said heating means differentially heating the inner lead heating part and the chip heating part by using the thermal insulation between the inner lead heating part and the chip heating part.

Claim 5

A heat block of a wire bonding machine according to claim 1, wherein said differentially heating means comprises: a thermal insulation plate which is disposed between upper and lower heating blocks for insulating therebetween, said upper heating block having said inner lead heating part thereon, said lower heating block being adapted for supporting said upper heating block thereon; an insert opening vertically formed inside the inner lead heating part of the upper heating block; and an insert part which is formed as upwardly extending from an upper surface of said lower heating block in order to be inserted into said insert opening of the upper heating block, and is covered on the side surfaces thereof with a thermal insulation part which is integrally formed with said thermal insulation plate, said insert part having an upper surface functioning as said chip heating part; a first heater and a first thermocouple which are longitudinally disposed in a center portion of the lower heating block; and a pair of second heaters and a pair of second thermocouples each longitudinally provided in each side of said upper heating block under the inner lead heating part, whereby said heating means differentially heating the inner lead heating part and the chip heating part by using the thermal insulation between the inner lead heating part and the chip heating part.

Claim 6

A heat block of a wire bonding machine comprising: an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame; a chip heating part for bonding the other ends of said wires to a semiconductor chip; and heating means for heating said inner lead heating part and said chip heating part such that said inner lead heating part has a relatively higher temperature than that of said chip heating part, said heating means comprising: a radiant opening formed in an upper heating block under said chip heating part in order to allow a radiant air to circulate therethrough, said upper heating block having said chip heating part and said inner lead heating part thereon; and a heater and a thermocouple which are mounted in one of said upper heating block and a lower heating block, said lower heating block adapted for supporting said upper heating block thereon, whereby said heating means differentially heating said chip heating part and said inner lead heating part by using a radiant air circulation through said radiant opening.

Claim 7

A heat block of a wire bonding machine comprising: an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame; a chip heating part for bonding the other ends of said wires to a semiconductor chip; and heating means for heating said inner lead heating part and said chip heating part such that said inner lead heating part has a relatively higher temperature than that of said chip heating part, said heating means comprising: a radiant opening formed in an upper heating block under said chip heating part in order to allow a radiant air to circulate therethrough, said upper heating block having said chip heating part and said inner lead heating part thereon; and a heater and a thermocouple which are mounted in one of said upper heating block and a lower heating block, said lower heating block adapted for supporting said upper heating block thereon, whereby said heating means differentially heating said chip heating part and said inner lead heating part by using a radiant air circulation through said radiant opening.

Claim 8

A heat block of a wire bonding machine comprising: an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame; a chip heating part for bonding the other ends of said wires to a semiconductor chip, said inner lead heating part and said chip heating part being made of materials with different thermal conductivity; and heating means for differentially heating said inner lead heating part and said chip heating part such that said inner lead heating part has a relatively higher temperature than that of said chip heating part.

Claim 9

A heat block of a wire bonding machine comprising: an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame; a chip heating part for bonding the other ends of said wires to a semiconductor chip, said inner lead heating part and said chip heating part being made of materials with different thermal conductivity; and heating means for differentially heating said inner lead heating part and said chip heating part such that said inner lead heating part has a relatively higher temperature than that of said chip heating part.

Claim 10

A heat block of a wire bonding machine according to claim 6, wherein said heating means comprises: an insert opening which is vertically formed at a center portion of said inner lead heating part of an upper heating block, said upper heating block having said inner lead heating part thereon; a separate-type chip heating block which is made of a material of relatively lower thermal conductivity than that of said upper heating block and adapted for being received in said insert opening, said chip heating block having an upper surface functioning as said chip heating part; and a heater and a thermocouple which are mounted in one of said upper heating block and a lower heating block, said lower heating block adapted for supporting said upper heating block thereon, whereby said heating means differentially heating said chip heating part and said inner lead heating part by using a difference of the thermal conductivity between the materials of the chip heating block and the upper heating block.