Patent US5200806A successfully refreshed from Google Patents.
US5200806A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame having a plurality of island regions and a suspension pin
Assignee: Toshiba Corp
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Filing: 1990-09-12
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Granted: 1993-04-06
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Expires: 2010-09-12
Abstract
Abstract A lead frame of this invention, which is made of a die-cut conductive plate and used for manufacturing a semiconductor device, comprises a frame portion at the peripheral area of the lead frame, a main bed portion supported by support members extending from the frame portion for mounting a semiconductor main chip, a plurality of leads extending from opposite sides of the frame portion toward the inner area of the lead frame, with the tip portion thereof being positioned near at the main bed portion, some of the plurality of leads having a sub-bed portion formed at a predetermined area for mounting a semiconductor sub-chip, and a suspension pin formed outside of a predetermined lead which is positioned at the outmost position of the plurality of leads, the suspension pin extending along the predetermined lead and being resin sealed with the plurality of leads at a resin molding process of semiconductor device manufacturing processes.
Inventors
- 👤 Hiromiti Sawaya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 00:50
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/461; H10W70/411; H10W70/421; H10W90/00; H10W90/811; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
148 words
A lead frame made of a die-cut conductive plate and used for manufacturing a semiconductor device, comprising: a frame portion at the peripheral area of said lead frame; a main bed portion supported by support members extending from said frame portion for mounting a semiconductor main chip; a plurality of leads extending from opposite sides of said frame portion toward the inner area of said lead frame, with the tip portion thereof being positioned near said main bed portion, some of said plurality of leads having a sub-bed portion formed at a predetermined area for mounting a semiconductor sub-chip; and a suspension pin formed outside of a predetermined lead which is positioned at the outmost position of said plurality of leads, said suspension pin extending along said predetermined lead and being resin sealed with said plurality of leads at a resin molding process of semiconductor device manufacturing processes.
Claim 2
Dependent Claim
148 words
A lead frame made of a die-cut conductive plate and used for manufacturing a semiconductor device, comprising: a frame portion at the peripheral area of said lead frame; a main bed portion supported by support members extending from said frame portion for mounting a semiconductor main chip; a plurality of leads extending from opposite sides of said frame portion toward the inner area of said lead frame, with the tip portion thereof being positioned near said main bed portion, some of said plurality of leads having a sub-bed portion formed at a predetermined area for mounting a semiconductor sub-chip; and a suspension pin formed outside of a predetermined lead which is positioned at the outmost position of said plurality of leads, said suspension pin extending along said predetermined lead and being resin sealed with said plurality of leads at a resin molding process of semiconductor device manufacturing processes.
Claim 3
Dependent Claim
28 words
A lead frame according to claim 1, wherein said sub-bed portion is formed at the intermediate area between the base portion and tip portion of said predetermined lead.
Claim 4
Dependent Claim
18 words
A lead frame according to claim 1, wherein said support members are wider than said main bed portion.
Claim 5
Dependent Claim
17 words
A lead frame according to claim 1, wherein said sub-bed portion is wider than said predetermined lead.
Claim 6
Dependent Claim
15 words
A lead frame according to claim 1, wherein said support members also functions as leads.
Claim 7
Dependent Claim
162 words
A semiconductor device formed by resin sealing a lead frame mounting semiconductor chips thereon, said lead frame made of a die-cut conductive plate and used for manufacturing a semiconductor device, comprising: a frame portion at the peripheral area of said lead frame; a main bed portion supported by support members extending from said frame portion for mounting a semiconductor main chip; a plurality of leads extending from opposite sides of said frame portion toward the inner area of said lead frame, with the tip portion thereof being positioned near said main bed portion, some of said plurality of leads having a sub-bed portion formed at a predetermined area for mounting a semiconductor sub-chip; and a suspension pin formed outside of a predetermined lead which is positioned at the outmost position of said plurality of leads, said suspension pin extending along said predetermined lead and being resin sealed with said plurality of leads at a resin molding process of semiconductor device manufacturing processes.
Claim 8
Dependent Claim
162 words
A semiconductor device formed by resin sealing a lead frame mounting semiconductor chips thereon, said lead frame made of a die-cut conductive plate and used for manufacturing a semiconductor device, comprising: a frame portion at the peripheral area of said lead frame; a main bed portion supported by support members extending from said frame portion for mounting a semiconductor main chip; a plurality of leads extending from opposite sides of said frame portion toward the inner area of said lead frame, with the tip portion thereof being positioned near said main bed portion, some of said plurality of leads having a sub-bed portion formed at a predetermined area for mounting a semiconductor sub-chip; and a suspension pin formed outside of a predetermined lead which is positioned at the outmost position of said plurality of leads, said suspension pin extending along said predetermined lead and being resin sealed with said plurality of leads at a resin molding process of semiconductor device manufacturing processes.
Claim 9
Dependent Claim
28 words
A lead frame according to claim 6, wherein said sub-bed portion is formed at the intermediate area between the base portion and tip portion of said predetermined lead.
Claim 10
Dependent Claim
18 words
A lead frame according to claim 6, wherein said support members are wider than said main bed portion.
Claim 11
Dependent Claim
17 words
A lead frame according to claim 6, wherein said sub-bed portion is wider than said predetermined lead.
Claim 12
Dependent Claim
15 words
A lead frame according to claim 6, wherein said support members also functions as leads.
References Cited (Backward Citations)
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JPS53108368A
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JPS5827332A
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JPH02284456A
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WO1991004575A1
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JPH03152965A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-05 | 1996-10-05 | 1997-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-05 | 2000-10-05 | 2001-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-05 | 2004-10-05 | 2005-04-06 | $7700.00 | Window Closed / Lapsed |