Patent US4278775A successfully refreshed from Google Patents.
Patent US5200642A successfully refreshed from Google Patents.
US5200642A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Internal capacitor arrangement for semiconductor device assembly
Assignee: LSI Corp
•
Filing: 1989-12-19
•
Granted: 1993-04-06
•
Expires: 2009-12-19
Abstract
Abstract A capacitor is disposed within a semiconductor device assembly atop a plastic layer pad, beneath which passes a pair of leads connected to a semiconductor device. The capacitor is connected to the pair of leads, such as by soldering, spot welding or conductive epoxy through cutouts in the pad. In one embodiment, the cutouts extend into the pad from inner and outer edges thereof. In another embodiment, the cutouts are holes through the pad. A plurality, such as four, capacitors are conveniently disposed atop a corresponding plurality of pads, and are connected to a corresponding plurality of pairs of leads within the semiconductor device assembly. By positioning the capacitor(s) as closely to the semiconductor device as possible, the efficacy of the capacitor(s) is maximized. Method and apparatus are disclosed.
Inventors
- 👤 Jon Long
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 15:51
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/601; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
151 words
A semiconductor device assembly comprising: a semiconductor device mounted to a die attach pad, wherein the die attach pad is generally coplanar with a plurality of leads extending generally radially in a plane from the semiconductor device, wherein a pair of the leads are power leads; a plastic film layer having two opposing surfaces formed atop the leads, wherein the semiconductor device extends above one surface of the plastic film layer and the leads are disposed on the opposite surface of the plastic film layer; a portion of the plastic film layer forming a pad disposed atop the pair of power leads; cutouts extending through the pad in alignment with the pair of power leads; and a capacitor disposed atop the pad on a surface of the plastic film layer opposite the leads, having two conductive legs, both of which are connected through the cutouts to the pair of power leads.
Claim 2
Dependent Claim
151 words
A semiconductor device assembly comprising: a semiconductor device mounted to a die attach pad, wherein the die attach pad is generally coplanar with a plurality of leads extending generally radially in a plane from the semiconductor device, wherein a pair of the leads are power leads; a plastic film layer having two opposing surfaces formed atop the leads, wherein the semiconductor device extends above one surface of the plastic film layer and the leads are disposed on the opposite surface of the plastic film layer; a portion of the plastic film layer forming a pad disposed atop the pair of power leads; cutouts extending through the pad in alignment with the pair of power leads; and a capacitor disposed atop the pad on a surface of the plastic film layer opposite the leads, having two conductive legs, both of which are connected through the cutouts to the pair of power leads.
Claim 3
Dependent Claim
21 words
A semiconductor device assembly according to claim 1, wherein the cutouts extend into the pad from inner and outer edges thereof.
Claim 4
Dependent Claim
17 words
A semiconductor device assembly according to claim 1, wherein the cutouts are holes disposed through the pad.
Claim 5
Dependent Claim
19 words
A semiconductor device assembly according to claim 1, wherein the power leads are closely-spaced, parallel and adjacent one another.
Claim 6
Dependent Claim
20 words
A semiconductor device assembly according to claim 1, wherein the capacitor is connected to the power leads by conductive epoxy.
Claim 7
Dependent Claim
21 words
A semiconductor device assembly according to claim 1, wherein the capacitor is connected to the power leads by soldering or spot-welding.
Claim 8
Dependent Claim
27 words
A semiconductor device assembly according to claim 1, including a plurality of pairs of power leads, a corresponding plurality of pads and a corresponding plurality of capacitors.
Claim 9
Dependent Claim
79 words
A semiconductor device assembly comprising: an upper plastic film layer; a lower plastic film layer; metallic leads sandwiched between the upper and lower plastic film layers; a die attach pad supported between the upper and lower plastic film layers; a semiconductor chip mounted to the die attach pad and connected to the leads; and a capacitor disposed on a surface of the upper plastic film layer, opposite the leads, having two conductive legs connected to two of the leads.
Claim 10
Dependent Claim
79 words
A semiconductor device assembly comprising: an upper plastic film layer; a lower plastic film layer; metallic leads sandwiched between the upper and lower plastic film layers; a die attach pad supported between the upper and lower plastic film layers; a semiconductor chip mounted to the die attach pad and connected to the leads; and a capacitor disposed on a surface of the upper plastic film layer, opposite the leads, having two conductive legs connected to two of the leads.
Claim 11
Dependent Claim
27 words
A semiconductor device assembly according to claim 8, including a plurality of pairs of power leads, a corresponding plurality of pads and a corresponding plurality of capacitors.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-05 | 1996-10-05 | 1997-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-05 | 2000-10-05 | 2001-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-05 | 2004-10-05 | 2005-04-06 | $7700.00 | Window Closed / Lapsed |