Patent US5199483A successfully refreshed from Google Patents.
US5199483A
Expired / Lapsed
US
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Method and apparatus for cooling wafers
Assignee: Applied Materials Inc
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Filing: 1991-05-15
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Granted: 1993-04-06
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Expires: 2011-05-15
Abstract
Abstract A wafer cooling apparatus characterized by a chamber, a pedestal disposed within the chamber and a mechanism for lowering a semiconductor wafer onto an upper surface of the pedestal. The upper surface of the pedestal is grooved to allow gas trapped between the wafer and the pedestal surface to escape around the periphery of the wafer, thereby minimizing the tendency of the wafer to "skate" across the surface of the pedestal on a thin layer of gas. The method involves extending a number of pins through a grooved cooling surface of the pedestal to contact a wafer, and retracting the pins into the pedestal to lower the wafer to the cooling surface and to force gas trapped between the wafer and the pedestal into the grooves of the pedestal.
Inventors
- 👤 Kenneth J. Bahng
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 02:02
CPC Classifications
H; H10; H10P; H10P95/00; H10P72/00; H10P72/04; H10P72/0431; H10P72/0434; H10P72/70; H10P72/76; H10P72/7604; H10P72/7612; Y; Y10; Y10S; Y10S269/00; Y10S269/903
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
109 words
A wafer cooling apparatus, comprising: a chamber; a pedestal comprising a support body having a substantially planar wafer support surface exposed to said chamber, said wafer support surface being provided with a groove which is so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating; and a mechanism for lowering a wafer disposed within said chamber towards said wafer support surface of said support body, whereby said support body is adapted to remove heat from said wafer.
Claim 2
Dependent Claim
109 words
A wafer cooling apparatus, comprising: a chamber; a pedestal comprising a support body having a substantially planar wafer support surface exposed to said chamber, said wafer support surface being provided with a groove which is so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating; and a mechanism for lowering a wafer disposed within said chamber towards said wafer support surface of said support body, whereby said support body is adapted to remove heat from said wafer.
Claim 3
Dependent Claim
21 words
A wafer cooling apparatus as recited in claim 1, further comprising: a conduit for introducing a cooling gas into said chamber.
Claim 4
Dependent Claim
24 words
A wafer cooling apparatus as recited in claim 2 wherein said gas is substantially anhydrous and is introduced at substantially ambient pressures and temperatures.
Claim 5
Dependent Claim
17 words
A wafer cooling apparatus as recited in claim 3 wherein said gas comprises hydrogen, helium or nitrogen.
Claim 6
Dependent Claim
29 words
A wafer cooling apparatus as recited in claim 1, wherein said mechanism for lowering a wafer comprises: at least three pins which retractably extend through said wafer support surface.
Claim 7
Dependent Claim
24 words
A wafer cooling apparatus as recited in claim 1, wherein said pedestal further comprises: a heat sink for actively removing heat from said body.
Claim 8
Dependent Claim
33 words
A wafer cooling apparatus as recited in claim 6, wherein said heat sink for actively removing heat from said body comprises: a conduit adapted to circulate a cooling fluid proximate to said body.
Claim 9
Dependent Claim
67 words
An anti-skating pedestal for wafers, comprising: a body having a substantially planar wafer support surface; and a fluid channel provided in said body which is so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating.
Claim 10
Dependent Claim
67 words
An anti-skating pedestal for wafers, comprising: a body having a substantially planar wafer support surface; and a fluid channel provided in said body which is so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating.
Claim 11
Dependent Claim
24 words
An anti-skating pedestal for was as recited in claim 8 wherein said fluid channel comprises: a plurality of grooves in said wafer support surface.
Claim 12
Dependent Claim
21 words
An anti-skating pedestal for wafers as recited in claim 9 wherein at least some of said grooves form a grid-like pattern.
Claim 13
Dependent Claim
28 words
An anti-skating pedestal for wafers as recited in claim 9 wherein at least some of said grooves radiate outwardly from an interior location of said wafer support area.
Claim 14
Dependent Claim
24 words
An anti-skating pedestal for wafers as recited in claim 8 wherein said body is made from a material which is a good thermal conductor.
Claim 15
Dependent Claim
15 words
An anti-skating pedestal for wafers as recited in claim 12 wherein said material comprises aluminum.
Claim 16
Dependent Claim
22 words
An anti-skating pedestal for wafers as recited in claim 12 further comprising: a heat sink for actively removing heat from said body.
Claim 17
Dependent Claim
22 words
An anti-skating pedestal for wafers as recited in claim 9 wherein said plurality of grooves have widths greater than about 0.02 inches.
Claim 18
Independent Claim
104 words
A method for lowering a wafer onto a pedestal in a gaseous environment, comprising: positioning a wafer over a substantially planar, grooved surface of a pedestal; extending a plurality of pins through said surface to contact a bottom surface of said wafer; and retracting said plurality of pins into said pedestal to lower said wafer towards said surface, said grooved surface being so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating.
Claim 19
Independent Claim
104 words
A method for lowering a wafer onto a pedestal in a gaseous environment, comprising: positioning a wafer over a substantially planar, grooved surface of a pedestal; extending a plurality of pins through said surface to contact a bottom surface of said wafer; and retracting said plurality of pins into said pedestal to lower said wafer towards said surface, said grooved surface being so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating.
Claim 20
Dependent Claim
21 words
A method for lowering a wafer as recited in claim 16 wherein said plurality of pins comprise at least three pins.
Claim 21
Dependent Claim
23 words
A method for lowering a wafer as recited in claim 16 further comprising enclosing said wafer and said surface from the ambient environment.
Claim 22
Dependent Claim
25 words
A method for lowering a wafer as recited in claim 18 further comprising releasing a substantially anhydrous gas proximate to said wafer and said surface.
Claim 23
Independent Claim
114 words
A method for cooling a wafer within a gaseous environment, comprising: extending a plurality of pins through a substantially planar, grooved surface of a pedestal made from a material having good thermal conductivity; contacting a semiconductor wafer with said plurality of pins; retracting said plurality of pins into said pedestal to lower said wafer towards said surface, said grooved surface being so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating, whereby said pedestal is adapted to remove heat from said wafer.
Claim 24
Independent Claim
114 words
A method for cooling a wafer within a gaseous environment, comprising: extending a plurality of pins through a substantially planar, grooved surface of a pedestal made from a material having good thermal conductivity; contacting a semiconductor wafer with said plurality of pins; retracting said plurality of pins into said pedestal to lower said wafer towards said surface, said grooved surface being so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating, whereby said pedestal is adapted to remove heat from said wafer.
Claim 25
Dependent Claim
32 words
A method for cooling a wafer as recited in claim 20 further comprising enclosing said wafer and said surface from the ambient environment after contacting said wafer with said plurality of pins.
Claim 26
Dependent Claim
24 words
A method for cooling a wafer as recited in claim 21 further comprising releasing a substantially anhydrous gas proximate said wafer and said surface.
Claim 27
Dependent Claim
22 words
A method for cooling a wafer as recited in claim 20 further comprising the step of actively removing heat from said pedestal.
Claim 28
Dependent Claim
19 words
A method for cooling a wafer as recited in claim 20 wherein said wafer is lowered to said surface.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-05 | 1996-10-05 | 1997-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-05 | 2000-10-05 | 2001-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-05 | 2004-10-05 | 2005-04-06 | $7700.00 | Window Closed / Lapsed |