Patent US5195299B1 successfully refreshed from Google Patents.
US5195299B1
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Method of reducing moisture content of hermetic packages containing semiconductor devices
Assignee: Henkel Corp
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Filing: 1992-02-28
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Granted: 1996-02-13
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Expires: 2012-02-28
Abstract
No abstract record available.
Inventors
- 👤 My N Nguyen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:58
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/48
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-12 | 1999-08-14 | 2000-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-12 | 2003-08-14 | 2004-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-12 | 2007-08-14 | 2008-02-13 | $7700.00 | Window Closed / Lapsed |