Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
159 words
An integrated circuit assembly comprising: an integrated circuit carrier; at least one integrated circuit chip in a flip-chip arrangement with the carrier; a connection post comprising a first post attached to the carrier, a second post attached to the chip, and a solder bump attaching the first and second posts, the connection post electrically and mechanically connecting the carrier and the chip, the connection post having an axis defining an axial direction, the connection post spacing the chip and the carrier in the axial direction; and flexible attachment means for attaching the connection post to at least one element of the set consisting of the carrier and the chip so that the connection post can move in the axial direction and tilt with respect to the axial direction; whereby, when the carrier and the chip undergo differential thermal expansion, the connection post moves to reduce shear strain in planes orthogonal to the normal axial direction along the connection post.
Claim 2
Dependent Claim
159 words
An integrated circuit assembly comprising: an integrated circuit carrier; at least one integrated circuit chip in a flip-chip arrangement with the carrier; a connection post comprising a first post attached to the carrier, a second post attached to the chip, and a solder bump attaching the first and second posts, the connection post electrically and mechanically connecting the carrier and the chip, the connection post having an axis defining an axial direction, the connection post spacing the chip and the carrier in the axial direction; and flexible attachment means for attaching the connection post to at least one element of the set consisting of the carrier and the chip so that the connection post can move in the axial direction and tilt with respect to the axial direction; whereby, when the carrier and the chip undergo differential thermal expansion, the connection post moves to reduce shear strain in planes orthogonal to the normal axial direction along the connection post.
Claim 3
Dependent Claim
25 words
The assembly of claim 1 wherein the flexible attachment means provides for flexibly attaching the connection post to both of the carrier and the chip.
Claim 4
Dependent Claim
31 words
The assembly of claim 1 wherein the flexible attachment means includes a cavity formed in the element and a flexible membrane formed over the cavity and attaching to the connection post.
Claim 5
Dependent Claim
14 words
An assembly as in claim 3 wherein the flexible membrane comprises concentric membrane rings.
Claim 6
Dependent Claim
124 words
An integrated circuit assembly comprising: an integrated circuit carrier having an electrical connection point and a mechanical connection means associated with the electrical connection point; an integrated circuit chip in a flip-chip arrangement with the carrier, the chip having an electrical connection point and a mechanical connection means associated with the electrical connection point; and an electrically conductive connection post mechanically connected to both mechanical connection means and in electrical contact with both electrical connection points and defining an electrically conductive path therebetween; wherein at least one of the mechanical connection means comprises a flexible mechanical connection with the connection post such that the chip is free to move with three axes of freedom relative to the carrier without disrupting the electrically conductive path.
Claim 7
Dependent Claim
124 words
An integrated circuit assembly comprising: an integrated circuit carrier having an electrical connection point and a mechanical connection means associated with the electrical connection point; an integrated circuit chip in a flip-chip arrangement with the carrier, the chip having an electrical connection point and a mechanical connection means associated with the electrical connection point; and an electrically conductive connection post mechanically connected to both mechanical connection means and in electrical contact with both electrical connection points and defining an electrically conductive path therebetween; wherein at least one of the mechanical connection means comprises a flexible mechanical connection with the connection post such that the chip is free to move with three axes of freedom relative to the carrier without disrupting the electrically conductive path.
Claim 8
Dependent Claim
75 words
An assembly according to claim 5 wherein the connection post comprises a first post having a first extremity connected to the mechanical connection means of the carrier and a second extremity projecting away from the carrier, a second post having a first extremity connected to the mechanical connection means of the chip and a second extremity projecting away from the chip, and means establishing electrical and mechanical connections between the second extremities of the posts.
Claim 9
Dependent Claim
15 words
An assembly according to claim 5 wherein the flexible mechanical connection comprises a flexible membrane.
Claim 10
Dependent Claim
14 words
An assembly according to claim 7 wherein the membrane is formed over a cavity.
Claim 11
Dependent Claim
16 words
An assembly according to claim 5 wherein both of the mechanical connection means comprise flexible membranes.
Claim 12
Dependent Claim
12 words
An assembly according to claim 5 wherein the connection post is flexible.
Claim 13
Dependent Claim
14 words
An assembly as in claim 7 wherein the flexible membrane comprises concentric membrane rings.
Claim 14
Dependent Claim
57 words
An integrated circuit assembly comprising: a multi-chip substrate; an electrical conductor cantilevered from the substrate; at least one sub-chip having a connection pad; an interconnection means positioned between the cantilevered electrical conductor and the connection pad; and a flexible membrane for maintaining the cantilevered electrical conductor in electrical contact with the connection pad through the interconnection means.
Claim 15
Dependent Claim
57 words
An integrated circuit assembly comprising: a multi-chip substrate; an electrical conductor cantilevered from the substrate; at least one sub-chip having a connection pad; an interconnection means positioned between the cantilevered electrical conductor and the connection pad; and a flexible membrane for maintaining the cantilevered electrical conductor in electrical contact with the connection pad through the interconnection means.
Claim 16
Dependent Claim
15 words
An assembly as in claim 12 wherein the flexible membrane is suspended over a cavity.
Claim 17
Dependent Claim
22 words
An assembly as in claim 12 wherein a connection post is mounted on the flexible membrane and supports the cantilevered electrical conductor.
Claim 18
Dependent Claim
12 words
An assembly as in claim 14 wherein the connection post is flexible.
Claim 19
Dependent Claim
14 words
An assembly as in claim 12 wherein the flexible membrane comprises concentric membrane rings.
Claim 20
Dependent Claim
21 words
An assembly as in claims 11 or 16 wherein each membrane ring is attached to the adjacent ring by flexible legs.
Claim 21
Dependent Claim
16 words
An assembly as in claim 17 wherein the flexible legs are arranged in a staggered pattern.