US5186381A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip bonding process
Assignee: Samsung Electronics Co Ltd
•
Filing: 1991-09-09
•
Granted: 1993-02-16
•
Expires: 2011-09-09
Abstract
Abstract A semiconductor chip bonding process is disclosed, and the process comprises the steps of forming a first Au ball using a wire ball bump bonding apparatus, stacking a second Au ball on the first Au ball, stacking a Pb ball on the second Au ball using the wire ball bump bonding apparatus, and bonding the chip to a substrate, wherein the conventional complicated BUMP manufacturing process is omitted due to the CHIP BONDING technique during the assembling process, so that the formation process is shortened and the defect rate during the chip bonding is minimized, thereby the manufacturing cost can be saved.
Inventors
- 👤 Gu S. Kim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:59
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/20; H10W72/01; H10W72/012; H10W72/01251; H10W72/01257; H10W72/01215; H10W72/01221; H10W72/01225; H10W72/01255; H10W72/019; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/221; H10W72/222; H10W72/251; H10W72/252; H10W72/29; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
114 words
A semiconductor chip bonding process comprising the steps of: forming a first Au ball by carrying out an Au wire ball bump bonding on an electrode of a chip with a wire ball bump bonding apparatus; stacking a second Au ball on said first Au ball by again carrying out said Au wire ball bump bonding step; forming a Pb ball on said second Au ball by carrying out a Pb wire ball bump bonding with said wire ball bump bonding apparatus; and carrying out a chip bonding by attaching said chip to a substrate by means of a Pb bond formed from said Pb ball by heating said Pb ball to melt it.
Claim 2
Dependent Claim
114 words
A semiconductor chip bonding process comprising the steps of: forming a first Au ball by carrying out an Au wire ball bump bonding on an electrode of a chip with a wire ball bump bonding apparatus; stacking a second Au ball on said first Au ball by again carrying out said Au wire ball bump bonding step; forming a Pb ball on said second Au ball by carrying out a Pb wire ball bump bonding with said wire ball bump bonding apparatus; and carrying out a chip bonding by attaching said chip to a substrate by means of a Pb bond formed from said Pb ball by heating said Pb ball to melt it.
References Cited (Backward Citations)
US509019A
Cited
US3986255A
Cited
US4661192A
Cited
US4750666A
Cited
US4875618A
Cited
US4875617A
Cited
US4889274A
Cited
US5090609A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-02-16 | 1996-08-17 | 1997-02-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-02-16 | 2000-08-17 | 2001-02-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-02-16 | 2004-08-17 | 2005-02-16 | $7700.00 | Window Closed / Lapsed |