US5185654A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrostatic RF absorbant circuit carrier assembly and method for making the same
Assignee: Voice Signals LLC
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Filing: 1991-11-27
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Granted: 1993-02-09
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Expires: 2011-11-27
Abstract
Abstract An electrostatic RF absorbant circuit carrier assembly (200) is described as having a plastic support structure (100) which consists of an integrally fashioned base (180) and surrounding sidewalls (170) which together form an internal cavity (185). A plurality of conductor paths (125,165) are disposed within the cavity (185). The assembly (200) is completed by a polymeric cover (110) having a surface integrally fashioned to comprise wall members (145) for making contact with conductive paths (165) within the cavity (185). In order to facilitate RF isolation and electrostatic dissipation, the cover (110) is layered with a surface material comprising: a thermosetting matrix system; a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the thermosetting matrix system; and a conductive filler comprising 1 to 4 percent by weight loading of the thermosetting matrix system and the RF absorbing filler.
Inventors
- 👤 Mark D. Mosher
- 👤 Robert Fraser
- 👤 Ronald D. Fuller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 23:22
CPC Classifications
H; H05; H05B; H05B6/00; H05B6/46; H05B6/60; H01; H01Q; H01Q17/00; H05K; H05K9/00; H05K9/0073; H05K9/0079; H10; H10W; H10W42/00; H10W42/60; H10W44/00; H10W44/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
132 words
A circuit carrier assembly comprising: a polymeric support structure having a base and surrounding sidewalls which form an internal cavity; a plurality of conductor paths disposed within said cavity; and a polymeric cover having a surface integrally fashioned to comprise wall members for making contact with conductor paths when the cavity is sealed by the cover, said cover layered with a surface material comprising: a thermosetting binder; a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder, such that the surface material absorbs RF energy within a range between 1-60 GHz; and a conductive filler comprising 1 to 4 percent by weight loading of the binder and the RF absorbing filler, such that the surface material has a surface resistivity of 10 5 -10 12 ohms/square.
Claim 2
Dependent Claim
132 words
A circuit carrier assembly comprising: a polymeric support structure having a base and surrounding sidewalls which form an internal cavity; a plurality of conductor paths disposed within said cavity; and a polymeric cover having a surface integrally fashioned to comprise wall members for making contact with conductor paths when the cavity is sealed by the cover, said cover layered with a surface material comprising: a thermosetting binder; a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder, such that the surface material absorbs RF energy within a range between 1-60 GHz; and a conductive filler comprising 1 to 4 percent by weight loading of the binder and the RF absorbing filler, such that the surface material has a surface resistivity of 10 5 -10 12 ohms/square.
Claim 3
Dependent Claim
22 words
The circuit carrier assembly of claim 1 further comprising a semiconductor device mounted within said cavity and connected to a conductor path.
Claim 4
Dependent Claim
25 words
The circuit carrier assembly of claim 2 wherein the semiconductor device is a GaAs integrated circuit capable of operating in the 1-60 GHz frequency range.
Claim 5
Dependent Claim
19 words
The circuit carrier assembly of claim 1 wherein the surrounding walls are integrally fashioned into the polymeric support structure.
Claim 6
Dependent Claim
27 words
The circuit carrier assembly of claim 1 wherein the polymeric support structure and the cover are made from a material selected from the group consisting of thermoplastics.
Claim 7
Dependent Claim
21 words
The circuit carrier assembly of claim 1 wherein the polymeric support structure and the cover are produced from thermoplastic fabrication processes.
Claim 8
Dependent Claim
25 words
The circuit carrier assembly of claim 1 wherein the wall members contact ground potential conductor paths within the cavity thereby forming zones of RF isolation.
Claim 9
Dependent Claim
18 words
The circuit carrier assembly of claim 1 wherein the polymeric support structure is layered with a conductive material.
Claim 10
Dependent Claim
20 words
The circuit carrier assembly of claim 1 wherein the thermosetting binder is selected from the group consisting of synthetic elastomers.
Claim 11
Dependent Claim
21 words
The circuit carrier assembly of claim 1 wherein the thermosetting binder is selected from the group consisting of adhesives and sealants.
Claim 12
Dependent Claim
14 words
The circuit carrier assembly of claim 1 wherein the thermosetting binder comprises silicone rubber.
Claim 13
Dependent Claim
17 words
The circuit carrier assembly of claim 1 wherein the non-conductive RF absorbing filler is carbonyl iron powder.
Claim 14
Dependent Claim
25 words
The circuit carrier assembly of claim 1 wherein the conductive filler is selected from the group consisting of: carbon black, metals, graphite and alloys thereof.
Claim 15
Dependent Claim
140 words
A circuit carrier assembly comprising: a polymeric support structure having a base and surrounding walls which form an internal cavity; a plurality of conductor paths disposed within the cavity; a semiconductor device mounted within the cavity and connected to a conductor path; a polymeric cover having a surface integrally fashioned to comprise wall members for making contact with ground potential conductor paths when the cavity is sealed by the cover, said cover layered with a surface material which absorbs RF energy within a range of 1-60 GHz and has a surface resistivity of 10 5 -10 12 ohms/square, said material comprising: a thermosetting binder; a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder; and a conductive filler comprising 1 to 4 percent by weight loading of the binder and the RF absorbing filler.
Claim 16
Dependent Claim
140 words
A circuit carrier assembly comprising: a polymeric support structure having a base and surrounding walls which form an internal cavity; a plurality of conductor paths disposed within the cavity; a semiconductor device mounted within the cavity and connected to a conductor path; a polymeric cover having a surface integrally fashioned to comprise wall members for making contact with ground potential conductor paths when the cavity is sealed by the cover, said cover layered with a surface material which absorbs RF energy within a range of 1-60 GHz and has a surface resistivity of 10 5 -10 12 ohms/square, said material comprising: a thermosetting binder; a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder; and a conductive filler comprising 1 to 4 percent by weight loading of the binder and the RF absorbing filler.
References Cited (Backward Citations)
US4379098A
Cited
US5045820A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-02-09 | 1996-08-10 | 1997-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-02-09 | 2000-08-10 | 2001-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-02-09 | 2004-08-10 | 2005-02-09 | $7700.00 | Window Closed / Lapsed |