Power device assembly and method

Claim 2

A power device assembly comprising (a) a circuit board sub-assembly comprising: a circuit, board having an upper surface, a lower surface andd a periphery; a heat sink frame mounted to the circuit board and defining an open area exposing at least a major portion of the upper surface of the circuit board, the heat sink frame extending outwardly beyond the periphery of the circuit board; and at least one power device having a body and electrically conductive leads extending from the body to electrical contact with the circuit board, the body being mounted in thermally conductive contact with the heat sink frame; and (b) a protective housing enclosing the circuit board sub-assembly, at least a portion of the heat sink frame extending outwardly from the protective housing.

Claim 3

The power device assembly of claim 1 having multiple said power devices mounted on an upper surface of the heat sink frame in thermally conductive contact therewith, the electrically conductive leads from each power device extending downwardly in the open area to the upper surface of the circuit board and through the circuit board to a solder connection at the lower surface of the circuit board.

Claim 4

The power device assembly of claim 1 further comprising electrical connector means for receiving a power lead to energize the power device assembly, the electrical connector means comprising a body mounted on the heat sink frame and electrical leads extending in the open area to electrical contact with the circuit board.

Claim 5

The power device assembly of claim 1 wherein the heat sink frame is mounted to the upper surface of the circuit board, a portion of a lower surface of the heat sink frame overlapping a peripheral portion of the upper surface of the circuit board, said power device being mounted on the upper surface of the heat sink frame, the electrically conductive leads of the power device extending downwardly in the open area to the upper surface of the circuit board and through the circuit board to a solder connection at the lower surface of the circuit board.

Claim 6

The power device assembly of claim 1 wherein at least a portion of the heat sink frame extending outwardly from the protective housing forms offset fin segments.

Claim 7

The power device assembly of claim 1 wherein the heat sink frame extends unbroken completely around the periphery of the circuit board.

Claim 8

The power device assembly of claim 1 wherein the protective housing comprises a plastic clamshell housing having two oppositely concave halves joined to each other via a living hinge along a shared peripheral edge and releasably lockable to each other in a closed position enclosing the circuit board subassembly.

Claim 9

The power device assembly of claim 7 wherein the circuit board sub-assembly forms a snap fit within one of the concave halves of the plastic clamshell housing.

Claim 10

The power device assembly of claim 7 further comprising mounting means for mounting the power device assembly to a structure, the mounting means comprising at least one plastic extension unitary with the plastic clamshell housing and adapted to receive a fastener.

Claim 11

A power amplifier assembly for powering speakers of a motor vehicle audio system, comprising (a) a circuit board sub-assembly comprising: a circuit board having an upper surface, a lower surface and a periphery; a metal heat sink frame having an upper surface and a lower surface, the heat sink frame being mounted to the upper surface of the circuit board, extending around the periphery of the circuit board and defining an open area exposing a major portion of the upper surface of the circuit board, a portion of the lower surface of the heat sink frame overlapping a peripheral portion of the upper surface of the circuit board, the heat sink frame comprising a flange portion which extends outwardly beyond the peripher,y of the circuit board and forms fin segments offset alternately up and down relative each other; a plurality of audio power amplifiers, each having a body mounted on the upper surface of the heat sink frame in thermally conductive contact therewith and electrically conductive leads extending from the body downwardly in the open area defined by the heat sink frame to the upper surface of the circuit board and through the circuit board to solder connections at the lower surface of the circuit board; and electrical connector means for receiving a power lead from a source of electrical power to energize the power amplifier assembly, the electrical connector means comprising a connector body mounted on the upper surface of the heat sink frame and connector leads extending downwardly from the connector body in the open area defined by the heat sink frame to the upper surface of the circuit board and through the circuit board to solder connections at the lower surface of the circuit board; and (b) a plastic protective clamshell housing enclosing the circuit board sub-assembly, having two oppositely concave halves joined to each other by a living hinge along a shared peripheral edge and comprising fastener means unitary therewith for releasably locking each of the concave halves to the other in a closed position about the circuit board sub-assembly, and mounting means unitary therewith for mounting the power amplifier assembly to a structure, the circuit board sub-assembly being releasably lockable into one of the concave halves of the protective housing, the fin segments of the flange portion of the heat sink frame extending outwardly beyond the protective housing in its closed position.

Claim 12

A power amplifier assembly for powering speakers of a motor vehicle audio system, comprising (a) a circuit board sub-assembly comprising: a circuit board having an upper surface, a lower surface and a periphery; a metal heat sink frame having an upper surface and a lower surface, the heat sink frame being mounted to the upper surface of the circuit board, extending around the periphery of the circuit board and defining an open area exposing a major portion of the upper surface of the circuit board, a portion of the lower surface of the heat sink frame overlapping a peripheral portion of the upper surface of the circuit board, the heat sink frame comprising a flange portion which extends outwardly beyond the peripher,y of the circuit board and forms fin segments offset alternately up and down relative each other; a plurality of audio power amplifiers, each having a body mounted on the upper surface of the heat sink frame in thermally conductive contact therewith and electrically conductive leads extending from the body downwardly in the open area defined by the heat sink frame to the upper surface of the circuit board and through the circuit board to solder connections at the lower surface of the circuit board; and electrical connector means for receiving a power lead from a source of electrical power to energize the power amplifier assembly, the electrical connector means comprising a connector body mounted on the upper surface of the heat sink frame and connector leads extending downwardly from the connector body in the open area defined by the heat sink frame to the upper surface of the circuit board and through the circuit board to solder connections at the lower surface of the circuit board; and (b) a plastic protective clamshell housing enclosing the circuit board sub-assembly, having two oppositely concave halves joined to each other by a living hinge along a shared peripheral edge and comprising fastener means unitary therewith for releasably locking each of the concave halves to the other in a closed position about the circuit board sub-assembly, and mounting means unitary therewith for mounting the power amplifier assembly to a structure, the circuit board sub-assembly being releasably lockable into one of the concave halves of the protective housing, the fin segments of the flange portion of the heat sink frame extending outwardly beyond the protective housing in its closed position.

Claim 13

The power amplifier assembly of claim 10 wherein the heat sink frame has a tab outwardly extending from its periphery, the tab being received in a corresponding slot in the protective housing.

Claim 16

The method of making a power device assembly according to claim 12 further comprising enclosing the soldered assembly within a protective housing, wherein at least a portion of the heat sink frame extends outwardly from the protective housing.

Claim 17

The method of making a power device assembly according to claim 13 wherein: the protective housing is a plastic clamshell housing having two oppositely concave halves joined to each other by a living hinge along a shared peripheral edge; and enclosing the soldered assembly within the protective housing comprises inserting the soldered assembly into releasable engagement within one of the two concave halves and then closing and releasably locking the concave halves to each other.