Holding structure of substrates

Claim 1

A structure holding and grounding a pair of printed circuit substrates (1, 2) to a chassis (20) comprising: a metallic plate (24) interposed horizontally between the two substrates (1, 2) in parallel therewith, the plate having a plurality of erect segments (22, 23) each cut from a portion of said plate and bent erect in a vertical direction toward a respective one of said substrates; each substrate (1, 2) having at least one grounding hole (25, 31) receiving an erect segment (22, 23) of said metallic plate (24) projected therethrough from a side facing said plate to an external side of the substrate on which a printed circuit pattern is provided, the erect segment (22, 23) being soldered to a respective grounding part (26, 30) of the printed circuit pattern for grounding thereof; said metallic plate (24) having on a peripheral edge thereof at least one connection segment (28) bent from the plate so as to form a metallic tongue having a certain bending resilience, said resilient tongue being placed in resilient contact with a portion of said chassis (20) and soldered thereto (29) to ground said grounding parts (26, 30) of the printed circuit patterns of said substrates (1, 2) through said interposed metallic plate to said chassis.