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US5182121A Expired / Lapsed US ⏱️ 0.0 years remaining

Hot press

Assignee: Hitachi Ltd
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Filing: 1990-10-09
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Granted: 1993-01-26
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Expires: 2010-10-09
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Abstract

Abstract A hot press including a displaceable sleeve for surrounding materials of a multi-layer substrate under a reduced pressure condition, a gas pressurizing condition and a heating condition with thermal plates. Upper and lower sealing units seal an interior of the sleeve, with a mechanism lowering and raising the sleeve. A pilot check mechanism prevents a lower bolster from raising/lowering upon the reduced pressure condition and the gas pressure condition, and a retainer maintains the lowered or raised condition of the sleeve. The multi-layer substrate is formed under the reduced pressure condition and the gas pressure condition. Accordingly, the atmosphere and moisture between the materials of the multi-layer substrate and volatile composition are removed. Additionally, a void generated during the heat and pressure process by the heating plates is eliminated from the multi-layer substrate. By carrying out the formation of the multi-layer substrate at the heat and pressure by the heating plates under the gas pressure condition, a final dimensional precision and shape are enhanced and a warpage or twist is suppressed.

Inventors

  • 👤 Akimi Miyashita
  • 👤 Mutsumasa Fujii
  • 👤 Minoru Kubosawa
  • 👤 Keiichiro Torii
  • 👤 Nobuaki Ooki
  • 👤 Kiyonori Kogawa
  • 👤 Masami Kawaguchi
  • 👤 Hideyasu Murooka
  • 👤 Masayuki Kyooi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 23:43
CPC Classifications
B; B30; B30B; B30B15/00; B30B15/0005; B30B15/0017; B29; B29C; B29C33/00; B29C33/02; B29C33/04; B29C43/00; B29C43/32; B29C43/56; B30B15/06; B30B15/062; B30B15/064; B29C2043/561; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 347 words
A hot press for mutually aligning materials of a multi-layer substrate of printed circuit boards and adhesive resin and interposing the materials into the heating plates and effecting heating and pressurization to form the multi-layer substrate, the hot press comprising: a base frame; a lower bolster movable up and down by a ram of a hydraulic cylinder supported by said base frame; a column fixed to said base frame for guiding the up and down movement of the lower bolster; an upper bolster fixed to an upper end portion of said column and confronting said lower bolster; upper and lower heating plates respectively fixed through insulative plates to said upper and lower bolsters; an intermediate heating plate located between said upper and lower heating plates and supported by said upper bolster; heating means for supplying a thermal medium to said intermediate heating plate, said upper heating plate and said lower heating plate and collecting the thermal medium from the heating plate; hydraulic pressure means for supplying pressurized oil to said hydraulic cylinder; a sleeve movable up and down along a side surface of said upper bolster by moving means, said sleeve being adapted to surround said materials for the multi-layer substrate with a lower end portion of said sleeve being in contact with an upper surface of said lower bolster; first sealing means for sealing an interior of said sleeve when said sleeve is in contact with the upper surface of said lower bolster; second sealing means for sealing an interior of said sleeve; discharging means for discharging atmosphere contained in said sleeve maintained under a sealed condition by said first and second sealing means; means for supplying a gas maintained at a predetermined pressure into said sleeve; and a hydraulic means including a pilot check mechanism for preventing said lower bolster from being raised due to a differential pressure between the upper surface and lower surface of said lower bolster when the interior of said sleeve is maintained at one of a vacuum pressure condition and a high pressure condition due to the predetermined gas pressure.
Claim 2
Dependent Claim 347 words
A hot press for mutually aligning materials of a multi-layer substrate of printed circuit boards and adhesive resin and interposing the materials into the heating plates and effecting heating and pressurization to form the multi-layer substrate, the hot press comprising: a base frame; a lower bolster movable up and down by a ram of a hydraulic cylinder supported by said base frame; a column fixed to said base frame for guiding the up and down movement of the lower bolster; an upper bolster fixed to an upper end portion of said column and confronting said lower bolster; upper and lower heating plates respectively fixed through insulative plates to said upper and lower bolsters; an intermediate heating plate located between said upper and lower heating plates and supported by said upper bolster; heating means for supplying a thermal medium to said intermediate heating plate, said upper heating plate and said lower heating plate and collecting the thermal medium from the heating plate; hydraulic pressure means for supplying pressurized oil to said hydraulic cylinder; a sleeve movable up and down along a side surface of said upper bolster by moving means, said sleeve being adapted to surround said materials for the multi-layer substrate with a lower end portion of said sleeve being in contact with an upper surface of said lower bolster; first sealing means for sealing an interior of said sleeve when said sleeve is in contact with the upper surface of said lower bolster; second sealing means for sealing an interior of said sleeve; discharging means for discharging atmosphere contained in said sleeve maintained under a sealed condition by said first and second sealing means; means for supplying a gas maintained at a predetermined pressure into said sleeve; and a hydraulic means including a pilot check mechanism for preventing said lower bolster from being raised due to a differential pressure between the upper surface and lower surface of said lower bolster when the interior of said sleeve is maintained at one of a vacuum pressure condition and a high pressure condition due to the predetermined gas pressure.
Claim 3
Dependent Claim 303 words
A hot press for mutually aligning materials of a multi-layer substrate of printed circuit boards and adhesive resin and interposing the materials into heating plates and effecting heating and pressurization to form the multi-layer substrate, the hot press comprising: a base frame; a lower bolster movable up and down by a ram of a hydraulic cylinder supported by said base frame; a column fixed to said base frame for guiding the up and down movement of the lower bolster; an upper bolster fixed to an upper end of said column and confronting said lower bolster; upper and lower heating plates respectively fixed through insulative plates to said upper and lower bolsters; an intermediate heating plate supported by said upper bolster by suspension rods; heating means for supplying a thermal medium to said intermediate heating plate, said upper heating plate and said lower heating plate and collecting the thermal medium from the heating plate; a passage for the thermal medium for at least one of cooling and heating said intermediate plate formed in said suspension rods; hydraulic pressure means for supplying pressurized oil to said hydraulic cylinder; a sleeve movable up and down along a side surface of said upper bolster by moving means, said sleeve being adapted to surround said materials for the multi-layer substrate with a lower end portion of said sleeve being in contact with an upper surface of said lower bolster; first sealing means for sealing an interior of said sleeve when said sleeve is in contact with the upper surface of said lower bolster; second sealing means for sealing an interior of said sleeve; discharging means for discharging atmosphere contained in said sleeve maintained under a sealed condition by said first and second sealing means and; means for supplying a gas maintained at a predetermined pressure into said sleeve.
Claim 4
Dependent Claim 303 words
A hot press for mutually aligning materials of a multi-layer substrate of printed circuit boards and adhesive resin and interposing the materials into heating plates and effecting heating and pressurization to form the multi-layer substrate, the hot press comprising: a base frame; a lower bolster movable up and down by a ram of a hydraulic cylinder supported by said base frame; a column fixed to said base frame for guiding the up and down movement of the lower bolster; an upper bolster fixed to an upper end of said column and confronting said lower bolster; upper and lower heating plates respectively fixed through insulative plates to said upper and lower bolsters; an intermediate heating plate supported by said upper bolster by suspension rods; heating means for supplying a thermal medium to said intermediate heating plate, said upper heating plate and said lower heating plate and collecting the thermal medium from the heating plate; a passage for the thermal medium for at least one of cooling and heating said intermediate plate formed in said suspension rods; hydraulic pressure means for supplying pressurized oil to said hydraulic cylinder; a sleeve movable up and down along a side surface of said upper bolster by moving means, said sleeve being adapted to surround said materials for the multi-layer substrate with a lower end portion of said sleeve being in contact with an upper surface of said lower bolster; first sealing means for sealing an interior of said sleeve when said sleeve is in contact with the upper surface of said lower bolster; second sealing means for sealing an interior of said sleeve; discharging means for discharging atmosphere contained in said sleeve maintained under a sealed condition by said first and second sealing means and; means for supplying a gas maintained at a predetermined pressure into said sleeve.

References Cited (Backward Citations)

GB508598A Cited
SU149050A1 Cited
US3695806A Cited
JPS537937A Cited
US4204822A Cited
US4551085A Cited
US4666551A Cited
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JPS6349411A Cited
JPS63130300A Cited
JPS63283911A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-01-26 1996-07-27 1997-01-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-01-26 2000-07-27 2001-01-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-01-26 2004-07-27 2005-01-26 $7700.00 Window Closed / Lapsed

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