US5179043A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vapor deposited micro heat pipes
Assignee: Texas A&M University System
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Filing: 1991-06-13
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Granted: 1993-01-12
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Expires: 2011-06-13
Abstract
Abstract A micro heat pipe, formed in a semiconductor substrate, carries heat from a region of heat flux in the substrate to a region of lower heat flux. The micro heat pipe is formed by cutting a groove into the substrate opposite a site where devices have been formed or are to be formed. Vapor deposited layers are then formed on the substrate to define the micro heat pipe. A fraction of the pipe is filled with a coolant or other working fluid and the pipe is sealed. A micro heat pipe may also be formed by etching a channel down into the substrate, oxidizing the surfaces of the channel, charging the channel with a cooling medium to fill a fraction of the channel and sealing the end of the channel. In operation, the working fluid evaporates in the region of high heat flux and condenses in the region of lower heat flux resulting in the transfer or redistribution of the fluid's heat of vaporization.
Inventors
- 👤 Mark H. Weichold
- 👤 George P. Peterson
- 👤 Arnab K. Mallik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 05:01
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F; F28; F28D; F28D15/00; F28D15/02; F28D15/0233; F28D15/04; F28D15/046; F28D2015/0225
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
74 words
A method of forming a micro heat pipe, comprising the steps of: a. forming a groove in a semiconductor substrate, the groove having a top; b. vapor depositing a heat conductive material until the top of the groove is sealed, thereby forming a tube in the groove, the tube having ends; c. charging a working fluid into the tube to fill a fraction of the tube; and d. sealing the ends of the tube.
Claim 2
Independent Claim
74 words
A method of forming a micro heat pipe, comprising the steps of: a. forming a groove in a semiconductor substrate, the groove having a top; b. vapor depositing a heat conductive material until the top of the groove is sealed, thereby forming a tube in the groove, the tube having ends; c. charging a working fluid into the tube to fill a fraction of the tube; and d. sealing the ends of the tube.
Claim 3
Independent Claim
88 words
A method of redistributing heat in a semiconductor device containing an integrated circuit, comprising the steps of: a. forming a groove in the surface of the semiconductor opposite the integrated circuit; b. vapor depositing a heat conductive material until a micro heat pipe is formed, the heat pipe having ends; c. sealing one end of the heat pipe; d. evacuating the micro heat pipe; e. charging a fraction of the micro heat pipe with a working fluid; and f. sealing the other end of the micro heat pipe.
Claim 4
Independent Claim
88 words
A method of redistributing heat in a semiconductor device containing an integrated circuit, comprising the steps of: a. forming a groove in the surface of the semiconductor opposite the integrated circuit; b. vapor depositing a heat conductive material until a micro heat pipe is formed, the heat pipe having ends; c. sealing one end of the heat pipe; d. evacuating the micro heat pipe; e. charging a fraction of the micro heat pipe with a working fluid; and f. sealing the other end of the micro heat pipe.
Claim 5
Independent Claim
114 words
A method of redistributing heat in a semiconductor device containing an integrated circuit, comprising the steps of: a. forming a groove in the surface of the semiconductor opposite the integrated circuit; b. vapor depositing a heat conductive material until a micro heat pipe is formed, the heat pipe having ends; c. immersing the semiconductor in a bath of the working fluid, thereby filling the micro heat pipe with the working fluid; d. sealing one end of the heat pipe; e. heating the bath a controlled amount until approximately 20% of the working fluid within the micro heat pipe remains in the liquid phase; and f. sealing the other end of the micro heat pipe.
Claim 6
Independent Claim
114 words
A method of redistributing heat in a semiconductor device containing an integrated circuit, comprising the steps of: a. forming a groove in the surface of the semiconductor opposite the integrated circuit; b. vapor depositing a heat conductive material until a micro heat pipe is formed, the heat pipe having ends; c. immersing the semiconductor in a bath of the working fluid, thereby filling the micro heat pipe with the working fluid; d. sealing one end of the heat pipe; e. heating the bath a controlled amount until approximately 20% of the working fluid within the micro heat pipe remains in the liquid phase; and f. sealing the other end of the micro heat pipe.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-01-12 | 1996-07-13 | 1997-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-01-12 | 2000-07-13 | 2001-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-01-12 | 2004-07-13 | 2005-01-12 | $7700.00 | Window Closed / Lapsed |