Patent US5173544A successfully refreshed from Google Patents.
US5173544A
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Epoxy resin compositions
Assignee: Shin-Etsu Chemical Co Ltd
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Filing: 1990-05-16
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Granted: 1992-12-22
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Expires: 2010-05-16
Abstract
Abstract An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.
Inventors
- 👤 Hisashi Shimizu
- 👤 Kazutoshi Tomiyoshi
- 👤 Hatsuji Shiraishi
- 👤 Toshio Shiobara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 18:59
CPC Classifications
C; C08; C08G; C08G77/00; C08G77/42; C08G59/00; C08G59/18; C08G59/20; C08L; C08L63/00
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
186 words
An epoxy resin composition comprising a. an epoxy resin, b. a curing agent, and c. a copolymer mixture comprising a long chain organopolysiloxane copolymer (I) prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain organopolysiloxane represented by the formula (1): ##STR6## wherein R is a hydrogen atom or a methyl group, a, b, c, and d are integers satisfying the relationships: a≧1, b≧0, c≧0, d≧0, and b+c≧1, the amount of the phenyl group is 4 to 15 mole % based on the total amount of the methyl and phenyl groups, and the number of hydrogen atoms directly bonded to silicon atoms per molecule is at least 2 and containing 70 to 300 silicon atoms per molecule, and a short-chain organopolysiloxane copolymer [II] prepared by the addition reaction of an alkenyl-containing epoxy resin with a short-chain organopolysiloxane represented by the formula (1) and containing 20 to 30 silicon atoms per molecule at a weight ratio of the copolymer [II] to the copolymer [I] of 0.3 to 0.6, wherein said epoxy resin recited by a is different from said copolymer mixture recited by c.
Claim 2
Dependent Claim
186 words
An epoxy resin composition comprising a. an epoxy resin, b. a curing agent, and c. a copolymer mixture comprising a long chain organopolysiloxane copolymer (I) prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain organopolysiloxane represented by the formula (1): ##STR6## wherein R is a hydrogen atom or a methyl group, a, b, c, and d are integers satisfying the relationships: a≧1, b≧0, c≧0, d≧0, and b+c≧1, the amount of the phenyl group is 4 to 15 mole % based on the total amount of the methyl and phenyl groups, and the number of hydrogen atoms directly bonded to silicon atoms per molecule is at least 2 and containing 70 to 300 silicon atoms per molecule, and a short-chain organopolysiloxane copolymer [II] prepared by the addition reaction of an alkenyl-containing epoxy resin with a short-chain organopolysiloxane represented by the formula (1) and containing 20 to 30 silicon atoms per molecule at a weight ratio of the copolymer [II] to the copolymer [I] of 0.3 to 0.6, wherein said epoxy resin recited by a is different from said copolymer mixture recited by c.
Claim 3
Dependent Claim
16 words
The epoxy resin composition of claim 1 wherein the organopolysiloxane has .tbd.Si--H groups at both terminals.
Claim 4
Dependent Claim
34 words
The epoxy resin composition of claim 1 wherein the amount of the phenyl group in the organopolysiloxane is 10 to 15 mole % based on the total amount of the methyl and phenyl groups.
Claim 5
Dependent Claim
27 words
The epoxy resin composition of claim 1 wherein the weight ratio of the copolymer [II] to the copolymer [I] of the copolymer mixture is 0.4 to 0.5.
Claim 6
Dependent Claim
19 words
The epoxy resin composition of claim 1 wherein the long-chain organopolysiloxane contains 100 to 150 silicon atoms per molecule.
Claim 7
Dependent Claim
19 words
The epoxy resin composition of claim 1 wherein the short-chain organopolysiloxane contains 23 to 26 silicon atoms per molecule.
Claim 8
Dependent Claim
34 words
The epoxy resin composition of claim 1 wherein the amount of the copolymer mixture is 1 to 100 parts by weight per 100 parts by weight of the epoxy resin and the curing agent.
Claim 9
Dependent Claim
34 words
The epoxy resin composition of claim 7 wherein the amount of the copolymer mixture is 2 to 60 parts by weight per 100 parts by weight of the epoxy resin and the curing agent.
Claim 10
Dependent Claim
13 words
The epoxy resin composition of claim 1 which further comprising an inorganic filler.
Claim 11
Dependent Claim
12 words
A cured resin obtained by curing the resin composition of claim 1.
References Cited (Backward Citations)
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