Patterning composition and method for patterning on a substrate

Claim 2

Method for patterning on a substrate comprising the steps of: applying on a holder a second coating of composition containing 4-methoxy-1-naphthol as a reducing agent which shows reducing activity by being heated and loss of said reducing activity by being irradiated by at least one emission selected from the group consisting of UV light, visible light and infrared light, applying on a substrate a first coating of composition containing copper (II) heptanoate as a metallic salt of organic acid, wherein said copper (II) heptanoate deposits a metal when reduced, irradiating through a metal mask with at least one of UV light, visible light and infrared light said second coating thereby to form patterned activated reducing agent, thereafter contacting a surface of said irradiated second coating with a surface of said first coating, and applying heat to contacting surfaces of said first coating and said second coating, to cause reduction of said copper (II) heptanoate, thereby to produce a patterned deposited metal layer on said substrate.

Claim 3

Method for patterning on a substrate comprising the steps of: applying a second coating of composition containing 4-methoxy-1-naphthol as a reducing agent which shows reducing activity by being heated and loss of said reducing activity by being irradiated by at least one emission selected from the group consisting of UV light, visible light and infrared light, on a first face of a planar holder which is transparent for said light, applying a first coating of composition containing copper (II) heptanoate as a metallic salt of organic acid, wherein said copper (II) heptanoate deposits a metal on a substrate when reduced, contacting a surface of said first coating with a surface of said second coating, irradiating through a metal mask with at least one of UV light, visible light and infrared light said second coating from a second face, opposite said first face, of said planar holder, and applying heat to contacting surfaces of said first coating and said second coating, to cause reduction of said copper (II) heptanoate, thereby to produce a patterned deposited metal layer on said substrate.

Claim 4

Method for patterning on a substrate comprising the steps of: applying a second coating of composition containing 4-methoxy-1-naphthol as a reducing agent which shows reducing activity by being heated and loss of said reducing activity by being irradiated by at least one emission selected from the group consisting of UV light, visible light and infrared light, on a first face of a planar holder which is transparent for said light, applying a first coating of composition containing copper (II) heptanoate as a metallic salt of organic acid, wherein said copper (II) heptanoate deposits a metal on a substrate when reduced, contacting a surface of said first coating with a surface of said second coating, irradiating through a metal mask with at least one of UV light, visible light and infrared light said second coating from a second face, opposite said first face, of said planar holder, and applying heat to contacting surfaces of said first coating and said second coating, to cause reduction of said copper (II) heptanoate, thereby to produce a patterned deposited metal layer on said substrate.