US4913768A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing electrical conductor boards
Assignee: Bayer AG
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Filing: 1989-01-04
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Granted: 1990-04-03
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Expires: 2009-01-04
Abstract
Abstract Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 μm thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 μm thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.
Inventors
- 👤 Gerhard D. Wolf
- 👤 Kirkor Sirinyan
- 👤 Ulrich VON Gizycki
- 👤 Rudolf Merten
- 👤 Friedrich Langer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 04:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/108; H05K3/18; H05K3/181; H05K3/38; H05K3/381; H05K3/40; H05K3/42; H05K3/425; H05K3/426; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K2201/0347; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/072; H05K2203/0723; H05K2203/11; H05K2203/1152; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
107 words
A process for producing two-layer electrical conductor boards with plated-through holes from substrates, which are clad on both sides with copper foils, comprising (a) removing the copper cladding from said substrates chemically or mechanically after cutting to size and drilling, (b) activating the surfaces of said substrates and the drilled hole walls by immersion in an activator bath, (c) providing the substrate from (b) with 0.05-2.0 μm thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture, (d) providing the substrate from (c) with a 0.5-5.0 μm thick copper layer in a subsequent copper bath, and (d) building up the conductor pattern thereon by semiadditive methods.
Claim 2
Dependent Claim
107 words
A process for producing two-layer electrical conductor boards with plated-through holes from substrates, which are clad on both sides with copper foils, comprising (a) removing the copper cladding from said substrates chemically or mechanically after cutting to size and drilling, (b) activating the surfaces of said substrates and the drilled hole walls by immersion in an activator bath, (c) providing the substrate from (b) with 0.05-2.0 μm thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture, (d) providing the substrate from (c) with a 0.5-5.0 μm thick copper layer in a subsequent copper bath, and (d) building up the conductor pattern thereon by semiadditive methods.
Claim 3
Dependent Claim
56 words
A process according to claim 1, wherein after removal of the metal cladding, the surface of the substrates is characterized by a specific total pore volume per unit of 0.015 to 0.045 dm 3 /m 2 , a mean pore diameter of 0.05 to 12.0 μm, and a mean pore depth of 0.05 to 4.0 μm.
Claim 4
Dependent Claim
17 words
A process according to claim 1, wherein the activation is carried out with organic noblemetal complex compounds.
Claim 5
Dependent Claim
17 words
A process according to claim 1, wherein inorganic ionic or colloidal activator systems are used as activators.
Claim 6
Dependent Claim
22 words
A process according to claim 1, wherein the metal layer of Ni, Co, Mn or Ni/Co has a thickness of 0.1-1.0 μm.
Claim 7
Dependent Claim
18 words
A process according to claim 1, wherein the metal layer applied according to (c) is a nickel layer.
Claim 8
Dependent Claim
29 words
A process according to claim 1, wherein the copper layer applied according to (d) has been deposited electrolessly or electrochemically and has a thickness of 1.0 to 3.0 μm.
Claim 9
Dependent Claim
22 words
A process according to claim 1, wherein the build-up of the conductor pattern is carried out by a semi-additive differential etching process.
Claim 10
Dependent Claim
15 words
A process according to claim 1, comprising sensitizing the substrate prior to carrying out (c).
References Cited (Backward Citations)
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US4260449A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-02 | 1993-10-02 | 1994-04-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-02 | 1997-10-02 | 1998-04-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-02 | 2001-10-02 | 2002-04-03 | $7700.00 | Window Closed / Lapsed |