High accuracy, high flexibility, energy beam machining system

Claim 2

A high precision system for machining substrates comprising: a source of an energy beam; an x-y table including means for supporting and positioning a substrate to be machined by said beam; beam deflection means for directing said beam at a predetermined angle to said substrate; real time digital signal processor (DSP) control means for controlling operative subsystems of said system, and beam through detector means for determining substrate through feature presence.

Claim 3

The system of claim 1 wherein the energy beam source comprises an electron beam source.

Claim 4

The system of claim 2 further comprising means for forming, directing, and blanking the beam.

Claim 5

The system of claim 3 further comprising a vacuum chamber enclosing at least the substrate supporting means of the x-y table and the beam source.

Claim 6

The system of claim 4 further comprising laser interferometer detecting means for detecting the position of the substrate.

Claim 7

The system of claim 5 further comprising said beam through detector means determining substrate registration relative to a predetermined position.

Claim 8

The system of claim 6 further comprising dynamic focus and stigmator means for producing a uniform beam within a predetermined field.

Claim 9

The system of claim 7 wherein the beam deflection means comprises deflection coils and a telecentric lens.

Claim 10

A high precision system for machining substrates comprising: an electron beam source; means for forming, directing and blanking said beam; dynamic focus and stigmator means for producing a uniform beam within a predetermined field; beam deflection means for directing said beam at a predetermined angle to a substrate, said beam deflection means comprising deflection coils and a telecentric lens; an x-y table including means for supporting and positioning a substrate to be machined by said beam; a vacuum chamber enclosing at least said substrate supporting means of said x-y table and said beam source; laser interferometer detecting means for detecting said position of a substrate; beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence; real time digital signal processor (DSP) control means for controlling operative subsystems of said system, and a substrate handling subsystem for storing and transferring a substrate into and out of said vacuum chamber, said handling subsystem including a handling chamber in selective vacuum contact with said vacuum chamber.

Claim 11

A high precision system for machining substrates comprising: an electron beam source; means for forming, directing and blanking said beam; dynamic focus and stigmator means for producing a uniform beam within a predetermined field; beam deflection means for directing said beam at a predetermined angle to a substrate, said beam deflection means comprising deflection coils and a telecentric lens; an x-y table including means for supporting and positioning a substrate to be machined by said beam; a vacuum chamber enclosing at least said substrate supporting means of said x-y table and said beam source; laser interferometer detecting means for detecting said position of a substrate; beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence; real time digital signal processor (DSP) control means for controlling operative subsystems of said system, and a substrate handling subsystem for storing and transferring a substrate into and out of said vacuum chamber, said handling subsystem including a handling chamber in selective vacuum contact with said vacuum chamber.

Claim 12

The system of claim 9 further comprising a computer in communication with the DSP control means, the computer configured to provide substrate machining data and to provide an operator interface to the DSP control means.

Claim 13

The system of claim 10 further comprising pattern buffer means for providing high speed substrate machining data memory access to the DSP control means, the machining data loaded into the pattern buffer means from the computer.

Claim 14

The system of claim 11 wherein the forming means includes a power supply producing a substantially +/-24 V ripple regulated voltage over the voltage range of 60 kV-120 kV.

Claim 15

The system of claim 2 further comprising a computer and wherein the DSP control means comprises a plurality of digital signal processor (DSP) cards operatively connected by a VME bus to the computer providing an operator interface, the computer containing at least substrate machining data, memory, and input/output means, the DSP cards further connected to controlled subsystems of the system, and the DSP cards connected to each other by a DSP-DSP bus.

Claim 16

The system of claim 13 further comprising a vacuum chamber enclosing at least the substrate supporting means of the x-y table and the beam source.

Claim 17

The system of claim 14 further comprising laser interferometer detecting means for detecting the position of the substrate.

Claim 18

The system of claim 15 further comprising beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence.

Claim 19

The system of claim 16 further comprising dynamic focus and stigmator means for producing a uniform beam within a predetermined field.

Claim 20

The system of claim 17 wherein the beam deflection means comprises deflection coils and a telecentric lens.

Claim 21

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; beam deflection means for directing said beam at a predetermined angle to said substrate; real time digital signal processor (DSP) control means for controlling operative subsystems of said system, a computer and wherein said DSP control means comprises a plurality of digital signal processor (DSP) cards operatively connected by a VME bus to said computer providing an operator interface, said computer containing at least substrate machining data, memory, and input/output means, said DSP cards further connected to controlled subsystems of said system, and said DSP cards connected to each other by a DSP-DSP bus, a vacuum chamber enclosing at least said substrate supporting means of said x-y table and said beam source, laser interferometer detecting means for detecting said position of a substrate, beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence, dynamic focus and stigmator means for producing a uniform beam within a predetermined field, said beam deflection means comprises deflection coils and a telecentric lens, and a substrate handling subsystem for storing and transferring said substrate into and out of said vacuum chamber, said handling subsystem including a handling chamber in selective vacuum contact with said vacuum chamber.

Claim 22

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; beam deflection means for directing said beam at a predetermined angle to said substrate; real time digital signal processor (DSP) control means for controlling operative subsystems of said system, a computer and wherein said DSP control means comprises a plurality of digital signal processor (DSP) cards operatively connected by a VME bus to said computer providing an operator interface, said computer containing at least substrate machining data, memory, and input/output means, said DSP cards further connected to controlled subsystems of said system, and said DSP cards connected to each other by a DSP-DSP bus, a vacuum chamber enclosing at least said substrate supporting means of said x-y table and said beam source, laser interferometer detecting means for detecting said position of a substrate, beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence, dynamic focus and stigmator means for producing a uniform beam within a predetermined field, said beam deflection means comprises deflection coils and a telecentric lens, and a substrate handling subsystem for storing and transferring said substrate into and out of said vacuum chamber, said handling subsystem including a handling chamber in selective vacuum contact with said vacuum chamber.

Claim 23

The system of claim 19 wherein the forming means includes a power supply producing a substantially +/-24 V ripple regulated voltage over the voltage range of 60 kV-120 kV.

Claim 24

The system of claim 19 further comprising pattern buffer means for providing high speed substrate machining data memory access to the control means across the VME bus, the machining data loaded into the pattern buffer means from the computer across the VME bus.

Claim 25

The system of claim 2 wherein the DSP control means comprises: means for calculating deflection distortion correction; means for calculating x-y table error correction; means for calculating registration of the substrate relative to a predetermined position error correction; comparing means for accumulating the distortion correction, the table correction, and the registration correction, and for comparing the accumulated correction with predetermined feature locations; and correcting means for correcting beam deflection to compensate for the accumulated correction, the correcting means responsive to the comparing means.

Claim 26

The system of claim 4, wherein the DSP control means comprises: first controlling means for controlling voltage to create the beam; second controlling means for controlling dynamic focus and astigmatism to produce a uniform beam; third controlling means for controlling the blanking means; fourth controlling means for controlling vacuum in the vacuum chamber; first detecting means for detecting the substrate x-y position; second detecting means for determining substrate registration relative to a predetermined position; fifth controlling means for controlling a substrate handling subsystem; and master controlling means for controlling the deflection means.

Claim 27

A high precision system for machining substrates comprising: a source of an energy beam; an x-y table including means for supporting and positioning a substrate to be machined by the beam; a vacuum chamber enclosing at least the substrate supporting means of the x-y table; detecting means for detecting the position of the substrate within the vacuum chamber; beam through detector means for determining substrate registration relative to a predetermined position and for determining substrate through feature presence; telecentric beam deflection means for directing the beam substantially perpendicular to the substrate, within a predetermined field of the substrate; and real time digital signal processor (DSP) control means for controlling at least the forming, directing, blanking, positioning, detecting, beam through detector, and deflection means.

Claim 28

A high precision system for machining substrates comprising: a source of an energy beam; an x-y table including means for supporting and positioning a substrate to be machined by the beam; a vacuum chamber enclosing at least the substrate supporting means of the x-y table; detecting means for detecting the position of the substrate within the vacuum chamber; beam through detector means for determining substrate registration relative to a predetermined position and for determining substrate through feature presence; telecentric beam deflection means for directing the beam substantially perpendicular to the substrate, within a predetermined field of the substrate; and real time digital signal processor (DSP) control means for controlling at least the forming, directing, blanking, positioning, detecting, beam through detector, and deflection means.

Claim 29

The system of claim 24 wherein the energy beam source comprises an electron beam source.

Claim 30

The system of claim 25 further comprising means for forming, directing, and blanking the beam.

Claim 31

The system of claim 26 wherein the vacuum chamber further encloses the beam source.

Claim 32

The system of claim 27 wherein the detecting means includes a laser interferometer.

Claim 33

The system of claim 28 further comprising dynamic focus and stigmator means for producing a uniform beam within a predetermined field.

Claim 34

The system of claim 29 wherein the beam deflection means comprises deflection coils and a telecentric lens.

Claim 35

The system of claim 30 further comprising a substrate handling subsystem for storing and transferring the substrate into and out of the vacuum chamber, the handling subsystem including a handling chamber in selective vacuum contact with the vacuum chamber.

Claim 36

The system of claim 31 further comprising a computer in communication with the DSP control means, the computer configured to provide substrate machining data and to provide an operator interface to the DSP control means.

Claim 37

The system of claim 32 further comprising pattern buffer means for providing high speed substrate machining data memory to the DSP control means, the machining data loaded into the pattern buffer means from the computer.

Claim 38

The system of claim 33 wherein the forming means includes a power supply producing a substantially +/-24 V ripple regulated voltage over the voltage range of 60 kV-120 kV.

Claim 39

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; a vacuum chamber enclosing at least said substrate supporting means of said x-y table; detecting means for detecting said position of said substrate within said vacuum chamber; beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence; telecentric beam deflection means for directing said beam substantially perpendicular to said substrate, within a predetermined field of said substrate; real time digital signal processor (DSP) control means for controlling at least said forming, directing, blanking, positioning, detecting, beam through detector, and deflection means; a computer and wherein said DSP control means comprises a plurality of digital signal processor (DSP) cards operatively connected by a VME bus to said computer providing an operator interface, said computer containing at least substrate machining data, memory, and input/output means, said DSP cards further connected to controlled subsystems of said system, and said DSP cards connected to each other by a DSP-DSP bus.

Claim 40

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; a vacuum chamber enclosing at least said substrate supporting means of said x-y table; detecting means for detecting said position of said substrate within said vacuum chamber; beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence; telecentric beam deflection means for directing said beam substantially perpendicular to said substrate, within a predetermined field of said substrate; real time digital signal processor (DSP) control means for controlling at least said forming, directing, blanking, positioning, detecting, beam through detector, and deflection means; a computer and wherein said DSP control means comprises a plurality of digital signal processor (DSP) cards operatively connected by a VME bus to said computer providing an operator interface, said computer containing at least substrate machining data, memory, and input/output means, said DSP cards further connected to controlled subsystems of said system, and said DSP cards connected to each other by a DSP-DSP bus.

Claim 41

The system of claim 25 wherein the control means comprises: means for calculating deflection distortion correction; means for calculating x-y table error correction; means for calculating registration of the substrate relative to a predetermined position error correction; comparing means for accumulating the distortion correction, the table correction, and the registration correction, and for comparing the accumulated correction with predetermined feature locations; and correcting means for correcting beam deflection to compensate for the accumulated correction, the correcting means responsive to the comparing means.

Claim 44

The method of claim 37 wherein the forming step comprises regulating a power supply ripple voltage within +/-24 V over a voltage range of 60 kV-120 kV.

Claim 45

The method of claim 38 wherein the forming step further comprises dynamically controlling the beam focus and astigmatism.

Claim 48

The method of claim 40 further comprising selectively pulsing said beam to machine said substrate in response to digital signal processor signals.

Claim 49

The method of claim 40 wherein said drilling comprises successively pulsing said beam with predetermined pulse widths to produce a predetermined hole profile in said substrate.

Claim 50

The method of claim 42 wherein the successive pulsing comprises a) applying a first pulse a predetermined pulse width; and b) applying subsequent pulses of successively increasing pulse widths to complete said drilling of a hole in said substrate.

Claim 51

A high precision system for machining substrates comprising: a source of an energy beam; an x-y table including means for supporting and positioning a substrate to be machined by the beam; telecentric beam deflection means for directing the beam at a predetermined angle to the substrate; real time digital signal processor (DSP) control means for controlling operative subsystems of the system, and beam through detector means for determining substrate through feature presence.

Claim 52

A high precision system for machining substrates comprising: a source of an energy beam; an x-y table including means for supporting and positioning a substrate to be machined by the beam; telecentric beam deflection means for directing the beam at a predetermined angle to the substrate; real time digital signal processor (DSP) control means for controlling operative subsystems of the system, and beam through detector means for determining substrate through feature presence.

Claim 53

A system in accordance with claim 44, wherein said through detector means includes means for determining substrate registration relative to a predetermined position.

Claim 54

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; beam deflection means for directing said beam at a predetermined angle to said substrate; a computer containing at least substrate machining data, memory, and input/output means real time digital signal processor (DSP) control means for controlling operative subsystems of said high precision system, said DSP control means comprising a plurality of digital signal processor (DSP) cards operatively connected by a VME bus to said computer providing an operator interface, said DSP cards further connected to controlled subsystems of said system, and said DSP cards connected to each other by a DSP-DSP bus, a vacuum chamber enclosing at least the substrate supporting means of said x-y table and said beam source, laser interferometer detecting means for detecting said position of a substrate, beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence, dynamic focus and stigmator means for producing a uniform beam within a predetermined field, said beam deflection means comprises deflection coils and a telecentric lens, and a substrate handling subsystem for storing and transferring said substrate into and out of said vacuum chamber, said handling subsystem including a handling chamber in selective vacuum contact with said vacuum chamber.

Claim 55

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; beam deflection means for directing said beam at a predetermined angle to said substrate; a computer containing at least substrate machining data, memory, and input/output means real time digital signal processor (DSP) control means for controlling operative subsystems of said high precision system, said DSP control means comprising a plurality of digital signal processor (DSP) cards operatively connected by a VME bus to said computer providing an operator interface, said DSP cards further connected to controlled subsystems of said system, and said DSP cards connected to each other by a DSP-DSP bus, a vacuum chamber enclosing at least the substrate supporting means of said x-y table and said beam source, laser interferometer detecting means for detecting said position of a substrate, beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence, dynamic focus and stigmator means for producing a uniform beam within a predetermined field, said beam deflection means comprises deflection coils and a telecentric lens, and a substrate handling subsystem for storing and transferring said substrate into and out of said vacuum chamber, said handling subsystem including a handling chamber in selective vacuum contact with said vacuum chamber.

Claim 56

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; a vacuum chamber enclosing at least said substrate supporting means of said x-y table; detecting means for detecting said position of said substrate within said vacuum chamber; beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence; telecentric beam deflection means for directing said beam substantially perpendicular to said substrate, within a predetermined field of said substrate; and real time digital signal processor (DSP) control means for controlling at least said forming, directing, blanking, positioning, detecting, beam through detector, and deflection means.

Claim 57

A high precision system for machining substrates comprising: a source of an energy beam comprising an electron beam source; an x-y table including means for supporting and positioning a substrate to be machined by said beam; a vacuum chamber enclosing at least said substrate supporting means of said x-y table; detecting means for detecting said position of said substrate within said vacuum chamber; beam through detector means for determining substrate registration relative to a predetermined position and for detecting substrate through feature presence; telecentric beam deflection means for directing said beam substantially perpendicular to said substrate, within a predetermined field of said substrate; and real time digital signal processor (DSP) control means for controlling at least said forming, directing, blanking, positioning, detecting, beam through detector, and deflection means.

Claim 60

A method in accordance with claim 47 wherein detecting substrate registration relative to a predetermined position of said substrate.