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US5170929A
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US
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Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means
Assignee: International Business Machines Corp
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Filing: 1992-05-29
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Granted: 1992-12-15
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Expires: 2012-05-29
Abstract
Abstract An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the quality and/or adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to the acoustic transducer means for monitoring the ultrasonic signal from the ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.
Inventors
- 👤 David C. Long
- 👤 Krishna Seshan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 23:57
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/10; G; G01; G01N; G01N29/00; G01N29/04; G01N29/11; H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; G01N2291/00; G01N2291/02; G01N2291/023; G01N2291/0231; G01N2291/025; G01N2291/0258; G01N2291/028; G01N2291/02827; G01N2291/04; G01N2291/044; G01N2291/10; G01N2291/101; G01N2291/26; G01N2291/269; G01N2291/2697
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
61 words
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to said acoustic transducer means for monitoring the ultrasonic signal from said ultrasonic source.
Claim 2
Dependent Claim
61 words
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to said acoustic transducer means for monitoring the ultrasonic signal from said ultrasonic source.
Claim 3
Dependent Claim
44 words
The apparatus of claim 1 wherein said monitor means comprises circuit means for detecting a predetermined amplitude level of the ultrasonic signal and process control means responsive to said predetermined amplitude level of said circuit means for regulating the power of said ultrasonic source.
Claim 4
Dependent Claim
25 words
The apparatus of claim 1 wherein the first substrate is a wire and said apparatus monitors the bonding of said wire to the second substrate.
Claim 5
Dependent Claim
41 words
The apparatus of claim 1 wherein the first substrate is a chip, chip resistor, chip transistor or surface mount component, and said apparatus monitors the removal of said chip, chip resistor, chip transistor or surface mount component, from the second substrate.
Claim 6
Dependent Claim
30 words
The apparatus of claim 1 wherein the first substrate is a pin or a wire and said apparatus monitors the removal of said pin or wire from the second substrate.
Claim 7
Dependent Claim
19 words
The apparatus of claim 1 further comprising a tube resonator interposed between said acoustic transducer means and the substrates.
Claim 8
Dependent Claim
13 words
The apparatus of claim 1 wherein said acoustic transducer means is a microphone.
Claim 9
Independent Claim
70 words
A method for monitoring the adhesion/dehesion between first and second substrates in an ultrasonic adhesion/dehesion monitoring apparatus comprising an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates, the method comprising the steps of: (a) placing acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (b) coupling monitor means to said acoustic transducer means for monitoring the ultrasonic signal from said ultrasonic source.
Claim 10
Independent Claim
70 words
A method for monitoring the adhesion/dehesion between first and second substrates in an ultrasonic adhesion/dehesion monitoring apparatus comprising an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates, the method comprising the steps of: (a) placing acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (b) coupling monitor means to said acoustic transducer means for monitoring the ultrasonic signal from said ultrasonic source.
Claim 11
Dependent Claim
19 words
The method of claim 8 further comprising interposing a tube resonator between the acoustic transducer means and the substrates.
Claim 12
Dependent Claim
44 words
The method of claim 1 wherein said monitor means comprises circuit means for detecting a predetermined amplitude level of the ultrasonic signal and process control means responsive to said predetermined amplitude level of said circuit means for regulating the power of said ultrasonic source.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-12-15 | 1996-06-15 | 1996-12-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-12-15 | 2000-06-15 | 2000-12-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-12-15 | 2004-06-15 | 2004-12-15 | $7700.00 | Window Closed / Lapsed |