Packaging for molded carriers of integrated circuits

Claim 2

A package for carriers of integrated circuits for handling the integrated circuit prior to attachment to a printed circuit board comprising: a plurality of integrated circuits, each of said integrated circuits having a plurality of electrical leads attached to and extending outwardly from said integrated circuit; a plurality of carriers, each of said carriers retaining an individual integrated circuit by rigidly retaining in a substantially planar direction all of said plurality of electrical leads attached to and extending outwardly from said integrated circuit; and means for flexibly and sequentially connecting said plurality of carriers to another of said carriers so as to form a flexible chain of said carriers and so that said carriers can be folded over one another, wherein said means for flexibility and sequentially connecting said plurality of carriers to each other comprises an electrically conductive material.

Claim 3

A package for integrated circuits as recited in claim 1 wherein said means for flexibly and sequentially connecting said plurality of carriers to each other comprises an adhesive tape.

Claim 6

A method for packaging carriers of integrated circuits as recited in claim 3 wherein said flexible link within said connecting step comprises an adhesive tape.

Claim 7

A package for carriers of integrated circuits comprising: a plurality of integrated circuits, each of said integrated circuits having a plurality of electrical leads attached to and extending outwardly from said integrated circuits; at least two adjacently positioned carriers, each of said carriers retaining an individual integrated circuit by rigidly retaining in a substantially planar direction all of said plurality of electrical leads attached to and extending outwardly from said integrated circuit; each of said carriers having top and bottom surfaces and each of said surfaces having first and second opposed edges; and first, second, third and fourth strips of adhesive tape, said first adhesive tape having a portion adhering to a portion of the top surface near said first edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said second adhesive tape having a portion adhering to a portion of the bottom surface near said first edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said first and second adhesive tapes being secured together a distance along said portion extending between said carriers to form a flexible hinge, said third adhesive tape having a portion adhering to a portion of the top surface near said second edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said fourth adhesive tape having a portion adhering to a portion of the bottom surface near said second edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said third and fourth adhesive tapes being secured together a distance along said portion extending between said carriers to form a flexible hinge.

Claim 8

A package for carriers of integrated circuits comprising: a plurality of integrated circuits, each of said integrated circuits having a plurality of electrical leads attached to and extending outwardly from said integrated circuits; at least two adjacently positioned carriers, each of said carriers retaining an individual integrated circuit by rigidly retaining in a substantially planar direction all of said plurality of electrical leads attached to and extending outwardly from said integrated circuit; each of said carriers having top and bottom surfaces and each of said surfaces having first and second opposed edges; and first, second, third and fourth strips of adhesive tape, said first adhesive tape having a portion adhering to a portion of the top surface near said first edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said second adhesive tape having a portion adhering to a portion of the bottom surface near said first edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said first and second adhesive tapes being secured together a distance along said portion extending between said carriers to form a flexible hinge, said third adhesive tape having a portion adhering to a portion of the top surface near said second edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said fourth adhesive tape having a portion adhering to a portion of the bottom surface near said second edge of each of said adjacent carriers and having a portion extending between said adjacent carriers, said third and fourth adhesive tapes being secured together a distance along said portion extending between said carriers to form a flexible hinge.

Claim 9

A package as set forth in claim 5 wherein said adhesive tape extending between adjacent carriers is of sufficient length so that said carriers can be folded over one another.

Claim 10

A package as set forth in claim 5 wherein said adhesive tape is electrically conductive.

Claim 11

A package as set forth in claim 5 wherein said adhesive tape has adhesive only on one side.

Claim 12

A package as set forth in claim 5 wherein said adhesive tape has adhesive on only one side and electrically conductive surface on the other side.

Claim 13

A package as set forth in claim 5 wherein each of said carriers has substantially identical widths and said adjacent positioned carriers are spaced apart a distance slightly greater than twice the width of said carrier so that said carriers may be folded over one another and may be positioned and maintained in substantially identical superimposed positions.

Claim 14

A package as set forth in claim 5 wherein said adhesive tape comprises a metallized polyester with an acrylic adhesive backing.

Claim 15

A package as set forth in claim 5 wherein said tape does not run the entire length of the carrier's edge.