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US5169407A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of determining end of cleaning of semiconductor manufacturing apparatus

Assignee: Toshiba Corp
•
Filing: 1990-12-07
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Granted: 1992-12-08
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Expires: 2010-12-07
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Abstract

Abstract In a method for determining an end of cleaning of a semiconductor manufacturing apparatus according to the invention, when the interior of a semiconductor substrate process chamber of the semiconductor manufacturing apparatus is cleaned by dry etching using plasma discharge, a constant current or voltage is supplied from a high-frequency power source to discharge electrodes during plasma discharge, an impedance between the electrodes or a temperature in the process chamber is monitored, a time point at which the impedance or temperature is abruptly changed is detected, and this time point of detection is determined to be an end of cleaning.

Inventors

  • 👤 Yasukazu Mase
  • 👤 Masahiro Abe
  • 👤 Osamu Hirata

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 22:21
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0418; H10P72/0421

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 62 words
A device for determining an end of cleaning of a semiconductor manufacturing apparatus having a semiconductor substrate process chamber comprising: means for cleaning an interior of the chamber using plasma discharge etching; means for monitoring a temperature in the chamber; and means for detecting a transition in a rate of change of the monitored temperature to determine the end of the cleaning.
Claim 2
Independent Claim 62 words
A device for determining an end of cleaning of a semiconductor manufacturing apparatus having a semiconductor substrate process chamber comprising: means for cleaning an interior of the chamber using plasma discharge etching; means for monitoring a temperature in the chamber; and means for detecting a transition in a rate of change of the monitored temperature to determine the end of the cleaning.
Claim 3
Dependent Claim 45 words
A device according to claim 1, wherein said detecting means determines the end of cleaning after a predetermined period of time has elapsed from the occurrence of the transition in the temperature change rate, said predetermined period of time resulting in overetching in the chamber.

References Cited (Backward Citations)

JPS5534229A Cited
US4207137A Cited
JPS5619624A Cited
GB2076330A Cited
JPS5879722A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-12-08 1996-06-08 1996-12-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-12-08 2000-06-08 2000-12-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-12-08 2004-06-08 2004-12-08 $7700.00 Window Closed / Lapsed

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