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US5166772A
Expired / Lapsed
US
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Transfer molded semiconductor device package with integral shield
Assignee: NXP USA Inc
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Filing: 1991-02-22
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Granted: 1992-11-24
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Expires: 2011-02-22
Abstract
Abstract A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a substrate (10) having a metallization pattern (12, 13), with one portion of the metallization pattern being a circuit ground (13). A semiconductor device (16) is electrically interconnected (17) to the metallization pattern (12). A perforated metal shield or screen (18) covers the semiconductor device (16) and is electrically and mechanically attached to the metallization circuit ground (13) in order to shield the semiconductor device (16) from radio frequency energy. A resin material (14) is transfer molded about the semiconductor device, the electrical interconnections, and the metal screen to form the completed package.
Inventors
- 👤 Keith D. Soldner
- 👤 Frank J. Juskey
- 👤 Bruce J. Freyman
- 👤 Barry M. Miles
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 10:26
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W42/00; H10W42/20; H10W42/60; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
118 words
A shielded semiconductor device package, comprising: an insulating substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a plurality of solderable surface mount pads, the metallization pattern being electrically connected to the surface mount pads by means of at least one conductive via; a semiconductor device electrically attached to the metallization pattern and mechanically attached to the substrate; a metal screen enclosing the semiconductor device and electrically and mechanically attached to the substrate circuit ground portion to shield the semiconductor device from radio frequency energy; and an insulating material transfer molded about the semiconductor device and encapsulating the metal screen.
Claim 2
Dependent Claim
118 words
A shielded semiconductor device package, comprising: an insulating substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a plurality of solderable surface mount pads, the metallization pattern being electrically connected to the surface mount pads by means of at least one conductive via; a semiconductor device electrically attached to the metallization pattern and mechanically attached to the substrate; a metal screen enclosing the semiconductor device and electrically and mechanically attached to the substrate circuit ground portion to shield the semiconductor device from radio frequency energy; and an insulating material transfer molded about the semiconductor device and encapsulating the metal screen.
Claim 3
Dependent Claim
17 words
The shielded semiconductor device package according to claim 1, wherein the metal screen comprises a wire mesh.
Claim 4
Dependent Claim
18 words
The shielded semiconductor device package according to claim 1, wherein the metal screen comprises a perforated metal sheet.
Claim 5
Dependent Claim
24 words
The shielded semiconductor device package according to claim 1, wherein the metal screen is soldered to the circuit ground portion of the metallization pattern.
Claim 6
Dependent Claim
30 words
The shielded semiconductor device package according to claim 1, wherein the metal screen is attached to the circuit ground portion of the metallization pattern by means of a conductive epoxy.
Claim 7
Dependent Claim
151 words
A shielded semiconductor device package including a radio frequency shield for at least one semiconductor device, comprising: an insulating substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a plurality of solderable surface mount pads, the metallization pattern being electrically connected to the surface mount pads by means of at least one plated through hole, and having the semiconductor device mechanically attached and electrically interconnected thereto; a non-conductive material encapsulating the semiconductor device, the electrical interconnections, and portions of the first side of the substrate; and a metal screen enclosing the semiconductor device and covering a portion of the first side of the substrate and electrically coupling the substrate and the metal screen to provide a shield for substantially reducing the ingress or egress of radio frequency signals through the semiconductor device package.
Claim 8
Dependent Claim
151 words
A shielded semiconductor device package including a radio frequency shield for at least one semiconductor device, comprising: an insulating substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a plurality of solderable surface mount pads, the metallization pattern being electrically connected to the surface mount pads by means of at least one plated through hole, and having the semiconductor device mechanically attached and electrically interconnected thereto; a non-conductive material encapsulating the semiconductor device, the electrical interconnections, and portions of the first side of the substrate; and a metal screen enclosing the semiconductor device and covering a portion of the first side of the substrate and electrically coupling the substrate and the metal screen to provide a shield for substantially reducing the ingress or egress of radio frequency signals through the semiconductor device package.
Claim 9
Dependent Claim
16 words
The shielded semiconductor device package according to claim 6, wherein the non-conductive material is transfer molded.
Claim 10
Dependent Claim
17 words
The shielded semiconductor device package according to claim 7, wherein the metal screen comprises a wire mesh.
Claim 11
Dependent Claim
18 words
The shielded semiconductor device package according to claim 6, wherein the metal screen comprises a perforated metal sheet.
Claim 12
Dependent Claim
30 words
The shielded semiconductor device package according to claim 6, wherein the metal screen is attached to the circuit ground portion of the metallization pattern by means of a conductive epoxy.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-24 | 1996-05-25 | 1996-11-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-24 | 2000-05-25 | 2000-11-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-24 | 2004-05-25 | 2004-11-24 | $7700.00 | Window Closed / Lapsed |