US5165590A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for manufacturing integrated device with improved connections between the pins and the semiconductor material chip
Assignee: STMicroelectronics SRL
•
Filing: 1992-04-13
•
Granted: 1992-11-24
•
Expires: 2012-04-13
Abstract
Abstract A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.
Inventors
- 👤 Carlo Cini
- 👤 Angelo Massironi
- 👤 Luigi Sisti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:52
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/50; H10W72/90; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07552; H10W72/07553; H10W72/07555; H10W72/521; H10W72/527; H10W72/531; H10W72/5363; H10W72/537; H10W72/541; H10W72/5445; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/557; H10W72/59; H10W72/921; H10W72/926; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
85 words
Process for the manufacture of integrated devices, comprising the steps of: selectively gold-plating device pins; and wire soldering for the execution of connections between a semiconductor material chip and the pins, wherein said wire soldering step includes: soldering wires made of at least a first material comprising aluminium or alloys with a prevalence of aluminium for providing the chip power connections; and soldering wires made of at least a second material comprising gold or alloys with prevalence of gold for providing the chip signal connections.
Claim 2
Dependent Claim
85 words
Process for the manufacture of integrated devices, comprising the steps of: selectively gold-plating device pins; and wire soldering for the execution of connections between a semiconductor material chip and the pins, wherein said wire soldering step includes: soldering wires made of at least a first material comprising aluminium or alloys with a prevalence of aluminium for providing the chip power connections; and soldering wires made of at least a second material comprising gold or alloys with prevalence of gold for providing the chip signal connections.
Claim 3
Dependent Claim
35 words
Process according to claim 1, wherein the wires comprising gold or alloys with prevalence or gold are soldered with a thermosonic method and the aluminium or aluminim-based alloy wires are soldered with an ultrasonic method.
Claim 4
Dependent Claim
34 words
Process according to claim 2, wherein plating is performed galvanically, using protection masks suitable for covering at least the outer ends of the pins, such as to leave uncovered selected portions of said pins.
Claim 5
Dependent Claim
33 words
Process according to claim 3, wherein the internal parts of the pins intended to be enclosed in a package are gold-plated, so that the gold plating remains inside the package after its closure.
Claim 6
Dependent Claim
69 words
Process according to claim 3, wherein said step of selectively gold-plating of the device pins includes: degreasing by immersion said pins in a sodium hydrate bath; washing said pins; reviving said pins in a bath of hydrochloric acid; coating said pins with a very thin layer of copper by immersion in a bath; coating said pins with a thin layer of nickel; and plating said pins with electrolytic gold.
Claim 7
Dependent Claim
67 words
Process according to claim 3, wherein said step of selectively gold-plating the device pins includes: degreasing by immersion said pins in a sodium hydrate bath; washing said pins; reviving said pins in a bath of hydrochloric acid; coating said pins with a thin layer of nickel; coating said pins with a very thin layer of copper by immersion in a bath; plating said pins with electrolytic gold.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-24 | 1996-05-25 | 1996-11-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-24 | 2000-05-25 | 2000-11-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-24 | 2004-05-25 | 2004-11-24 | $7700.00 | Window Closed / Lapsed |