Patent US5164699A successfully refreshed from Google Patents.
US5164699A
Expired / Lapsed
US
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Via resistors within-multi-layer, 3 dimensional structures substrates
Assignee: Raytheon Co
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Filing: 1990-12-17
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Granted: 1992-11-17
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Expires: 2010-12-17
Abstract
Abstract Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.
Inventors
- 👤 Hal D. Smith
- 👤 Robert F. McClanahan
- 👤 Andrew A. Shapiro
- 👤 Raymond Brown
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:17
CPC Classifications
H; H01; H01C; H01C1/00; H01C1/08; H01C1/084; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H10; H10W; H10W44/00; H10W44/401; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
86 words
A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising: a plurality of resistive via fills in vias in respective adjacent insulating layers forming respective via resistors having precisely controlled resistance values; a plurality of conductive means for electrically contacting predetermined tops and bottoms of the resistive via fills; and electrical connection means for providing external electrical connection to selected ones of said conductive means at locations on the outside the unitized multilayer circuit structure.
Claim 2
Dependent Claim
86 words
A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising: a plurality of resistive via fills in vias in respective adjacent insulating layers forming respective via resistors having precisely controlled resistance values; a plurality of conductive means for electrically contacting predetermined tops and bottoms of the resistive via fills; and electrical connection means for providing external electrical connection to selected ones of said conductive means at locations on the outside the unitized multilayer circuit structure.
Claim 3
Dependent Claim
19 words
The resistor structure of claim 1 wherein said conductive means comprises a conductive via fill or a conductive trace.
Claim 4
Dependent Claim
27 words
The resistor structure of claim 1 wherein said electrical connection means includes a conductive via fill which extends to the outside of the unitized multilayer circuit structure.
Claim 5
Dependent Claim
26 words
The resistor structure of claim 1 wherein said plurality of resistive via fills are configured to provide resistance values having predetermined ratios relative to each other.
Claim 6
Dependent Claim
20 words
The resistor structure of claim 4 wherein said ratios are controlled by the cross-sectional areas of said resistive via fills.
Claim 7
Dependent Claim
23 words
The resistor structure of claim 4 wherein said ratios are controlled by the characteristics of the material utilized for said resistive via fills.
Claim 8
Dependent Claim
19 words
The resistor structure of claim 4 wherein said ratios are controlled by the thicknesses of said resistive via fills.
Claim 9
Dependent Claim
72 words
A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising: a resistive via fill formed in a via in one of the insulating layers and forming a via resistor having a precisely controlled resistance value; and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.
Claim 10
Dependent Claim
72 words
A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising: a resistive via fill formed in a via in one of the insulating layers and forming a via resistor having a precisely controlled resistance value; and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.
Claim 11
Dependent Claim
23 words
The resistor structure of claim 8 wherein said one or more thermally conductive via fills comprises one or more electrically conductive via fills.
Claim 12
Dependent Claim
24 words
The resistor structure of claim 8 wherein said one or more thermally conductive via fills comprises one or more metal matrix composite via inserts.
Claim 13
Dependent Claim
82 words
A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising: a plurality of resistive via fills comprising the same via fill material formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined precisely controlled ratios; and contact means electrically connected to the tops and bottoms of said plurality of resistive via fills.
Claim 14
Dependent Claim
82 words
A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising: a plurality of resistive via fills comprising the same via fill material formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined precisely controlled ratios; and contact means electrically connected to the tops and bottoms of said plurality of resistive via fills.
Claim 15
Dependent Claim
40 words
The resistor structure of claim 11 further including for each of said resistive via fills one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.
Claim 16
Dependent Claim
39 words
The resistor structure of claim 11 further including for each of said resistive via fills electrical connection means for allowing electrical connection to selected ones of said contact means from locations on the outside the unitized multilayer circuit structure.
References Cited (Backward Citations)
US4300115A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-17 | 1996-05-18 | 1996-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-17 | 2000-05-18 | 2000-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-17 | 2004-05-18 | 2004-11-17 | $7700.00 | Window Closed / Lapsed |