US5164336A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method
Assignee: Nippon Steel Chemical and Materials Co Ltd
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Filing: 1990-09-06
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Granted: 1992-11-17
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Expires: 2010-09-06
Abstract
Abstract A method of connecting a TAB tape to a semiconductor chip is disclosed which comprises the steps of preliminarily locating and fixing bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps. Also disclosed are a bump sheet and a bumped tape to be used in a method of connecting a TAB tape to a semiconductor chip.
Inventors
- 👤 Yasuhide Ohno
- 👤 Tadakatsu Maruyama
- 👤 Hiroaki Otsuka
- 👤 Hiroyuki Tanahashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:17
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H10W72/00; H10W72/071; H10W72/0711; H10W70/40; H10W70/453; H10W72/077; H10W72/701; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/20; H10W72/251; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
84 words
A method of connecting a TAB tape to a semiconductor chip comprising the steps of: preliminarily locating and fixing substantially spherical bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps.
Claim 2
Independent Claim
84 words
A method of connecting a TAB tape to a semiconductor chip comprising the steps of: preliminarily locating and fixing substantially spherical bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps.
Claim 3
Dependent Claim
33 words
A method according to claim 1, wherein said bumps are arranged and fixed on a substrate of a synthetic resin film at positions corresponding to the pattern of electrodes of said semiconductor chip.
Claim 4
Dependent Claim
61 words
A method according to claim 1, wherein said bumps are located on a substrate of a synthetic resin film at positions corresponding to the pattern of electrodes of said semiconductor chip and fixed by transferring the bumps from said substrate to portions of the leads of said TAB tape which are to be connected to the electrodes of said semiconductor chip.
Claim 5
Dependent Claim
75 words
A method according to claim 1, wherein said bumps are fixed in a form of a bump sheet by arranging the bumps on a substrate of a synthetic resin film at Positions corresponding to the pattern of electrodes of said semiconductor chip and the leads of said TAB tape are formed in a predetermined pattern on one surface of said synthetic resin film of said bump sheet in an electrically conducting relation with said bumps.
Claim 6
Dependent Claim
11 words
The method of claim 1 wherein said electrodes are aluminum electrodes.
Claim 7
Dependent Claim
12 words
The method of claim 1 wherein said bumps are made of metal.
Claim 8
Dependent Claim
22 words
The method of claim 1 wherein said bumps are made of a metal selected from the group consisting gold, aluminum and copper.
Claim 9
Dependent Claim
14 words
The method of claim 2 wherein said synthetic resin is a polyester or polyimide.
Claim 10
Dependent Claim
27 words
The method of claim 1 wherein said thermocompression is carried out at a temperature of 350° C. to 550° C. and pressure of 10 to 50 g/lead.
References Cited (Backward Citations)
JPS5718347A
Cited
JPS59202643A
Cited
JPS6052045A
Cited
US4784972A
Cited
JPS63288032A
Cited
JPS63291427A
Cited
JPH01243554A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-17 | 1996-05-18 | 1996-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-17 | 2000-05-18 | 2000-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-17 | 2004-05-18 | 2004-11-17 | $7700.00 | Window Closed / Lapsed |