Formation of bump electrode

Abstract

Abstract PURPOSE:To form a bump electrode at low cost by a method wherein a metal granule is inserted into the metal granule inserting hole located on a positioning plate, the metal granule is heated up and compressed under the above-mentioned condition and jointed to a substrate. CONSTITUTION:A positioning plate 9 is provided on a semiconductor substrate 6. A metal ball 10 is supplied into the metal granule inserting hole 8 located on a positioning plate 9. The positioning plate 9 and the substrae 6 are inclined together, and the remaining metal ball 11 which is not in the inserting hole is removed. The positioning plate 9 and the substrate 6 are bought to the horizontal position again. Then, a heating roller 12 is rolled to the point above the metal ball 10. As a result, the metal ball 10 is heated up and compressed and joined to an electrode pad 7.

Inventors

• 👤 Masanobu Horii
• 👤 堀井　政信
• 👤 Yutaka Makino
• 👤 豊 牧野

Bibliographic Details