Semiconductor integrated circuit device and method of producing same

Claim 2

A semiconductor integrated circuit device comprising a negative differential resistance element and a field effect transistor which are formed in a first region and in a second region, different from the first region, respectively, on a principal surface of the same semiconductor substrate, a base layer of said negative differential resistance element and a channel layer of said field effect transistor being formed as the same epitaxial layer, wherein said base layer and said channel layer are located at the same level from said principal surface of said semiconductor substrate and have the same thickness, and wherein a collector current of said negative differential resistance element has negative differential characteristics which are functions of a voltage between a base and an emitter thereof.

Claim 3

A device acceding to claim 1, wherein said negative differential resistance element is a resonant tunneling hot electron transistor and said field effect transistor is a Schottky-barrier type field effect transistor.

Claim 4

A device according to claim 1, wherein said negative differential resistance element is a resonant tunneling hot electron transistor and said field effect transistor is a heterojunction type field effect transistor.

Claim 5

A device according to claim 1, wherein said negative differential resistance element is a resonant tunneling bipolar transistor and said field effect transistor is a Schottky-barrier type field effect transistor.

Claim 6

A semiconductor integrated circuit device comprising a negative differential resistance element and a field effect ransistor which are formed on the same semiconductor substrate, a base layer of said negative differential resistance element and a channel layer of said field effect transistor being formed in the same epitaxial layer, a base electrode of said negative differential resistance element, and source and drain electrodes of said field effect transistor being in electrical connection with said epitaxial layer to thereby monolithically integrate said resistance element and said field effect transistor.

Claim 7

A semiconductor integrated circuit device comprising a negative differential resistance element and a field effect ransistor which are formed on the same semiconductor substrate, a base layer of said negative differential resistance element and a channel layer of said field effect transistor being formed in the same epitaxial layer, a base electrode of said negative differential resistance element, and source and drain electrodes of said field effect transistor being in electrical connection with said epitaxial layer to thereby monolithically integrate said resistance element and said field effect transistor.

Claim 8

A device according to claim 1, wherein said negative differential resistance element comprises: a collector layer formed on said substrate; a base layer formed on said collector layer; an emitter layer formed on said base layer; a resonant tunneling barrier layer formed between said emitter layer and said base layer and consisting of: a first barrier layer formed to come into contact with said emitter layer and having a thickness at which electrons injected into said emitter layer are able to tunnel therethrough; a second barrier layer formed to come into contact with said base layer and having a thickness at which electrons injected into said emitter layer are able to tunnel therethrough; and a well layer formed between said first and second barriers, having a band gap smaller than those of said first and second barriers and having a thickness at which a sub-band can be formed therein; and said field effect transistor is a Schottky barrier type field effect transistor and comprises: a channel layer formed of a layer identical to said base layer; a Schottky barrier layer formed of one of said base layer and said emitter layer; a gate electrode formed on said Schottky barrier layer; and a source electrode and a drain electrode formed on said channel layer and symmetrically arranged against said gate electrode.

Claim 9

A device according to claim 6, wherein said collector, base, and emitter layers of said negative differential resistance element have the same conductivity type, and said negative differential transistor further comprises a collector barrier layer formed between said base and collector layers and having a band gap larger than those of said base and collector layers.

Claim 10

A device according to claim 6, wherein said collector and emitter layers of said negative differential resistance element have one conductivity type, said base layer has another conductivity type, opposite to that one conductivity type, and a PN junction is formed at the interface of said base and collector layer.

Claim 11

A device according to claim 6, wherein said emitter layer of said negative differential resistance element is provided with a stopper layer to prevent etching therewithin, and said gate electrode of said field effect transistor is formed to come into contact with said stopper layer.