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US5161114A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing a reticule

Assignee: Fujitsu VLSI Ltd
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Filing: 1990-03-13
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Granted: 1992-11-03
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Expires: 2010-03-13
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Abstract

Abstract In a method of manufacturing reticules of the present invention, device pattern data is generated by shrinking (or magnifying) the pregenerated device pattern by calculation with determined shrinking ratio and meanwhile it is combined with alignment mark data of pregenerated alignment mark pattern in the determined shape and size and the combined data is then converted to the exposure data. As a result, in generating the reticule by shrinking the device pattern, a reticule having no positional displacement between the device pattern and alignment mark pattern can be easily generated in high efficiency.

Inventors

  • 👤 Shin Akiyama

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 00:01
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70483; G03F7/70491; G03F7/705; G03F1/00; G03F1/68; G03F9/00; G03F9/70

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 117 words
A method of manufacturing a reticule employed in manufacturing a semiconductor device using a computer, comprising the steps of: generating first device pattern data; storing said first pattern data in first data storing means; reading said first device pattern data stored in said first data storing means; shrinking a size of said first device pattern data so as to generate second pattern data; generating alignment mark pattern data which has a predetermined shape and a predetermined size; combining in the computer said second device pattern data and said alignment mark pattern data so as to produce combined pattern data; and operating an exposure apparatus to be employed in manufacturing the reticule based on said combined pattern data.
Claim 2
Independent Claim 117 words
A method of manufacturing a reticule employed in manufacturing a semiconductor device using a computer, comprising the steps of: generating first device pattern data; storing said first pattern data in first data storing means; reading said first device pattern data stored in said first data storing means; shrinking a size of said first device pattern data so as to generate second pattern data; generating alignment mark pattern data which has a predetermined shape and a predetermined size; combining in the computer said second device pattern data and said alignment mark pattern data so as to produce combined pattern data; and operating an exposure apparatus to be employed in manufacturing the reticule based on said combined pattern data.
Claim 3
Dependent Claim 34 words
A method recited in claim 1, wherein said step of generating alignment mark pattern data is carried out by reading alignment mark pattern data prepared and stored in second data storing means in advance.
Claim 4
Independent Claim 119 words
A method of manufacturing a reticule employed in manufacturing a semiconductor device using a computer, comprising the steps of: generating first device pattern data; storing said first device pattern data in first data storing means; reading said first device pattern data stored in said first data storing means; expanding a size of said first device pattern data so as to generate second device pattern data; generating alignment mark pattern data which has a predetermined shape and a predetermined size; combining in the computer said second device pattern data and said alignment mark pattern data so as to produce combined pattern data; and operating an exposure apparatus to be employed in manufacturing the reticule based on said combined pattern data.
Claim 5
Independent Claim 119 words
A method of manufacturing a reticule employed in manufacturing a semiconductor device using a computer, comprising the steps of: generating first device pattern data; storing said first device pattern data in first data storing means; reading said first device pattern data stored in said first data storing means; expanding a size of said first device pattern data so as to generate second device pattern data; generating alignment mark pattern data which has a predetermined shape and a predetermined size; combining in the computer said second device pattern data and said alignment mark pattern data so as to produce combined pattern data; and operating an exposure apparatus to be employed in manufacturing the reticule based on said combined pattern data.
Claim 6
Dependent Claim 35 words
A method as recited in claim 3, wherein said step of generating alignment mark pattern data is carried out by reading alignment mark pattern data prepared and stored in second data storing means in advance.

References Cited (Backward Citations)

US3955072A Cited
US4103998A Cited
US4777641A Cited
US4878177A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-11-03 1996-05-04 1996-11-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-11-03 2000-05-04 2000-11-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-11-03 2004-05-04 2004-11-03 $7700.00 Window Closed / Lapsed

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