Semiconductor integrated circuit with shield electrodes for protecting the interconnection lines from undesirable radiation

Claim 2

A semiconductor integrated circuit, comprising: a semiconductor chip; a plurality of circuit blocks formed on said semiconductor chip, said circuit blocks each having semiconductor circuit elements; distribution line means for distributing power to said semiconductor circuit elements and for grounding said circuit blocks, said distribution line means including first and second power supply lines for distributing said power and which are in electrical contact with each other, said distribution line means including first and second ground lines for grounding said circuit blocks and which are in electrical contact with each other; and inter-block line means for electrically interconnecting said circuit blocks and being electrically insulated from said distribution line means, said inter-block line means including inter-block lines, said first power supply lines and said first ground lines being cut at desired locations for enabling said inter-block lines to pass therethrough, continuity of power distribution through said first power supply lines being maintained by said second power supply lines because of said electrical contact therebetween, continuity of grounding through said first ground lines being maintained by said second ground lines because of said electrical contact therebetween.

Claim 3

A circuit as in claim 1, wherein said circuit blocks each performs a different function.

Claim 4

A semiconductor integrated circuit, comprising: a semiconductor chip; a plurality of circuit blocks formed on said semiconductor chip, said circuit blocks each having semiconductor circuit elements; distribution line means for distributing power to said semiconductor circuit elements and for grounding said circuit blocks, said distribution line means including first, second and third power supply lines for distributing said power, said second power supply lines being in electrical contact with and between said first and third power supply lines, said distribution line means including first, second and third ground lines for grounding said circuit blocks, said second ground lines being in electrical contact with and between said first and third ground lines; and inter-block line means for electrically interconnecting said circuit blocks and being electrically insulated from said distribution line means, said inter-block line means including first and second inter-block lines, said first power supply lines and said first ground lines being on a first insulating layer and being cut at desired locations for enabling said first inter-block lines to pass therethrough, said second power supply lines and said second ground lines being on a second insulating layer and being cut at desired locations for enabling said second inter-block lines to pass therethrough, whereby bi-level crossing of said inter-block lines is attainable via said cuts at said desired locations.

Claim 5

A semiconductor integrated circuit, comprising: a semiconductor chip; a plurality of circuit blocks formed on said semiconductor chip, said circuit blocks each having semiconductor circuit elements; distribution line means for distributing power to said semiconductor circuit elements and for grounding said circuit blocks, said distribution line means including first, second and third power supply lines for distributing said power, said second power supply lines being in electrical contact with and between said first and third power supply lines, said distribution line means including first, second and third ground lines for grounding said circuit blocks, said second ground lines being in electrical contact with and between said first and third ground lines; and inter-block line means for electrically interconnecting said circuit blocks and being electrically insulated from said distribution line means, said inter-block line means including first and second inter-block lines, said first power supply lines and said first ground lines being on a first insulating layer and being cut at desired locations for enabling said first inter-block lines to pass therethrough, said second power supply lines and said second ground lines being on a second insulating layer and being cut at desired locations for enabling said second inter-block lines to pass therethrough, whereby bi-level crossing of said inter-block lines is attainable via said cuts at said desired locations.

Claim 6

A circuit as in claim 3, wherein said circuit blocks each performs a different function.