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Multi-channel plasma discharge endpoint detection method

Assignee: Applied Materials Inc
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Filing: 1990-05-24
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Granted: 1992-11-03
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Expires: 2010-05-24
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Abstract

Abstract A plasma discharge endpoint detection system and method characterized by a plurality of individual data channels which are combined to create a composite function representative of the conditions within a plasma etch chamber. Preferably, a number of the channels are representative of spectral components within the optical spectrum caused by the plasma discharge within the etch chamber. A multi-channel sensor assembly is provided for this purpose including a number of light-guides for guiding light from the plasma discharge to filters and photosensors associated with the multiple channels. Other channels can detect various conditions such as the D.C. bias on a cathode within the plasma etch chamber. The various channels are digitized, weighted and summed within a digital computer to create the composite function from which endpoint and other conditions within the chamber can be determined. The method is characterized by the weighting and summing of a plurality of data channels carrying information about the conditions within a plasma etch chamber to develop a composite function and then analyzing the composite function to determine endpoint and other conditions. The endpoint detection method compares the slope of the composite function to a predetermined maximum slope value and identifies endpoint when the maximum slope value is exceeded a predetermined number of times.

Inventors

  • 👤 David Cheng

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 07:37
CPC Classifications
C; C23; C23F; C23F4/00; H; H01; H01J; H01J37/00; H01J37/32; H01J37/32917; H01J37/32935

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 69 words
A method of monitoring a plasma process which comprises (a) optically monitoring a plurality of preselected emission spectra developed by a plasma in a plasma chamber, (b) amplifying and digitizing a plurality of spectra signals of said spectra, (c) weighting and summing said signals to form a composite function, and (d) comparing the slope of the composite function to a predetermined value to determine preselected conditions within said plasma.
Claim 2
Independent Claim 69 words
A method of monitoring a plasma process which comprises (a) optically monitoring a plurality of preselected emission spectra developed by a plasma in a plasma chamber, (b) amplifying and digitizing a plurality of spectra signals of said spectra, (c) weighting and summing said signals to form a composite function, and (d) comparing the slope of the composite function to a predetermined value to determine preselected conditions within said plasma.
Claim 3
Dependent Claim 21 words
A method according to claim 1 wherein a D.C. bias channel of a cathode within said plasma chamber is also monitored.
Claim 4
Dependent Claim 24 words
A method according to claim 1 wherein the step of forming a composite includes forming a weighted sum of said plurality of spectral components.
Claim 5
Dependent Claim 24 words
A method according to claim 1 wherein said composite of said plurality of parameters includes a weighted sum of at least four spectral components.
Claim 6
Dependent Claim 34 words
A method according to claim 1 wherein said step of comparing is repeated a plurality of times and wherein endpoint is determined after a number of consecutive comparisons indicate endpoint conditions in said plasma.
Claim 7
Independent Claim 58 words
A method of monitoring the endpoint of a plasma etch process in a plasma etch system which comprises (a) collecting a plurality of digital emission signals from said plasma, (b) calculating a composite emission curve from said signals by weighting and summing said signals, and (c) determining when the slope of said composite curve exceeds a predetermined slope.
Claim 8
Independent Claim 58 words
A method of monitoring the endpoint of a plasma etch process in a plasma etch system which comprises (a) collecting a plurality of digital emission signals from said plasma, (b) calculating a composite emission curve from said signals by weighting and summing said signals, and (c) determining when the slope of said composite curve exceeds a predetermined slope.
Claim 9
Dependent Claim 23 words
A method according to claim 6 wherein said signals are obtained from a plurality of portions of an optical spectrum of said plasma.
Claim 10
Dependent Claim 35 words
A method according to claim 6 further comprising monitoring the D.C. bias of a cathode within said plasma etch system; and forming said composite using both said plurality of spectral components and said D.C. bias.
Claim 11
Dependent Claim 23 words
A method according to claim 6 wherein said step of calculating the composite further includes removing the background level from said weighted sum.
Claim 12
Dependent Claim 21 words
A method according to claim 9 wherein said step of calculating the composite further includes filtering undesired components from said composite.
Claim 13
Dependent Claim 49 words
A method according to claim 9 wherein said step of calculating the composite includes; summing said time related sum function over time to develop a time related background function; and subtracting said time related background function from said time related sum function to develop a time related offset function.
Claim 14
Dependent Claim 35 words
A method according to claim 11 wherein said step of calculating the composite includes; performing a notch filter function on said time related offset function to remove undesired components from said time related offset function.

References Cited (Backward Citations)

US4312732A Cited
US4207137A Cited
JPS5941475A Cited
US4609426A Cited
US4695700A Cited
US4615761A Cited
US4720628A Cited
EP0320425A2 Cited
US5045149A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-11-03 1996-05-04 1996-11-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-11-03 2000-05-04 2000-11-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-11-03 2004-05-04 2004-11-03 $7700.00 Window Closed / Lapsed

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