Device for encapsulating electronic components

Claim 3

A device as claimed in claim 1 wherein the locking means comprises a locking bar which is slidable relative to the frame between said idle position and said locking position for placing the plungers in said positions and lever means coupled to the frame for driving the plungers in response to displacement of the frame.

Claim 4

A device as claimed in claim 2 wherein the spring means includes a plurality of springs each corresponding to a different plunger, the lever means comprising a plurality of levers equal to the number of said plungers, each lever being coupled to and corresponding to a different spring and being rotatably fixed with one end on a joint pivot shaft which is mounted to the frame and the other lever end is loaded by a corresponding one of said springs, said levers each having a central portion coupled to and for operating an associated plunger, the locking bar being coupled to the free ends of the levers for placing said plungers in said positions.

Claim 5

A device as claimed in claim 3, including a sliding lock positioned between each lever and the locking bar.

Claim 6

A device as claimed in claim 4, wherein the levers are firmly pressed against a stop block by means of the sliding locks in the locking position of the locking bar, and pressed resililently against the stop block under the load of the associated spring in the idle position of the locking bar.

Claim 7

A device as claimed in claim 4 wherein each sliding lock is loaded by one of said springs and pressed against the associated lever by that one spring.

Claim 8

A device as claimed in claim 5 wherein each sliding lock is loaded by one of said springs and pressed against the associated lever by that one spring.

Claim 9

Encapsulation apparatus for electronic components comprising: a mold comprising upper and lower mold parts having an ejection state and a mold state, at least one of which parts including a plurality of cavities each for encapsulating a component with a synthetic resin in a mold cycle; a plurality of plunger pots secured to at least the other of said parts, each pot for receiving solidified resin, said pots each being coupled in at least the mold state via a corresponding injection gate to a corresponding cavity; means for heating the mold for melting said received solidified resin; a frame reciprocally movable relative to at least said other of said parts; a plurality of plungers coupled to the frame, each plunger corresponding to and engaged with a different plunger pot for displacement in a first direction relative to said engaged pot for applying pressure to said received resin to force the molten resin into the corresponding cavity via said corresponding gate; drive means for displacement of the frame and plungers relative to said at least one part; and locking means displaceable in a second direction transverse to first direction and having a locking position and an idle position for locking the plungers relative to the frame in the locking position in one portion of a mold cycle and for resiliently loading said plungers relative to said frame in a second portion of the mold cycle.

Claim 10

Encapsulation apparatus for electronic components comprising: a mold comprising upper and lower mold parts having an ejection state and a mold state, at least one of which parts including a plurality of cavities each for encapsulating a component with a synthetic resin in a mold cycle; a plurality of plunger pots secured to at least the other of said parts, each pot for receiving solidified resin, said pots each being coupled in at least the mold state via a corresponding injection gate to a corresponding cavity; means for heating the mold for melting said received solidified resin; a frame reciprocally movable relative to at least said other of said parts; a plurality of plungers coupled to the frame, each plunger corresponding to and engaged with a different plunger pot for displacement in a first direction relative to said engaged pot for applying pressure to said received resin to force the molten resin into the corresponding cavity via said corresponding gate; drive means for displacement of the frame and plungers relative to said at least one part; and locking means displaceable in a second direction transverse to first direction and having a locking position and an idle position for locking the plungers relative to the frame in the locking position in one portion of a mold cycle and for resiliently loading said plungers relative to said frame in a second portion of the mold cycle.

Claim 11

The apparatus of claim 8 wherein said drive means includes means for displacing the frame in the one portion of the cycle to a first mold position and for holding the frame in said first position during said second portion of the cycle.

Claim 12

The apparatus of claim 8 wherein said locking means comprises a movably secured bar having recesses and elevations, said locking means including means for causing said elevations to fixedly engage said plungers during said one portion of the cycle and for causing said recesses to releasably engage said plungers in said second portion of said cycle and resilient means coupled to the frame for resiliently engaging the plungers in said second portion of the cycle.

Claim 13

The apparatus of claim 10 wherein said drive means includes lever means coupled to said plungers and to said frame for displacing said plungers in response to displacement of said frame, said resilient means including spring means coupled to said lever means and said frame and responsive to the engagement of said recesses with said plungers to form said resilient engagement.