US5155578A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages
Assignee: Texas Instruments Inc
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Filing: 1991-04-26
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Granted: 1992-10-13
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Expires: 2011-04-26
Abstract
Abstract The degree of wire sweep and wire clearance over the buss bars in the 16 Mega Bit LOC package is found to be dependent on the angle of the bond wires. A positive wire angle range of 5 to 15 degrees is recommended for minimum wire sweep and maximum wire clearance over the buss bars. This is so because they offer the least resistance to the flow of the mold compound during transfer molding. A staggered gating system ensures that the wire angles in all cavities are positive with respect to the gate. This invention is also applicable to conventional packages.
Inventors
- 👤 Thiam B. Lim
- 👤 Soon C. Lian
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 07:24
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W74/00; H10W74/01; H10W74/016; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
119 words
A semiconductor device including a circuit chip having bond wires that extend in part over an electrically active portion of the device, wherein the bond pads on the chip are located along a linear path at the center of the chip, and arranged in relation to the corresponding leadframe fingers such that the bond wires connecting the respective pads and fingers span the active portion at an angle of 5 to 15 degrees, measured in the chip surface with respect to a line in said surface perpendicular to the path along which the bonding pads are located, and wherein the bond wire lengths are selected to provide clearance over the chip of at least two times the wire diameter.
Claim 2
Dependent Claim
119 words
A semiconductor device including a circuit chip having bond wires that extend in part over an electrically active portion of the device, wherein the bond pads on the chip are located along a linear path at the center of the chip, and arranged in relation to the corresponding leadframe fingers such that the bond wires connecting the respective pads and fingers span the active portion at an angle of 5 to 15 degrees, measured in the chip surface with respect to a line in said surface perpendicular to the path along which the bonding pads are located, and wherein the bond wire lengths are selected to provide clearance over the chip of at least two times the wire diameter.
Claim 3
Dependent Claim
16 words
A device as in claim 1 wherein said bond wires are comprised of gold and beryllium.
Claim 4
Dependent Claim
11 words
A device as in claim 1 wherein said device is resin-encapsulated.
References Cited (Backward Citations)
US3611061A
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US4618879A
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US4768070A
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US4890153A
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US4959706A
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US4916506A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-13 | 1996-04-13 | 1996-10-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-13 | 2000-04-13 | 2000-10-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-13 | 2004-04-13 | 2004-10-13 | $7700.00 | Window Closed / Lapsed |