Patent US5150198A successfully refreshed from Google Patents.
US5150198A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Radiator for semiconductor chip
Assignee: Nippon Steel Corp
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Filing: 1991-03-14
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Granted: 1992-09-22
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Expires: 2011-03-14
Abstract
Abstract A radiator for a semiconductor chip is provided which is made from a material having good heat conductivity. The radiator is plate shaped and is attached to the semiconductor chip. The radiator has at least one projection on the outer peripheral edge thereof so as to extend outwardly, laterally beyond the outer periphery of the semiconductor chip. The semiconductor chip and the radiator are sealed within plastic so that the projection of the radiator extend outwardly from the plastic encapsulation. Heat from the semiconductor chip is released from the plastic encapsulation via the projection(s) of the radiator. The radiator can be formed from a material which also has good electrical conductivity to electrically protect the semiconductor chip.
Inventors
- 👤 Naoharu Ohikata
- 👤 Toshio Yamamoto
- 👤 Masashi Konda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/461; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/701; H10W72/071; H10W72/077
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
85 words
A radiator for a semiconductor chip comprising: a substantially planar plate element formed from a heat-conductive material and having a face to be attached to a face of the semiconductor chip, said plate element having an outer peripheral edge; and at least one projecting portion extending outwardly from the outer periphery of said plate element so as to extend outwardly, laterally beyond an outer periphery of the semiconductor chip, said projecting portion being located at a position to avoid outer leads of the semiconductor chip.
Claim 2
Dependent Claim
85 words
A radiator for a semiconductor chip comprising: a substantially planar plate element formed from a heat-conductive material and having a face to be attached to a face of the semiconductor chip, said plate element having an outer peripheral edge; and at least one projecting portion extending outwardly from the outer periphery of said plate element so as to extend outwardly, laterally beyond an outer periphery of the semiconductor chip, said projecting portion being located at a position to avoid outer leads of the semiconductor chip.
Claim 3
Dependent Claim
32 words
A radiator for a semiconductor chip according to claim 1, wherein said plate element is formed from an electroconductive material and is electrically connected to the back surface of the semiconductor chip.
Claim 4
Dependent Claim
40 words
A radiator for a semiconductor chip according to claim 1, wherein said plate element is square-shaped so as to correspond with the shape of the semiconductor chip and said projecting portion is formed at a corner of said plate element.
Claim 5
Dependent Claim
92 words
A semiconductor package comprising: a plastic encapsulation in which a semiconductor chip and a radiator attached to said semiconductor chip are sealed within plastic, said radiator including a plate element formed from a heat conductive material, said radiator further comprising at least one projecting portion extending outwardly from an outer periphery of said plate element so as to extend outwardly, laterally beyond an outer periphery of the semiconductor chip, and said projecting portion being located at a position to avoid outer leads of said semiconductor chip and exposed beyond said plastic encapsulation.
Claim 6
Dependent Claim
92 words
A semiconductor package comprising: a plastic encapsulation in which a semiconductor chip and a radiator attached to said semiconductor chip are sealed within plastic, said radiator including a plate element formed from a heat conductive material, said radiator further comprising at least one projecting portion extending outwardly from an outer periphery of said plate element so as to extend outwardly, laterally beyond an outer periphery of the semiconductor chip, and said projecting portion being located at a position to avoid outer leads of said semiconductor chip and exposed beyond said plastic encapsulation.
Claim 7
Dependent Claim
29 words
A semiconductor package according to claim 4, wherein said projecting portion is formed so as to avoid passages for molten plastic in a mold for forming said plastic encapsulation.
Claim 8
Dependent Claim
37 words
A semiconductor package according to claim 4, wherein said plate element is square-shaped so as to correspond to the shape of the semiconductor chip and said projecting portion is formed at a corner of said plate element.
Claim 9
Dependent Claim
68 words
A radiator attached to a semiconductor chip, the combination comprising: a radiator plate formed from a heat conductive material, for radiating heat from said semiconductor chip attached thereto; and a first projection member provided on said radiation plate so as to extend outwardly, laterally beyond a periphery of said semiconductor chip, said first projection member being located at a position to avoid outer leads of said semiconductor chip.
Claim 10
Dependent Claim
68 words
A radiator attached to a semiconductor chip, the combination comprising: a radiator plate formed from a heat conductive material, for radiating heat from said semiconductor chip attached thereto; and a first projection member provided on said radiation plate so as to extend outwardly, laterally beyond a periphery of said semiconductor chip, said first projection member being located at a position to avoid outer leads of said semiconductor chip.
Claim 11
Dependent Claim
50 words
The combination according to claim 7, wherein said radiator further comprises a second projection member formed on said radiation plate so as to extend outwardly, laterally beyond the periphery of said semiconductor chip, said second projection member being located at a position to avoid outer leads of said semiconductor chip.
Claim 12
Dependent Claim
24 words
The combination according to claim 8, wherein said first and second projection members are each formed from the same material as said radiation plate.
Claim 13
Dependent Claim
28 words
The combination according to claim 7, wherein said radiation plate is formed from an electroconductive material, and is electrically connected to the back surface of said semiconductor chip.
Claim 14
Dependent Claim
38 words
The combination according to claim 7, wherein said radiation plate is square shaped so as to correspond to the shape of the semiconductor chip and said first projection member is formed at a corner of said radiation plate.
Claim 15
Dependent Claim
39 words
The combination according to claim 8, wherein said radiation plate is square-shaped so as to correspond to the shape of said semiconductor chip and said first and second projection members are respectively formed at corners of said radiation plate.
Claim 16
Dependent Claim
66 words
A plastic sealed semiconductor chip package, comprising: a semiconductor chip; a radiation plate formed from a heat conductive material, for radiating heat from said semiconductor chip attached thereto; and a projection member provided on said radiation plate so as to extend outwardly, laterally beyond a periphery of said semiconductor chip, said projection member being located at a position to avoid outer leads of said semiconductor chip.
Claim 17
Dependent Claim
66 words
A plastic sealed semiconductor chip package, comprising: a semiconductor chip; a radiation plate formed from a heat conductive material, for radiating heat from said semiconductor chip attached thereto; and a projection member provided on said radiation plate so as to extend outwardly, laterally beyond a periphery of said semiconductor chip, said projection member being located at a position to avoid outer leads of said semiconductor chip.
Claim 18
Dependent Claim
24 words
A plastic sealed semiconductor chip package according to claim 13, wherein said projection member is formed from the same material as said radiation plate.
Claim 19
Dependent Claim
38 words
A plastic sealed semiconductor chip package according to claim 13, wherein said projection member is formed so as to avoid passages for molten plastic in a mold for sealing said semiconductor chip and said radiation plate in plastic.
Claim 20
Dependent Claim
40 words
A plastic sealed semiconductor chip package according to claim 13, wherein said radiation plate is square-shaped so as to correspond with the shape of the semiconductor chip and said projection member is formed at a corner of said radiation plate.
Claim 21
Dependent Claim
104 words
A semiconductor package mounted on a printed board, comprising: a plastic encapsulation in which a semiconductor chip and a radiator attached to said semiconductor chip are sealed within plastic, said radiator including a plate element formed from a heat-conductive material, said radiator further comprising at least one projecting portion extending outwardly from the outer periphery of said plate element so as to extend outwardly, laterally beyond an outer periphery of said semiconductor chip, said projecting portion being located at a position to avoid outer leads of said semiconductor chip, exposed beyond said plastic encapsulation and connected to a ground terminal of the printed board.
Claim 22
Dependent Claim
104 words
A semiconductor package mounted on a printed board, comprising: a plastic encapsulation in which a semiconductor chip and a radiator attached to said semiconductor chip are sealed within plastic, said radiator including a plate element formed from a heat-conductive material, said radiator further comprising at least one projecting portion extending outwardly from the outer periphery of said plate element so as to extend outwardly, laterally beyond an outer periphery of said semiconductor chip, said projecting portion being located at a position to avoid outer leads of said semiconductor chip, exposed beyond said plastic encapsulation and connected to a ground terminal of the printed board.
Claim 23
Dependent Claim
28 words
A semiconductor package according to claim 17, wherein said plate element is formed from an electroconductive material and electrically connected to the back surface of said semiconductor chip.
Claim 24
Dependent Claim
29 words
A semiconductor package according to claim 17, wherein said projecting portion is formed so as to avoid passages for molten plastic in a mold for forming said plastic encapsulation.
Claim 25
Dependent Claim
37 words
A semiconductor package according to claim 17, wherein said plate element is square-shaped so as to correspond with the shape of said semiconductor chip and said projecting portion is formed at a corner of said plate element.
Claim 26
Dependent Claim
80 words
A plastic sealed semiconductor chip package mounted on a printed board, comprising: a semiconductor chip; a radiation plate formed from a heat-conductive material, for radiating heat from said semiconductor chip attached thereto; and a projection member provided on said radiation plate so as to extend outwardly, laterally beyond a periphery of said semiconductor chip, said projection member being located at a position to avoid outer leads of said semiconductor chip and connected to a ground terminal of the printed board.
Claim 27
Dependent Claim
80 words
A plastic sealed semiconductor chip package mounted on a printed board, comprising: a semiconductor chip; a radiation plate formed from a heat-conductive material, for radiating heat from said semiconductor chip attached thereto; and a projection member provided on said radiation plate so as to extend outwardly, laterally beyond a periphery of said semiconductor chip, said projection member being located at a position to avoid outer leads of said semiconductor chip and connected to a ground terminal of the printed board.
Claim 28
Dependent Claim
24 words
A plastic sealed semiconductor chip package according to claim 21, wherein said projection member is formed from the same material as said radiatiion plate.
Claim 29
Dependent Claim
40 words
A plastic sealed semiconductor chip package according to claim 21, wherein said radiation plate and said projection member are each formed from an electroconductive material and said radiation plate is electrically connected to the back surface of said semiconductor chip.
Claim 30
Dependent Claim
38 words
A plastic sealed semiconductor chip package according to claim 21, wherein said projection member is formed so as to avoid passages for molten plastic of a mold for sealing said semiconductor chip and said radiation plate in plastic.
Claim 31
Dependent Claim
40 words
A plastic sealed semiconductor chip package according to claim 21, wherein said radiation plate is square-shaped so as to correspond with the shape of said semiconductor chip and said projection member is formed at a corner of said radiation plate.
References Cited (Backward Citations)
US4943844A
Cited
US4953173A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-22 | 1996-03-23 | 1996-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-22 | 2000-03-23 | 2000-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-22 | 2004-03-23 | 2004-09-22 | $7700.00 | Window Closed / Lapsed |