Patent US5141455A successfully refreshed from Google Patents.
US5141455A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting of electronic components on substrates
Assignee: Molex LLC
•
Filing: 1991-04-08
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Granted: 1992-08-25
•
Expires: 2011-04-08
Abstract
Abstract A method for mounting electronic components, such as capacitors and the like, to a flat flexible insulating substrate having conductive material thereon. In one form of the invention, an electronic component is attached to a given area of the substrate with one conductive side of the electronic component in electrical connection with the conductive material on the substrate. A slot is formed in the substrate substantially about the electronic component but less than 360° thereabout to define a tongue, including the electronic component, and an integral hinge portion of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360° slot is formed in the substrate. One conductive side of the electronic component is in electrical connection with the conductive material on the substrate within the closed slot, and the other conductive side of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal is electrically connected to the conductive material on the substrate inside the closed slot.
Inventors
- 👤 Timothy R. Ponn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:35
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/189; H05K3/00; H01; H01R; H01R13/00; H01R13/66; H01R13/719; H05K3/30; H05K3/32; H05K3/325; H05K3/326; H05K1/182; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09081; H05K2201/10; H05K2201/10007; H05K2201/10189; H05K2201/10431; H05K2201/10439; H05K2201/10492; H05K2201/10507; H05K2201/1053; H05K2201/1059; H05K2201/10613; H05K2201/10621; H05K2201/10636; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49147; Y10T29/49151; Y10T29/49153
Claims Analysis
Total Claims: 53
Claim 1
Independent Claim
134 words
A method for mounting electronic components such as capacitors having first and second conductive sides, to a flat flexible insulating substrate having conductive material thereon, comprising the steps of: attaching an electronic component to a given area of the substrate with the first conductive side of the component in electrical connection with said conductive material; forming a slot in the substrate substantially about the electronic component but less than 360° thereabout to define an integral hinge portion of the substrate; and bending the area of the substrate within said slot about the integral hinge portion to move said given area of the substrate out of its flat plane and thereby move the electronic component therewith into a desired position for connection of the second conductive side of the electronic component to an appropriate terminal.
Claim 2
Independent Claim
134 words
A method for mounting electronic components such as capacitors having first and second conductive sides, to a flat flexible insulating substrate having conductive material thereon, comprising the steps of: attaching an electronic component to a given area of the substrate with the first conductive side of the component in electrical connection with said conductive material; forming a slot in the substrate substantially about the electronic component but less than 360° thereabout to define an integral hinge portion of the substrate; and bending the area of the substrate within said slot about the integral hinge portion to move said given area of the substrate out of its flat plane and thereby move the electronic component therewith into a desired position for connection of the second conductive side of the electronic component to an appropriate terminal.
Claim 3
Dependent Claim
34 words
The method of claim 1 wherein the electronic component is attached to the substrate by forming a cut in the substrate and inserting said one conductive side of the electronic component into the cut.
Claim 4
Dependent Claim
25 words
The method of claim 2, including applying a conductive adhesive between the conductive material on the substrate and the conductive side of the electronic component.
Claim 5
Dependent Claim
34 words
The method of claim 2, including forming said cut with an aperture having a width less than the wide of the electronic component and at least one slit in an edge of the aperture.
Claim 6
Dependent Claim
25 words
The method of claim 1, including applying a conductive adhesive between the conductive material on the substrate and the conductive side of the electronic component.
Claim 7
Dependent Claim
33 words
The method of claim 5 wherein said substrate is a laminate including an insulating film and a conductive film, and said conductive adhesive is applied in a local area about the electronic component.
Claim 8
Dependent Claim
44 words
The method of claim 1, including inserting an appropriate terminal through an opening in the substrate formed by moving said given area thereof out of the plane of the substrate, and electrically connecting the terminal to said opposite conductive end of the electronic component.
Claim 9
Dependent Claim
23 words
The method of claim 8, including connecting the terminal to the opposite end of the electronic component by means of a conductive adhesive.
Claim 10
Independent Claim
78 words
A method for mounting electronic component, such as capacitors having first and second conductive surfaces, to a flat insulating substrate, comprising the steps of: attaching an electronic component to the insulating substrate with the first conductive side of the component generally in the plane of the substrate; and applying a conductive adhesive over a substantial area of the insulating substrate to provide a ground plane thereon in electrical connection with the first conductive side of the electronic component.
Claim 11
Independent Claim
78 words
A method for mounting electronic component, such as capacitors having first and second conductive surfaces, to a flat insulating substrate, comprising the steps of: attaching an electronic component to the insulating substrate with the first conductive side of the component generally in the plane of the substrate; and applying a conductive adhesive over a substantial area of the insulating substrate to provide a ground plane thereon in electrical connection with the first conductive side of the electronic component.
Claim 12
Dependent Claim
34 words
The method of claim 9 wherein the electronic component is attached to the substrate by forming a cut in the substrate and inserting said one conductive side of the electronic component into the cut.
Claim 13
Dependent Claim
34 words
The method of claim 10, including forming said cut with an aperture having a width less than the width of the electronic component and at least one slit in an edge of the aperture.
Claim 14
Dependent Claim
30 words
The method of claim 9, including inserting an appropriate terminal through an opening in the substrate and electrically connecting the terminal to an opposite conductive end of the electronic component.
Claim 15
Dependent Claim
23 words
The method of claim 12, including connecting the terminal to the opposite end of the electronic component by means of a conductive adhesive.
Claim 16
Dependent Claim
13 words
The method of claim 9 wherein said conductive material is applied by spraying.
Claim 17
Independent Claim
96 words
A method for mounting electronic components, such as capacitors having first and second conductive sides, to a flat flexible insulating substrate having conductive material thereon, comprising the steps of: forming a tongue on the flexible substrate and defining an integral hinge portion of the substrate about which the tongue can be bent; attaching one conductive side of the electronic component to said tongue; and bending said tongue about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith to one side of the substrate.
Claim 18
Independent Claim
96 words
A method for mounting electronic components, such as capacitors having first and second conductive sides, to a flat flexible insulating substrate having conductive material thereon, comprising the steps of: forming a tongue on the flexible substrate and defining an integral hinge portion of the substrate about which the tongue can be bent; attaching one conductive side of the electronic component to said tongue; and bending said tongue about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith to one side of the substrate.
Claim 19
Independent Claim
39 words
The method of claim of 15 wherein said one conductive side of the electronic component is attached to the tongue by applying a conductive adhesive between the conductive material thereon and the one conductive side of the electronic component.
Claim 20
Dependent Claim
34 words
The method of claim 15 wherein the electronic component is attached to the tongue by forming a cut in the tongue and inserting said one conductive side of the electronic component into the cut.
Claim 21
Dependent Claim
34 words
The method of claim 17, including forming said cut with an aperture having a width less than the width of the electronic component and at least one slit in an edge of the aperture.
Claim 22
Dependent Claim
44 words
The method of claim 15 wherein said substrate, including said tongue, is a laminate having an insulating film and a conductive film, and the electronic component is attached to the tongue by applying a conductive adhesive in a local area about the electronic component.
Claim 23
Dependent Claim
35 words
The method of claim 15 wherein said tongue is formed by a slot in the substrate substantially about the electronic component but less than 360° thereabout to define said integral hinge portion of the substrate.
Claim 24
Dependent Claim
42 words
The method of claim 20, including inserting an appropriate terminal through an opening in the substrate formed by moving the tongue out of the plane of the substrate, and electrically connecting the terminal to the second conductive end of the electronic component.
Claim 25
Dependent Claim
25 words
The method of claim 15, including the step of attaching the substrate to a face of a complementary connector to define a ground plane therefor.
Claim 26
Dependent Claim
86 words
An electrical device, comprising: a flat flexible insulating substrate having conductive material thereon and a tongue integral therewith and bent out of the flat plane thereof; and an electronic component attached to said tongue and having a conductive side electrically connected to said conductive material wherein said tongue includes an aperture into which the conductive side of the electronic component is inserted, the aperture having a width less than the width of the electronic component and at least one slit in an edge of the aperture.
Claim 27
Dependent Claim
86 words
An electrical device, comprising: a flat flexible insulating substrate having conductive material thereon and a tongue integral therewith and bent out of the flat plane thereof; and an electronic component attached to said tongue and having a conductive side electrically connected to said conductive material wherein said tongue includes an aperture into which the conductive side of the electronic component is inserted, the aperture having a width less than the width of the electronic component and at least one slit in an edge of the aperture.
Claim 28
Dependent Claim
43 words
The electrical device of claim 23 wherein said substrate, including said tongue, is a laminate having an insulating film and a conductive film, and including conductive adhesive applied in a local area about the electronic component for attaching the component to the tongue.
Claim 29
Dependent Claim
31 words
The electrical device of claim 23 wherein said conductive material on the substrate covers a substantial area thereof, and the electronic component is attached to the conductive material by conductive adhesive.
Claim 30
Dependent Claim
29 words
In combination with the electrical device of claim 23, an electrical connector housing having said substrate attached to a generally flat face thereof to define a ground plane therefor.
Claim 31
Dependent Claim
53 words
The combination of claim 26 wherein said tongue is formed by a slot in the substrate substantially about the electronic component but less than 360° thereabout to define an integral hinge portion of the substrate, the tongue being bent out of the plane of the substrate to define an opening through the substrate.
Claim 32
Dependent Claim
27 words
The combination of claim 27, including a terminal extending through the opening in the substrate and electrically connected to an opposite conductive side of the electronic component.
Claim 33
Independent Claim
97 words
A method for mounting electronic components, such as capacitors having two conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of: attaching an electronic component to the substrate with one conductive side of the component in electrical connection with said conductive material and the other conductive side of the component conductively isolated form the one side of the component and the conductive material to which the component is attached; and inserting an electrical terminal through aperture means in the substrate for electrical connection to said other conductive side of the electronic component.
Claim 34
Independent Claim
97 words
A method for mounting electronic components, such as capacitors having two conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of: attaching an electronic component to the substrate with one conductive side of the component in electrical connection with said conductive material and the other conductive side of the component conductively isolated form the one side of the component and the conductive material to which the component is attached; and inserting an electrical terminal through aperture means in the substrate for electrical connection to said other conductive side of the electronic component.
Claim 35
Dependent Claim
29 words
The method of claim 29 wherein said one conductive side of the electronic component is connected to the conductive material of the substrate by applying a conductive adhesive therebetween.
Claim 36
Dependent Claim
34 words
The method of claim 30 wherein the electronic component is attached to the substrate by forming a cut in the substrate and inserting said one conductive side of the electronic component into the cut.
Claim 37
Dependent Claim
25 words
The method of claim 31, including applying a conductive adhesive between the conductive material on the substrate and the conductive side of the electronic component.
Claim 38
Dependent Claim
34 words
The method of claim 31, including forming said cut with an aperture having a width less than the width of the electronic component and at least one slit in an edge of the aperture.
Claim 39
Dependent Claim
51 words
The method of claim 29 wherein both conductive sides of the electronic component are attached to the substrate and the other conductive side of the component then is conductively isolated from the one conductive side of the component by cutting a slot in the substrate 360° about said other conductive side.
Claim 40
Dependent Claim
64 words
The method of claim 34 wherein a generally U-shaped slot is cut in the substrate and said electronic component is attached to the substrate with said one side of the component attached to the substrate outside the U-shaped slot and with the other side of the component attached to the substrate inside the U-shaped slot, whereafter the slot is cut further to said 360°.
Claim 41
Independent Claim
166 words
A method for mounting electronic components such as capacitors having two conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of: cutting a generally U-shaped slot in the substrate; attaching an electronic component to the substrate with one conductive side of the component in electrical connecting with said conductive material outside the U-shaped slot and with the other conductive side of the component in electrical connection with the conductive material inside the U-shaped slot; cutting the U-shaped slot further to form a closed slot surrounding said other side of the electronic component thereby isolating the other conductive side from the one side of the electronic component and the conductive material to which the component is attached; forming aperture means in the substrate within the closed slot; and inserting an electrical terminal through the aperture means for electrical connection to said other conductive side of the electronic component through the medium of the conductive material on the substrate within the closed slot.
Claim 42
Independent Claim
166 words
A method for mounting electronic components such as capacitors having two conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of: cutting a generally U-shaped slot in the substrate; attaching an electronic component to the substrate with one conductive side of the component in electrical connecting with said conductive material outside the U-shaped slot and with the other conductive side of the component in electrical connection with the conductive material inside the U-shaped slot; cutting the U-shaped slot further to form a closed slot surrounding said other side of the electronic component thereby isolating the other conductive side from the one side of the electronic component and the conductive material to which the component is attached; forming aperture means in the substrate within the closed slot; and inserting an electrical terminal through the aperture means for electrical connection to said other conductive side of the electronic component through the medium of the conductive material on the substrate within the closed slot.
Claim 43
Dependent Claim
28 words
The method of claim 36 wherein the conductive sides of the electronic component are connected to the conductive material of the substrate by applying a conductive adhesive therebetween.
Claim 44
Dependent Claim
27 words
The method of claim 37 wherein said terminal is connected to the conductive material of the substrate inside the closed slot by applying a conductive adhesive therebetween.
Claim 45
Independent Claim
99 words
A method for mounting electronic components, such as capacitors having two opposite conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of: cutting a slot in the substrate; attaching an electronic component to the substrate with opposite conductive sides of the component in electrical connection with said conductive material on opposite sides of said slot; further cutting said slot into a closed configuration defining an isolated portion of the substrate 360° about one conductive side of the electronic component; and attaching a terminal to the conductive material on said isolated portion of the substrate.
Claim 46
Independent Claim
99 words
A method for mounting electronic components, such as capacitors having two opposite conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of: cutting a slot in the substrate; attaching an electronic component to the substrate with opposite conductive sides of the component in electrical connection with said conductive material on opposite sides of said slot; further cutting said slot into a closed configuration defining an isolated portion of the substrate 360° about one conductive side of the electronic component; and attaching a terminal to the conductive material on said isolated portion of the substrate.
Claim 47
Dependent Claim
28 words
The method of claim 39 wherein the conductive sides of the electronic component are connected to the conductive material of the substrate by applying a conductive adhesive therebetween.
Claim 48
Dependent Claim
27 words
The method of claim 40 wherein said terminal is connected to the conductive material of the substrate inside the closed slot by applying a conductive adhesive therebetween.
Claim 49
Dependent Claim
83 words
An electrical device, comprising: a flat flexible insulating substrate having conductive material thereon and closed slot in the substrate defining an isolated portion thereof; an electronic component attached to the substrate with one conductive side of the component electrically connected to the conductive material inside the closed slot and the other conductive side of the electronic component electrically connected to the conductive material outside the closed slot; and a terminal electrically attached to the conductive material of the substrate inside the closed slot.
Claim 50
Dependent Claim
83 words
An electrical device, comprising: a flat flexible insulating substrate having conductive material thereon and closed slot in the substrate defining an isolated portion thereof; an electronic component attached to the substrate with one conductive side of the component electrically connected to the conductive material inside the closed slot and the other conductive side of the electronic component electrically connected to the conductive material outside the closed slot; and a terminal electrically attached to the conductive material of the substrate inside the closed slot.
Claim 51
Dependent Claim
27 words
The electrical device of claim 42 wherein the conductive sides of the electronic component are electrically connected to the conductive material of the substrate by conductive adhesive.
Claim 52
Dependent Claim
33 words
The electrical device of claim 42 wherein said terminal projects through an aperture in the substrate within the closed slot, the terminal engaging the conductive material of the substrate within the closed slot.
Claim 53
Dependent Claim
19 words
The electrical device of claim 44 wherein the terminal is electrically connected to the conductive material by conductive adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-25 | 1996-02-24 | 1996-08-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-25 | 2000-02-24 | 2000-08-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-25 | 2004-02-24 | 2004-08-25 | $7700.00 | Window Closed / Lapsed |