Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
103 words
A thin-film semiconductor device having an insulating substrate, a semiconductor layer formed on the insulating substrate, and a first wiring member formed on the insulating substrate with at least part of the first wiring member being in surface contact with the insulating substrate, wherein the first wiring member of said device comprises: a wiring base on the insulating substrate side, said wiring base being formed of a conductive material having a body-centered cubic lattice structure with its lattice constants either the same as or approximately identical to those of α-tantalum; and an overlying wiring part formed of α-tantalum superposed on the wiring base.
Claim 2
Dependent Claim
103 words
A thin-film semiconductor device having an insulating substrate, a semiconductor layer formed on the insulating substrate, and a first wiring member formed on the insulating substrate with at least part of the first wiring member being in surface contact with the insulating substrate, wherein the first wiring member of said device comprises: a wiring base on the insulating substrate side, said wiring base being formed of a conductive material having a body-centered cubic lattice structure with its lattice constants either the same as or approximately identical to those of α-tantalum; and an overlying wiring part formed of α-tantalum superposed on the wiring base.
Claim 3
Dependent Claim
13 words
The device according to claim 1, wherein the conductive material is tantalum-molybdenum alloy.
Claim 4
Dependent Claim
31 words
The device according to claim 1, wherein the first wiring member includes a gate electrode of a reverse staggered MOS thin-film transistor and a signal wiring connected to the gate electrode.
Claim 5
Dependent Claim
176 words
A thin-film semiconductor device having a plurality of thin-film semiconductor elements and an active matrix wiring circuit provided on a common insulating substrate, in which both a first signal wiring of the active matrix wiring circuit and an electrode on the substrate side of each of the plurality of thin-film semiconductor elements are in surface contact with the insulating substrate, said device comprising: the first signal wiring of the active matrix wiring circuit including a wiring base on the substrate side and being formed of a conductive material having a body-centered cubic lattice structure with its lattice constants either the same as or approximately identical to those of α-tantalum, an intermediate overlying wiring part formed of α-tantalum and superposed on the wiring base, and a top overlying wiring part formed of α-tantalum superposed on the intermediate overlying wiring part; and the electrode on the substrate side of each of the plurality of thin-film semiconductor elements including a single thin layer of tantalum that is integral with the top overlying wiring part of the first signal wiring.
Claim 6
Dependent Claim
176 words
A thin-film semiconductor device having a plurality of thin-film semiconductor elements and an active matrix wiring circuit provided on a common insulating substrate, in which both a first signal wiring of the active matrix wiring circuit and an electrode on the substrate side of each of the plurality of thin-film semiconductor elements are in surface contact with the insulating substrate, said device comprising: the first signal wiring of the active matrix wiring circuit including a wiring base on the substrate side and being formed of a conductive material having a body-centered cubic lattice structure with its lattice constants either the same as or approximately identical to those of α-tantalum, an intermediate overlying wiring part formed of α-tantalum and superposed on the wiring base, and a top overlying wiring part formed of α-tantalum superposed on the intermediate overlying wiring part; and the electrode on the substrate side of each of the plurality of thin-film semiconductor elements including a single thin layer of tantalum that is integral with the top overlying wiring part of the first signal wiring.
Claim 7
Dependent Claim
13 words
The device according to claim 4, wherein the conductive material is tantalum-molybdenum alloy.
Claim 8
Dependent Claim
38 words
The device according to claim 4, wherein the electrode on the substrate side is a gate electrode of a reverse staggered MOS thin-film transistor, and the first signal wiring is a signal wiring connected to the gate electrode.
Claim 9
Dependent Claim
40 words
The device according to claim 4, wherein the electrode on the substrate side includes source and drain electrodes of a staggered MOS thin-film transistor, and the first signal wiring comprises signal wirings connected to the source and drain electrodes, respectively.
Claim 10
Dependent Claim
103 words
A thin-film semiconductor device having an insulating substrate, a semiconductor layer formed on the insulating substrate, and two first wiring members formed on the insulating substrate with at least part of each first wiring member being in surface contact with the insulating substrate, wherein each first wiring member of said device comprises: a wiring base on the insulating substrate side, said wiring base being formed of a conductive material having a body-centered cubic lattice structure with its lattice constants either the same as or approximately identical to those of α-tantalum; and an overlying wiring part formed of α-tantalum superposed on the wiring base.
Claim 11
Dependent Claim
103 words
A thin-film semiconductor device having an insulating substrate, a semiconductor layer formed on the insulating substrate, and two first wiring members formed on the insulating substrate with at least part of each first wiring member being in surface contact with the insulating substrate, wherein each first wiring member of said device comprises: a wiring base on the insulating substrate side, said wiring base being formed of a conductive material having a body-centered cubic lattice structure with its lattice constants either the same as or approximately identical to those of α-tantalum; and an overlying wiring part formed of α-tantalum superposed on the wiring base.
Claim 12
Dependent Claim
13 words
The device according to claim 8, wherein the conductive material is tantalum-molybdenum alloy.
Claim 13
Dependent Claim
36 words
The device according to claim 8, wherein the two first wiring members comprise a source and a drain electrode of a staggered MOS thin-film transistor and signal wirings connected to the source and drain electrodes, respectively.