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US5137846A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for forming a polycyanurate encapsulant

Assignee: NXP USA Inc
•
Filing: 1991-01-31
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Granted: 1992-08-11
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Expires: 2011-01-31
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Abstract

Abstract An improved encapsulant for an electronic component package is composed of an inorganic powder dispersed in a polycyanurate resin binder. The encapsulant is formed by applying a curing mixture of the powder and a liquid vehicle composed predominantly of a blend of one or more multifunctional cyanate ester compounds that are curable to form the binder. The blend includes a cyanate ester substituted bisphenol derivative compound having the formula <IMAGE> wherein R1and R2are members of the group consisting of hydrogen, methyl and ethyl. Preferably, the blend includes a second cyantophenylene compound having the formula <IMAGE> wherein R3is a hydrocarbon chain including an aryl link.

Inventors

  • 👤 Steven C. Machuga
  • 👤 Robert W. Pennisi
  • 👤 Stephanie Schauer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 10:25
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/40; H10W74/47

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 132 words
A method for forming a corrosion-resistant encapsulant on an electronic component package, said method comprising dispensing onto the package at ambient temperature a flowable moisture comprising an inorganic powder and a curable, substantially halide-free liquid vehicle predominantly composed of a cyanate ester blend comprising at least 30 weight percent of a cyanate ester-substituted bisphenol derivative compound having the formula ##STR7## wherein R 1 and R 2 are distinct members of the group consisting of hydrogen, methyl and ethyl group, and the balance mainly a aryl-linked multifunctional cyanatophenylene compound having the formula ##STR8## is wherein R 3 is a hydrocarbon linkage comprising at least one aryl link, and heating the applied mixture to cure the vehicle and thereby form an encapsulant characterized by the inorganic powder dispersed in a hydrophobic polycyanurate resin binder.
Claim 2
Independent Claim 132 words
A method for forming a corrosion-resistant encapsulant on an electronic component package, said method comprising dispensing onto the package at ambient temperature a flowable moisture comprising an inorganic powder and a curable, substantially halide-free liquid vehicle predominantly composed of a cyanate ester blend comprising at least 30 weight percent of a cyanate ester-substituted bisphenol derivative compound having the formula ##STR7## wherein R 1 and R 2 are distinct members of the group consisting of hydrogen, methyl and ethyl group, and the balance mainly a aryl-linked multifunctional cyanatophenylene compound having the formula ##STR8## is wherein R 3 is a hydrocarbon linkage comprising at least one aryl link, and heating the applied mixture to cure the vehicle and thereby form an encapsulant characterized by the inorganic powder dispersed in a hydrophobic polycyanurate resin binder.
Claim 3
Dependent Claim 22 words
A method in accordance with claim 1 wherein the vehicle further comprises a high boiling alcohol and a transition metal catalyst compound.
Claim 4
Dependent Claim 41 words
A method in accordance with claim 2 wherein the vehicle includes an alcohol having a boiling point greater than about 200° C. and an organometallic catalyst compound containing a metal selected from the group consisting of zinc, manganese, copper and cobalt.
Claim 5
Dependent Claim 27 words
A method in accordance with claim 1 wherein the inorganic powder is formed of an oxide material selected from the group consisting of silica, alumina and aluminosilicate.
Claim 6
Dependent Claim 18 words
A method in accordance with claim 1 wherein the mixture comprises at least 60 weight percent inorganic powder.
Claim 7
Dependent Claim 20 words
A method in accordance with claim 1 wherein the mixture comprises between about 60 and 70 weight percent inorganic powder.
Claim 8
Dependent Claim 22 words
A method in accordance with claim 1 wherein the mixture is heated for curing at a temperature not greater than 160° C.
Claim 9
Dependent Claim 24 words
A method in accordance with claim 1 wherein the mixture is cured by heating at a temperature between than 120° C. and 150° C.
Claim 10
Independent Claim 117 words
A method for forming an encapsulant on an electronic component package, said method comprising dispensing onto the package a flowable mixture comprising an inorganic powder and a curable, liquid vehicle composed of a cyanate ester blend comprising a cyanate ester-substituted bisphenol derivative compound having the formula ##STR9## wherein R 1 and R 2 are members of the group consisting of hydrogen, methyl and ethyl group, and the balance mainly a aryl-linked cyanatophenylene compound having the formula ##STR10## is wherein R 3 is a hydrocarbon linkage comprising at least one aryl link, and heating the applied mixture to cure the vehicle and thereby form an encapsulant characterized by the inorganic powder dispersed in a hydrophobic polycyanurate resin binder.
Claim 11
Independent Claim 117 words
A method for forming an encapsulant on an electronic component package, said method comprising dispensing onto the package a flowable mixture comprising an inorganic powder and a curable, liquid vehicle composed of a cyanate ester blend comprising a cyanate ester-substituted bisphenol derivative compound having the formula ##STR9## wherein R 1 and R 2 are members of the group consisting of hydrogen, methyl and ethyl group, and the balance mainly a aryl-linked cyanatophenylene compound having the formula ##STR10## is wherein R 3 is a hydrocarbon linkage comprising at least one aryl link, and heating the applied mixture to cure the vehicle and thereby form an encapsulant characterized by the inorganic powder dispersed in a hydrophobic polycyanurate resin binder.
Claim 12
Independent Claim 131 words
A method for forming a corrosion-resistant encapsulant on an electronic component package, said method comprising dispensing onto the package at ambient temperature a flowable moisture comprising an inorganic powder and a curable, substantially halide-free liquid vehicle predominantly composed of a cyanate ester blend consisting essentially of between 40 and 60 weight percent of a (bis)cyanatophenylene) compound having the formula ##STR11## wherein R 1 and R 2 are distinct members of the group consisting of hydrogen, methyl and ethyl group, and the balance mainly a aryl-linked (bis)cyanatophenylene) compound having the formula ##STR12## is wherein R 3 is a hydrocarbon linkage comprising at least one aryl link, and heating the applied mixture to cure the vehicle and thereby form an encapsulant characterized by the inorganic powder dispersed in a hydrophobic polycyanurate resin binder.
Claim 13
Independent Claim 131 words
A method for forming a corrosion-resistant encapsulant on an electronic component package, said method comprising dispensing onto the package at ambient temperature a flowable moisture comprising an inorganic powder and a curable, substantially halide-free liquid vehicle predominantly composed of a cyanate ester blend consisting essentially of between 40 and 60 weight percent of a (bis)cyanatophenylene) compound having the formula ##STR11## wherein R 1 and R 2 are distinct members of the group consisting of hydrogen, methyl and ethyl group, and the balance mainly a aryl-linked (bis)cyanatophenylene) compound having the formula ##STR12## is wherein R 3 is a hydrocarbon linkage comprising at least one aryl link, and heating the applied mixture to cure the vehicle and thereby form an encapsulant characterized by the inorganic powder dispersed in a hydrophobic polycyanurate resin binder.
Claim 14
Dependent Claim 22 words
A method in accordance with claim 10 wherein the vehicle further comprises a high boiling alcohol and a transition metal catalyst compound.
Claim 15
Dependent Claim 41 words
A method in accordance with claim 10 wherein the vehicle includes an alcohol having a boiling point greater than about 200° C. and an organometallic catalyst compound containing a metal selected from the group consisting of zinc, manganese, copper and cobalt.
Claim 16
Dependent Claim 29 words
A method in accordance with claim 10 wherein the mixture comprises at least 60 weight percent inorganic powder selected from the group consisting of silica, alumina and aluminosilicate powders.
Claim 17
Dependent Claim 20 words
A method in accordance with claim 13 wherein the mixture comprises between about 60 and 70 weight percent inorganic powder.
Claim 18
Dependent Claim 22 words
A method in accordance with claim 10 wherein the mixture is heated for curing at a temperature not greater than 160° C.
Claim 19
Dependent Claim 24 words
A method in accordance with claim 10 wherein the mixture is cured by heating at a temperature between than 120° C. and 150° C.

References Cited (Backward Citations)

US4709008A Cited
US4999699A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-08-11 1996-02-10 1996-08-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-08-11 2000-02-10 2000-08-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-08-11 2004-02-10 2004-08-11 $7700.00 Window Closed / Lapsed

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