Semiconductor processing gas diffuser plate

Claim 2

A baffle apparatus for insertion into a semiconductor wafer processing furnace to diffuse processing gases that are injected into the furnace by an injector nozzle, the semiconductor wafers being supported within the furnace on an elongated wafer paddle for sliding wafers into and out of the furnace, the wafer paddle being defined by an elongated well having upwardly rising sides, the baffle apparatus comprising: a diffuser plate assembly having an upper end and a lower end, the diffuser plate assembly having at least one diffuser plate against which injected gases are to be forced: the lower end of the diffuser plate assembly being sized and shaped to engage with and be supported by an elongated wafer paddle, the lower end of the diffuser plate assembly including a paddle opening which is shaped to correspond to a cross sectional shape of a wafer paddle, the paddle opening being sized slightly larger than the wafer paddle cross sectional shape, the lower end of the diffuser plate assembly thereby being slidable over and along the wafer paddle by receipt of the wafer paddle through the paddle opening, with engagement of the paddle and paddle opening supporting the diffuser plate assembly in an upright position relative to the paddle; and a diffuser cup on the diffuser plate, the diffuser cup being positioned on the diffuser plate to longitudinally align with a furnace nozzle when the diffuser plate assembly is received by an elongated wafer paddle within a semiconductor wafer processing furnace.

Claim 3

The baffle apparatus of claim 1 wherein the diffuser cup includes radial holes.

Claim 4

The baffle apparatus of claim 1 wherein the diffuser plate is perforated in an area external of the position of the diffuser cup.

Claim 5

A baffle appartaus for insertion into a semicondcutor wafer processing furnace to diffuse processing gases that are injected into the furnace by an injector nozzle, the semiconductor wafers being supported within the furnace on an elongated wafer paddle for sliding wafers into and out of the furnace, the baffle apparatus comprising: a diffuser plate assembly having an upper end and a lower end, the diffuser plate assembly having at least first and second diffuser plates against which injected gases are to be forced, the first and second diffuser plates being longitudinally spaced relative to one another; the lower ends of the first and second diffuser plates each including a paddle opening which is shaped to correspond to a cross sectional shape of a wafer paddle, each paddle opening being sized slightly larger than the wafer paddle cross sectional shape, the paddle opening in the first diffuser plate being aligned with the paddle opening of the second diffuser plate, the lower end of the first and second diffuser plates thereby being slidable over and along the wafer paddle by receipt of the wafer paddle through their respective paddle openings, with engagement of the paddle and paddle openings supporting the diffuser plate assembly in an upright position; a diffuser cup on the first diffuser plate, the diffuser cup being positioned on the first diffuser plate to longitudinally align with the furnace nozzle when an elongated wafer paddle receives the first and second diffuser plates through their respective paddle openings within a semiconductor wafer processing furnace; and the first and second diffuser plates being perforated in an are external of the position of the diffuser cup.

Claim 6

A baffle appartaus for insertion into a semicondcutor wafer processing furnace to diffuse processing gases that are injected into the furnace by an injector nozzle, the semiconductor wafers being supported within the furnace on an elongated wafer paddle for sliding wafers into and out of the furnace, the baffle apparatus comprising: a diffuser plate assembly having an upper end and a lower end, the diffuser plate assembly having at least first and second diffuser plates against which injected gases are to be forced, the first and second diffuser plates being longitudinally spaced relative to one another; the lower ends of the first and second diffuser plates each including a paddle opening which is shaped to correspond to a cross sectional shape of a wafer paddle, each paddle opening being sized slightly larger than the wafer paddle cross sectional shape, the paddle opening in the first diffuser plate being aligned with the paddle opening of the second diffuser plate, the lower end of the first and second diffuser plates thereby being slidable over and along the wafer paddle by receipt of the wafer paddle through their respective paddle openings, with engagement of the paddle and paddle openings supporting the diffuser plate assembly in an upright position; a diffuser cup on the first diffuser plate, the diffuser cup being positioned on the first diffuser plate to longitudinally align with the furnace nozzle when an elongated wafer paddle receives the first and second diffuser plates through their respective paddle openings within a semiconductor wafer processing furnace; and the first and second diffuser plates being perforated in an are external of the position of the diffuser cup.

Claim 7

The baffle apparatus of claim 4 wherein the perforations form a repetitive pattern in each of the first and second diffuser plates, the pattern of the second diffuser plate being rotationally offset from the pattern of the first diffuser plate.

Claim 8

The baffle apparatus of claim 5 wherein the patterns in each of the first and second diffuser plates are repetitive at 90° rotation intervals, the patterns of the first and second diffuser plates being rotationally offset from one another by 45°.

Claim 9

The baffle apparatus of claim 4 wherein the diffuser cup includes radial holes.

Claim 10

The baffle apparatus of claim 7 wherein the perforations form a repetitive pattern in each of the first and second diffuser plates, the pattern of the second diffuser plate being rotationally offset from the pattern of the first diffuser plate.

Claim 11

The baffle apparatus of claim 8 wherein the patterns in each of the first and second diffuser plates are repetitive at 90° rotation intervals, the patterns of the first and second diffuser plates being rotationally offset from one another by 45°.