Photoresist composition with copolymer binder having a major proportion of phenolic units and a minor proportion of non-aromatic cyclic alcoholic units

Claim 2

A photoresist composition consisting of an admixture of a resin binder and a light sensitive component, said resin binder comprising a copolymer having a major proportion of phenolic units and a minor proportion of non-aromatic cyclic alcoholic units, said cyclic alcoholic units being present in a concentration of less than 50 mole percent of the total of said binder and being insufficient to prevent development of an exposed coating of the photoresist in a developer for said photoresist, said light sensitive component being present in an amount capable of generating a latent image by exposure of a coating of said photoresist to activating radiation.

Claim 3

The photoresist of claim 1 where the copolymer is a random, essentially linear copolymer.

Claim 4

The photoresist of claim 2 wherein the light sensitive component is selected from the group of (1) o-quinone diazide sulfonic acid esters and (2) a combination of an aminoplast or phenolplast and a photoactive acid generating compound.

Claim 5

The photoresist of claim 3 where the resin binder is a copolymer selected from the group consisting of: ##STR2## where unit (1) is a phenolic unit and unit (2) is a cyclic alcohol unit; Z is an alkylene bridge having from 1 to 3 carbon atoms; A is a substituent substituted for hydrogen on the ring selected from the group of lower alkyl having from 1 to 3 carbon atoms, halo, alkoxy having from 1 to 3 carbon atoms, hydroxyl, nitro and amino; a is a number varying from 0 to 3; B is a substituent selected from the group of hydrogen, lower alkyl having from 1 to 3 carbon atoms, halo, alkoxy having from 1 to 3 carbon atoms, hydroxyl, nitro and amino, provided that at least 3 of said B substituents are hydrogen; b is a whole, odd integer varying between 6 and 10; and X is the mole fraction of the unit (1) in the copolymer and varies between 0.50 and 0.99.

Claim 6

The photoresist of claim 3 where the resin binder is a hydrogenated phenolic resin having a percent hydrogenation varying from about 1 to 30 mole percent.

Claim 7

The photoresist of claim 5 where percent hydrogenation varies from 5 and 15 mole percent.

Claim 8

The photoresist of claim 5 where the hydrogenated phenolic resin is a hydrogenated novolak resin and the light sensitive component is a naphthoquinone diazide sulfonic acid ester.

Claim 9

The photoresist of claim 5 where the hydrogenated phenolic resin is a hydrogenated polyvinyl phenol resin and the light sensitive component is a naphthoquinone diazide sulfonic acid ester.

Claim 10

The photoresist of claim 5 where the hydrogenated phenolic resin is a hydrogenated polyvinyl phenol resin and the light sensitive component is a combination of an aminoplast and an acid generating compound.

Claim 11

The photoresist of claim 9 where the photoresist is a negative acting photoresist.

Claim 12

The photoresist of claim 9 where the aminoplast is a melamine formaldehyde resin.

Claim 13

The photoresist of claim 9 where the photoactive generating compound is one that: (i) selectively absorbs actinic radiation having a wave length in the range of about 350 nm or less; (ii) is compatible with the acid-hardening resin and the aminoplast or phenolplast; (iii) is developable in an aqueous based solution; (iv) is capable, on exposure to actinic radiation having a wavelength in the range of about 350 nm or less, of generating halogen acid for crosslinking the acid-hardening resin system at elevated temperatures to form a thermally stable negative image.

Claim 14

The photoresist of claim 12 where the photoactive acid generating compound is 1,1-bis[p-chlorophenyl]-2,2,2-trichloroethane.

Claim 15

A photoresist consisting of an admixture of an acid hardening resin system where the resin component of the system is a partially hydrogenated polyvinyl phenol and a photoactive acid generating compound, said polyvinyl phenol component having a major proportion of phenolic groups and a minor proportion of cyclic alcoholic groups, said cyclic alcoholic groups being present in an amount of less than 50 mole percent of the total binder and insufficient to prevent development of an exposed photoresist coating in a developer for said photoresist, said photoactive acid component being present in an amount capable of generating a latent image in a coating of said photoresist following exposure to activating radiation and baking.

Claim 16

A photoresist consisting of an admixture of an acid hardening resin system where the resin component of the system is a partially hydrogenated polyvinyl phenol and a photoactive acid generating compound, said polyvinyl phenol component having a major proportion of phenolic groups and a minor proportion of cyclic alcoholic groups, said cyclic alcoholic groups being present in an amount of less than 50 mole percent of the total binder and insufficient to prevent development of an exposed photoresist coating in a developer for said photoresist, said photoactive acid component being present in an amount capable of generating a latent image in a coating of said photoresist following exposure to activating radiation and baking.

Claim 17

The photoresist of claim 14 where the cyclic alcoholic groups comprise from 5 and 15 mole percent of the resin.

Claim 18

The photoresist of claim 14 where acid hardening resin system is a combination of an aminoplast and said hydrogenated polyvinyl phenol resin.

Claim 19

The photoresist of claim 14 where the photoresist is a negative acting photoresist.

Claim 20

The photoresist of claim 16 where the aminoplast is a melamine resin.

Claim 21

The photoresist of claim 18 where the aminoplast is a melamine formaldehyde resin.