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US5126178A
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US
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Wafer processing film
Assignee: Mitsui Chemicals Inc
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Filing: 1991-02-14
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Granted: 1992-06-30
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Expires: 2011-02-14
Abstract
Abstract The present invention provides a water processing film fitted on one side of the base film with a pressure-sensitive adhesive layer and further with a release film on the surface of the pressure-sensitive adhesive layer, and coated on the back side of the base film a phosphoric surfactant wherein ionic components are not detected by ion chromatography, and can prevent failure of an integrated circuit dye static electricity generated in the handling of the wafer processing film and can also inhibit contamination and corrosion of the wafer by surfactant.
Inventors
- 👤 Yasuo Takemura
- 👤 Osamu Narimatsu
- 👤 Kazuyoshi Komatsu
- 👤 Yoko Takeuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:59
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/18; H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7402; C; C09; C09J; C09J7/00; C09J7/20; C09J7/201; C09J7/22; C09J7/24; C09J7/241; C09J2301/00; C09J2301/30; C09J2301/302; C09J2301/40; C09J2301/414; C09J2421/00; C09J2423/00; C09J2423/005; C09J2423/04; C09J2423/046; C09J2423/10; C09J2423/106; C09J2427/00; C09J2427/006; C09J2429/00; C09J2431/00; C09J2431/006; C09J2433/00; C09J2467/00; C09J2467/005; C09J2471/00; C09J2471/005; C09J2477/00; C09J2477/005; H10P72/7416; Y; Y10; Y10T; Y10T428/00; Y10T428/14; Y10T428/1424; Y10T428/28; Y10T428/2848
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
55 words
A wafer processing film comprising: a base film; a pressure-sensitive adhesive layer coating a first side of said base film; a release film on a surface of said pressure-sensitive adhesive layer; a phosphoric acid based surfactant coating a second side of said base film, wherein said surfactant is not in direct contact with said wafer
Claim 2
Dependent Claim
55 words
A wafer processing film comprising: a base film; a pressure-sensitive adhesive layer coating a first side of said base film; a release film on a surface of said pressure-sensitive adhesive layer; a phosphoric acid based surfactant coating a second side of said base film, wherein said surfactant is not in direct contact with said wafer
Claim 3
Dependent Claim
26 words
A wafer processing film according to claim 1, wherein said phosphoric acid based surfactant comprises: ionic components in an amount which is undetectable by ion chromatography.
Claim 4
Dependent Claim
80 words
A wafer processing film according to claim 1 wherein said phosphoric acid based surfactant is a compound selected from the group consisting of: (A) an alkyl phosphoric acid ester; (B) an alkyl phosphoric acid ester salt; (C) said alkyl phosphoric acid ester and said alkyl phosphoric acid ester salt; (D) an alkyl ether phosphoric acid ester; (E) an alkyl ether phosphoric acid ester salt; and (F) said alkyl ether phosphoric acid ester and said alkyl ether phosphoric acid ester salt.
Claim 5
Dependent Claim
63 words
A wafer processing film according to claim 3, wherein, said compound is obtained by reacting a higher alcohol or a terminal group of a polyoxyethylene derivative of a higher alcohol with a phosphorating agent and neutralizing residual acidic hydroxyl groups with a base and said phosphorating agent is a compound selected from the group consisting of phosphorus pentoxide, phosphorus oxychloride and phosphorus trichloride.
Claim 6
Dependent Claim
36 words
A wafer processing film according to claim 3 wherein an alkyl group in said alkyl phosphoric acid ester and said alkyl phosphoric acid ester salt has a carbon number in the range from 8 to 18.
Claim 7
Dependent Claim
34 words
A wafer processing film according to claim 4 wherein said base used for neutralizing said residual acidic hydroxyl groups is a compound selected from the group consisting of ammonia, organic amine and amino alcohol.
Claim 8
Dependent Claim
38 words
A wafer processing film according to claim 3 wherein an alkyl group in said alkyl ether phosphoric acid ester and said alkyl ether phosphoric acid ester salt has a carbon number in the range from 8 to 18.
Claim 9
Dependent Claim
37 words
A wafer processing film according to claim 3 wherein said alkyl ether phosphoric acid ester and said alkyl ether phosphoric acid ester salt has an ethylene oxide addition mole number in the range from 2 to 8.
Claim 10
Dependent Claim
27 words
A wafer processing film according to claim 1 wherein said surfactant on said second side is in an amount of from 1 to 100 mg/m 2 .
Claim 11
Dependent Claim
33 words
A wafer processing film according to claim 1 wherein the material which comprises said pressure-sensitive adhesive layer is a material selected from the group consisting of acryl base, vinyl base and rubber base.
Claim 12
Dependent Claim
28 words
A wafer processing film according to claim 10 wherein said pressure-sensitive adhesive layer comprises an aqueous emulsion polymerized with a polymerization initiator with substantially no strongly corrosive ions.
Claim 13
Dependent Claim
24 words
A wafer processing film according to claim 11 wherein said polymerization initiator with substantially no strongly corrosive ions comprises a water soluble azo compound.
Claim 14
Dependent Claim
15 words
A wafer processing film according to claim 12 wherein said polymerization initiator comprises 4,4'-azobiscyanopentanoic acid.
Claim 15
Dependent Claim
37 words
A wafer processing film according to claim 1 wherein said base film is prepared from a resin and said resin is a material selected from the group consisting of polyethylene, ethylene copolymer, polypropylene and plasticized polyvinyl chloride.
Claim 16
Dependent Claim
17 words
A wafer processing film according to claim 14 wherein said ethylene copolymer is an ethylene-vinyl acetate copolymer.
Claim 17
Dependent Claim
23 words
A wafer processing film according to claim 1 wherein said base film has a thickness in the range from 10 to 2000 μm.
Claim 18
Dependent Claim
28 words
A wafer processing film according to claim 1 wherein the amount of said pressure-sensitive adhesive layer coating is in the range from 1 to 200 g/m 2 .
Claim 19
Dependent Claim
33 words
A wafer processing film according to claim 1 wherein said release film is prepared from a resin and said resin is a material selected from a group consisting of polyolefin, polyester and polyamide.
Claim 20
Dependent Claim
13 words
A wafer processing film according to claim 1 from 10 to 500 μm.
Claim 21
Dependent Claim
42 words
A wafer processing film according to claim 1 wherein a nonionic surface active agent is added to said phosphoric acid base surfactant in an amount not exceeding 50 parts by weight per 100 parts by weight of said phosphoric acid base surfactant.
Claim 22
Dependent Claim
24 words
A wafer processing film according to claim 1 wherein the detection limit of the ionic components by ion chromatography is 1 ppm by weight.
Claim 23
Dependent Claim
27 words
A wafer processing film according to claim 1 wherein said surfactant on said second side is in an amount of from 0.5 to 1000 mg/m 2 .
References Cited (Backward Citations)
US4853286A
Cited
US4756968A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-30 | 1995-12-30 | 1996-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-30 | 1999-12-30 | 2000-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-30 | 2003-12-30 | 2004-06-30 | $7700.00 | Window Closed / Lapsed |