Fabrication of microelectronics using photosensitive polyimides

Claim 2

A process for photolithtograhically patterning a layer of a dielectric composition having an initial thickness to provide a dielectric feature having a final thickness, the dielectric composition having a photosensitive polyimide and a solvent, the process consisting of the steps: (a) heating the layer to a primary temperature ranging from about 100° C. to 130° C. effective to decrease the initial thickness of the layer by a first amount to an intermediate thickness; (b) exposing the portions of the layer of intermediate thickness to radiation; (c) removing the exposed portions of the layer; (d) heating the exposed portions of the layer to a secondary temperature ranging between about 200° C. to 300° C. effective to decrease the intermediate thickness of the layer by a second amount to a final thickness, the first amount being greater than the second amount; and (e) curing the layer from step (d) bu heating it to a third temperature ranging between about 350° C. to about 420° C., substantially no decrease in the thickness of the layer occurring during this step.

Claim 3

The process of claim 1 wherein step (c) further comprises: contacting said layer with a developing solvent, said developing solvent being selected such that the unexposed portions of said layer are removed by contact with said developing solvent and said exposed portions remain after being contacted with said developing solvent.

Claim 4

The process of claim 1, wherein the radiation is ultraviolet radiation.

Claim 5

The process of claim 2, wherein the intermediate thickness of the layer after step (a) is such that the exposed portions are uniformly irradiated by the ultraviolet radiation, said uniform irradiation increasing the resistance of the exposed portions to adjacent attack by the developing solvent uniformly throughout the layer, such that the exposed portions, after removal of the unexposed portions, have walls that are substantially vertical.

Claim 6

The process of claim 1, wherein the first amount is at least about 80 percent of the difference between the initial thickness and the final thickness of the layer.

Claim 7

The process of claim 1, wherein the photosensitive polyimide comprises the repeating structural unit represented by the formula: ##STR2## wherein R is an aliphatic group and R' is an aliphatic group.

Claim 8

The process of claim 1 wherein the photosensitive polyimide is an inherently photosensitive polyimide.

Claim 9

A process for electroplating over a conductor seed pattern consisting essentially of the steps: (a) applying a layer of a dielectric composition, having an initial thickness, over said conductor seed pattern, said dielectric composition comprising a photosensitive polyimide and a solvent; (b) heating the layer to a primary temperature ranging from about 100° C. to 130° C. effective to decrease the initial thickness of the layer by a first amount to an intermediate thickness; (c) photolithographically patterning the layer of intermediate thickness such that portions of the conductor seed pattern to be electroplated are uncovered; (d) heating the photolithographically patterned layer to a secondary temperature ranging between about 200° C. to 300° C. effective to decrease the intermediate thickness of the layer by a second amount to a final thickness, the first amount being greater than the second amount, the layer of final thickness being substantially free of solvent; (e) subjecting the uncovered conductor seed pattern to electroplating conditions; and (f) heating the photolithographically patterned layer to a third temperature ranging between about 350° C. to about 420° C. effective to cure the photosensitive polyimide of the photolithographically patterned layer, substantially no decrease in the thickness of the layer occurring in this step.

Claim 10

A process for electroplating over a conductor seed pattern consisting essentially of the steps: (a) applying a layer of a dielectric composition, having an initial thickness, over said conductor seed pattern, said dielectric composition comprising a photosensitive polyimide and a solvent; (b) heating the layer to a primary temperature ranging from about 100° C. to 130° C. effective to decrease the initial thickness of the layer by a first amount to an intermediate thickness; (c) photolithographically patterning the layer of intermediate thickness such that portions of the conductor seed pattern to be electroplated are uncovered; (d) heating the photolithographically patterned layer to a secondary temperature ranging between about 200° C. to 300° C. effective to decrease the intermediate thickness of the layer by a second amount to a final thickness, the first amount being greater than the second amount, the layer of final thickness being substantially free of solvent; (e) subjecting the uncovered conductor seed pattern to electroplating conditions; and (f) heating the photolithographically patterned layer to a third temperature ranging between about 350° C. to about 420° C. effective to cure the photosensitive polyimide of the photolithographically patterned layer, substantially no decrease in the thickness of the layer occurring in this step.

Claim 11

The process of claim 8, wherein the photolithographic patterning of the layer of the dielectric composition in step (c) further comprises the steps: (i) irradiating the layer with untraviolet radiation through a mask such that a portion of the layer is exposed to the ultraviolet radiation; and (ii) contacting said layer with a developing solvent, said developing solvent being selected such that the unexposed portions of said layer are removed by contact with said developing solvent and said exposed portions remain after being contacted with said developing solvent.

Claim 12

The process of claim 8, wherein the first amount is at least about 80 percent of the difference between the initial thickness and the final thickness of the layer.

Claim 13

A high density multilayer interconnect structure prepared by the process of claim 8.

Claim 14

The process of claim 8, wherein the conductor seed pattern of step (a) comprises discontinuous conductor lines electrically interconnected by a conductive film, said conductive film providing an electrical connection until being exposed to an elevated temperature, said exposure to the elevated temperature disconnecting the electrical connection provided by the conductive film.

Claim 15

The process of claim 12, wherein the electrical connection provided by the conductive film is maintained after step (b).

Claim 16

The process of claim 12, wherein the electrical connection provided by the conductive film is maintained after step (d).

Claim 17

The process of claim 12, wherein the conductive film is heated by a laser beam.

Claim 18

The process of claim 8, wherein the photosensitive polyimide is an inherently photosensitive polyimide.

Claim 19

The process of claim 1, wherein the secondary temperature is less than 350° C.

Claim 20

A process for electroplating over a conductor seed pattern consisting essentially of the steps: (a) applying a layer of a dielectric composition, having an initial thickness, over said conductor seed pattern, said dielectric composition comprising a photosensitive polyimide and a solvent, said conductor seed pattern comprising gold; (b) heating the layer to a primary temperature ranging from about 100° C. to 130° C. effective to decrease the initial thickness of the layer by a first amount to an intermediate thickness; (c) photolithographically patterning the layer of intermediate thickness such that portions of the conductor seed pattern to be electroplated are uncovered; (d) heating the photolithographically patterned layer to a secondary temperature ranging between about 200° C. to 300° C. effective to decrease the intermediate thickness of the layer by a second amount to a final thickness, the first amount being greater than the second amount, the layer of final thickness being substantially free of the solvent; (e) subjecting the uncovered conductor seed pattern to electroplating conditions; and (f) heating the photolithographically patterned layer to a third temperature ranging between about 350° C. to about 420° C. effective to cure the photosensitive polyimide of the polylithographically patterned layer, substantially no decrease in thickness of the layer occurring in this step.

Claim 21

A process for electroplating over a conductor seed pattern consisting essentially of the steps: (a) applying a layer of a dielectric composition, having an initial thickness, over said conductor seed pattern, said dielectric composition comprising a photosensitive polyimide and a solvent, said conductor seed pattern comprising gold; (b) heating the layer to a primary temperature ranging from about 100° C. to 130° C. effective to decrease the initial thickness of the layer by a first amount to an intermediate thickness; (c) photolithographically patterning the layer of intermediate thickness such that portions of the conductor seed pattern to be electroplated are uncovered; (d) heating the photolithographically patterned layer to a secondary temperature ranging between about 200° C. to 300° C. effective to decrease the intermediate thickness of the layer by a second amount to a final thickness, the first amount being greater than the second amount, the layer of final thickness being substantially free of the solvent; (e) subjecting the uncovered conductor seed pattern to electroplating conditions; and (f) heating the photolithographically patterned layer to a third temperature ranging between about 350° C. to about 420° C. effective to cure the photosensitive polyimide of the polylithographically patterned layer, substantially no decrease in thickness of the layer occurring in this step.