Patent EP0287324A2 successfully refreshed from Google Patents.
US5116939A
Expired / Lapsed
US
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Polyimide processing additives
Assignee: National Aeronautics and Space Administration
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Filing: 1987-08-11
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Granted: 1992-05-26
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Expires: 2007-08-11
Abstract
Abstract A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15% by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.
Inventors
- 👤 James C. Fletcher
- 👤 J. Richard Pratt
- 👤 Terry L. St. Clair
- 👤 Diane M. Stoakley
- 👤 Harold D. Burks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 03:16
CPC Classifications
C; C08; C08K; C08K5/00; C08K5/16; C08K5/21; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1067; C08K5/34; C08K5/3412; C08K5/3415
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
65 words
A process for preparing polyimides having enhanced melt flow properties, which process comprises admixing a member selected from the group consisting of high molecular weight poly(amic acids) and high molecular weight polyimides with 0.05 to 15 percent by weight of a member selected from the group consisting of low molecular weight amic acid additives and low molecular weight imide additives, and thermally curing the admixture.
Claim 2
Dependent Claim
65 words
A process for preparing polyimides having enhanced melt flow properties, which process comprises admixing a member selected from the group consisting of high molecular weight poly(amic acids) and high molecular weight polyimides with 0.05 to 15 percent by weight of a member selected from the group consisting of low molecular weight amic acid additives and low molecular weight imide additives, and thermally curing the admixture.
Claim 3
Dependent Claim
59 words
The process of claim 1, wherein the low molecular weight amic acid additive is selected from the group consisting of ##STR5## wherein R, R', R", and R'" are selected from the group consisting of hydrogen, alkyl, aklyloxy, aryl, halogen, and haloakyl; and x is selected from the group consisting of oxo, thio, methylene, carbonyl, 2,2-hexafluoropropyl, sulfone, 4,4'-thiodiphenoxy, and nil.
Claim 4
Dependent Claim
59 words
The process of claim 1, wherein the low molecular weight imide additive is selected from the group consisting of ##STR6## wherein R, R', R", and R'" are selected from the group consisting of hydrogen, alkyl, alkyloxy, aryl, halogen, and haloalkyl; and x is are selected from the group consisting of oxo, thio, methylene, carbonyl, 2,2-hexafluoropropyl, sulfone, 4,4'-thiodiphenoxy, and nil.
Claim 5
Dependent Claim
91 words
The process of claim 1, wherein the admixing of a polymer selected from the group consisting of high molecular weight poly(amic acids) and high molecular weight polyimides with an additive selected from the group consisting of low molecular weight amic acid additives and low molecular weight imide additives is achieved by adding the low molecular weight additive in a phase selected from the group consisting of solid powder, solution, and dispersion to the high molecular weight polymer in a phase selected from the group consisting of solid powder, solution and dispersion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-05-26 | 1995-11-25 | 1996-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-05-26 | 1999-11-25 | 2000-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-05-26 | 2003-11-25 | 2004-05-26 | $7700.00 | Window Closed / Lapsed |