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US5114529A
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Plasma processing method and apparatus
Assignee: International Business Machines Corp
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Filing: 1991-04-09
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Granted: 1992-05-19
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Expires: 2011-04-09
Abstract
Abstract A plasma processing apparatus includes an oxygen source 14 which provides gas to a plasma generating means 16 for generating plasma in a plasma generating area 40. Gas flows from the plasma generating area 40 to a wafer 30 placed in a processing area 60. A magnetic field generating area 50, located between the plasma generating area 40 and the processing area 60 is created by coils 20 and a power source 21. Charged particles are reflected by the magnetic field and are thus prevented from reaching the wafer 30. A baffle 22 is disposed above the processing area 60 to partly block charged particles.
Inventors
- 👤 Akira Masuyama
- 👤 Takaki Saitoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 07:14
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32009; H01J37/32082; H01J37/32091; H01J37/32357; H01J37/32431; H01J37/32623; H01J37/3266
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
61 words
A plasma processing method comprising the steps of: generating a plasma containing electricallyneutral reaction species in a plasma generating area; processing a workpiece by said reaction species in a processing area; and, generating a mirror magnetic field between said plasma generating area and said processing area for restricting charged particles from moving from said plasma generating area to said processing area.
Claim 2
Dependent Claim
61 words
A plasma processing method comprising the steps of: generating a plasma containing electricallyneutral reaction species in a plasma generating area; processing a workpiece by said reaction species in a processing area; and, generating a mirror magnetic field between said plasma generating area and said processing area for restricting charged particles from moving from said plasma generating area to said processing area.
Claim 3
Dependent Claim
26 words
A plasma processing method according to claim 1, wherein said workpiece is a semiconductor wafer having photoresist on its surface, and the processing is photoresist ashing.
Claim 4
Dependent Claim
29 words
A plasma processing method according to claim 1, wherein said mirror magnetic field is generated by an electrical coil disposed between said plasma generating area and said processing area.
Claim 5
Dependent Claim
31 words
A plasma processing method to claim 1, wherein the direction of said mirror magnetic field is parallel to that of gas flow from said plasma generating area to said processing area.
Claim 6
Dependent Claim
23 words
A plasma processing method according to claim 4, wherein said plasma generating area is located above said processing and the gas flows downward.
Claim 7
Dependent Claim
24 words
A plasma processing method according to claim 1, wherein said plasma generating area is located above said processing area and the gas flows downward.
Claim 8
Dependent Claim
29 words
A plasma processing method according to claim 1, further comprising the step of: partly blocking charged particles with a baffle installed between said mirror magnetic field and said workpiece.
Claim 9
Dependent Claim
31 words
A plasma processing method according to claim 1, further comprising the step of: partly blocking charged particles with a baffle installed between said mirror magnetic field and said plasma generating area.
Claim 10
Dependent Claim
57 words
A plasma processing apparatus comprising: plasma generating means for generating plasma containing electrically-neutral reaction species; a processing area for processing a workpiece with said reaction species; and, mirror magnetic field generating means disposed between said plasma generating means and said processing area for restricting charged particles from moving from said plasma generating means to said processing area.
Claim 11
Dependent Claim
57 words
A plasma processing apparatus comprising: plasma generating means for generating plasma containing electrically-neutral reaction species; a processing area for processing a workpiece with said reaction species; and, mirror magnetic field generating means disposed between said plasma generating means and said processing area for restricting charged particles from moving from said plasma generating means to said processing area.
Claim 12
Dependent Claim
26 words
A plasma processing apparatus according to claim 9, wherein said workpiece is a semiconductor wafer having photoresist on its surface, and the processing is photoresist ashing.
Claim 13
Dependent Claim
19 words
A plasma processing apparatus according to claim 9, wherein said mirror magnetic field generating means is an electrical coil.
Claim 14
Dependent Claim
32 words
A plasma processing apparatus according to claim 9, wherein the direction of said mirror magnetic field is parallel to that of gas flow from said plasma generating area to said processing area.
Claim 15
Dependent Claim
24 words
A plasma processing apparatus according to claim 9, wherein said plasma generating means is located above said processing area, and the gas flows downward.
Claim 16
Dependent Claim
30 words
A plasma processing apparatus according to claim 9, further comprising a baffle installed between said mirror magnetic field generating means and said workpiece to at least partly block charged particles.
Claim 17
Dependent Claim
32 words
A plasma processing apparatus according to claim 9, further comprising a baffle installed between said mirror magnetic field generating means and said plasma generating means to at least partly block charged particles.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-05-19 | 1995-11-18 | 1996-05-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-05-19 | 1999-11-18 | 2000-05-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-05-19 | 2003-11-18 | 2004-05-19 | $7700.00 | Window Closed / Lapsed |