← Back to Patent Explorer
US5024748A Expired / Lapsed US ⏱️ 0.0 years remaining

Microwave plasma processing apparatus

Assignee: Fujitsu Semiconductor Ltd
•
Filing: 1990-01-22
•
Granted: 1991-06-18
•
Expires: 2010-01-22
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A microwave plasma processing apparatus used for etching or ashing processes of a semiconductor substrate, comprising a plasma generation chamber, into which a reactive gas and microwave power are introduced, a reaction chamber in which the substrate is disposed for processing, and a plasma shield plate separating the reaction chamber from the plasma generation chamber, the plasma shield plate being of electrically conductive material and having at least a hole for flowing the plasma into the reaction chamber and forming a portion of the plasma generation chamber. The microwave plasma processing apparatus of the invention further comprises a cover member disposed on a surface of the plasma shield plate facing the plasma generation chamber and made of inactive material with active species included in the plasma such as quartz and alumina ceramic.

Inventors

  • 👤 Shuzo Fujimura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 08:22
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H01J37/3244; H01J37/32009; H01J37/32357; H01J37/32623; Y; Y10; Y10S; Y10S156/00; Y10S156/914

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 143 words
A microwave plasma processing apparatus, comprising: a plasma generation chamber for generating plasma by irradiating microwave power to a reactive gas introduced therein, a reaction chamber disposed on a downstream side of the reactive gas for receiving a substrate to be processed therein, a plasma shield plate separating the reaction chamber from the plasma generation chamber, the plasma shield plate being of electrically conductive material and having at least a hole for allowing the plasma to flow into the reaction chamber and forming a portion of the plasma generation chamber, and a separate cover member disposed on the surface of said plasma shield plate facing the plasma generation chamber, said cover member being of a sufficient thickness to prevent cracking or peeling phenomena due to thermal stresses, and made of an inactive material with respect to the active species included in the plasma.
Claim 2
Dependent Claim 143 words
A microwave plasma processing apparatus, comprising: a plasma generation chamber for generating plasma by irradiating microwave power to a reactive gas introduced therein, a reaction chamber disposed on a downstream side of the reactive gas for receiving a substrate to be processed therein, a plasma shield plate separating the reaction chamber from the plasma generation chamber, the plasma shield plate being of electrically conductive material and having at least a hole for allowing the plasma to flow into the reaction chamber and forming a portion of the plasma generation chamber, and a separate cover member disposed on the surface of said plasma shield plate facing the plasma generation chamber, said cover member being of a sufficient thickness to prevent cracking or peeling phenomena due to thermal stresses, and made of an inactive material with respect to the active species included in the plasma.
Claim 3
Dependent Claim 42 words
A microwave plasma processing apparatus as recited in claim 1, wherein said cover member is of the material with which the active species of the plasma have a smaller recombination coefficient than that with said conductive material of the plasma shield plate.
Claim 4
Dependent Claim 25 words
A microwave plasma processing apparatus as recited in claim 1, wherein said electrically conductive material of the plasma shield plate is a metal comprising aluminum.
Claim 5
Dependent Claim 19 words
A microwave plasma processing apparatus as recited in claim 1, wherein the material of said cover member is quartz.
Claim 6
Dependent Claim 20 words
A microwave plasma processing apparatus as recited in claim 1, wherein the material of said cover member is alumina ceramic.
Claim 7
Dependent Claim 20 words
A microwave plasma processing apparatus as recited in claim 1, wherein said reactive gas to generate the plasma includes oxygen.
Claim 8
Dependent Claim 26 words
A microwave plasma processing apparatus as recited in claim 6, wherein said reactive gas to generate the plasma further includes fluoride containing gas or/and nitrogen gas.
Claim 9
Dependent Claim 71 words
A microwave plasma processing apparatus as recited in claim 1, wherein said reaction chamber is partitioned forming a diffusion chamber located on the bottom side of the plasma shield plate, and the plasma shield plate including said hole forms an upper portion of the diffusion chamber and a diffusion plate forms a lower portion thereof, the diffusion plate having a plurality of another holes facing the substrate in the reaction chamber.

References Cited (Backward Citations)

US4718976A Cited
US4512868A Cited
US4609428A Cited
US4631105A Cited
US4901667A Cited
US4820370A Cited
US4931135A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-06-17 1994-12-17 1995-06-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-06-17 1998-12-17 1999-06-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-06-17 2002-12-17 2003-06-18 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag