Patent US2934366A successfully refreshed from Google Patents.
Patent US5113764A successfully refreshed from Google Patents.
US5113764A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor bridge (SCB) packaging system
Assignee: Olin Corp
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Filing: 1991-05-13
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Granted: 1992-05-19
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Expires: 2011-05-13
Abstract
Abstract The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primar housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.
Inventors
- 👤 Frank N. Mandigo
- 👤 George C. Mei
- 👤 Julius C. Fister
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 15:47
CPC Classifications
F; F42; F42B; F42B3/00; F42B3/10; F42B3/12; F42B3/13
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
136 words
A primer housing for a semiconductor bridge device, comprising: a primer cup having a base and sidewalls with an aperture formed in said base; a primer button located within said aperture and electrically isolated from said primer cup; an electrical conductive washer contacting a bonding site on said semiconductor bridge device and being in electrical contact with both said semiconductor bridge device and an interior surface of said sidewalls; said primer cup, primer button, and electrically conductive washer individually selected from the group consisting of copper, aluminum, copper alloys, aluminum alloys andiron-nickel alloys; an electrically conductive compliant die attach material both bonding and electrically interconnecting said semiconductor bridge device to said primer button; and a dielectric material selected from the group consisting of polymers, ceramics and glasses disposed between said primer button and said primer cup.
Claim 2
Dependent Claim
136 words
A primer housing for a semiconductor bridge device, comprising: a primer cup having a base and sidewalls with an aperture formed in said base; a primer button located within said aperture and electrically isolated from said primer cup; an electrical conductive washer contacting a bonding site on said semiconductor bridge device and being in electrical contact with both said semiconductor bridge device and an interior surface of said sidewalls; said primer cup, primer button, and electrically conductive washer individually selected from the group consisting of copper, aluminum, copper alloys, aluminum alloys andiron-nickel alloys; an electrically conductive compliant die attach material both bonding and electrically interconnecting said semiconductor bridge device to said primer button; and a dielectric material selected from the group consisting of polymers, ceramics and glasses disposed between said primer button and said primer cup.
Claim 3
Dependent Claim
33 words
The primer housing of claim 1 wherein said washer is formed from a copper alloy having a spring temper and is maintained in electrical contact with said semiconductor bridge device by spring tension.
Claim 4
Dependent Claim
21 words
The primer housing of claim 2 wherein said semiconductor bridge device includes bumps on the bonding site which contacts said washer.
Claim 5
Dependent Claim
21 words
The primer housing of claim 3 wherein a gold metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 6
Dependent Claim
21 words
The primer housing of claim 3 wherein a silver metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 7
Dependent Claim
21 words
The primer housing of claim 2 wherein a gold metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 8
Dependent Claim
21 words
The primer housing of claim 2 wherein a silver metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 9
Dependent Claim
24 words
The primer housing of claim 2 wherein said copper alloy washer is selected from the group consisting of copper alloys C194, C195 and C260.
Claim 10
Dependent Claim
15 words
The primer housing of claim 8 wherein said washer is silver plated copper alloy C260.
Claim 11
Dependent Claim
23 words
The primer housing of claim 9 wherein a nickel diffusion layer is disposed between said copper alloy C260 washer and said silver plating.
Claim 12
Dependent Claim
15 words
The primer housing of claim 8 wherein said washer is gold plated copper alloy C260.
Claim 13
Dependent Claim
23 words
The primer housing of claim 11 wherein a nickel diffusion layer is disposed between said gold plating and said copper alloy C260 washer.
Claim 14
Dependent Claim
25 words
The primer housing of claim 1 wherein said washer is maintained in electrical contact with said semiconductor bridge device by soldering to said bonding site.
Claim 15
Dependent Claim
137 words
A primer housing for a semiconductor bridge device, comprising: a primer cup having a base and sidewalls with an aperture formed in said base; a primer button located within said aperture and electrically isolated from said primer cup; an electrical conductive washer contacting a bonding site on said semiconductor bridge device and being in electrical contact with both said semiconductor bridge device and an interior surface of said sidewalls; said primer cup, primer button, and electrically conductive washer individually selected from the group consisting of copper, aluminum, copper alloys, aluminum alloys and iron-nickel alloys; an electrically conductive buffered die attach material, both bonding and electrically interconnecting said semiconductor bridge device to said primer button; and a dielectric material selected from the group consisting of polymers, ceramics and glasses disposed between said primer button and said primer cup.
Claim 16
Dependent Claim
137 words
A primer housing for a semiconductor bridge device, comprising: a primer cup having a base and sidewalls with an aperture formed in said base; a primer button located within said aperture and electrically isolated from said primer cup; an electrical conductive washer contacting a bonding site on said semiconductor bridge device and being in electrical contact with both said semiconductor bridge device and an interior surface of said sidewalls; said primer cup, primer button, and electrically conductive washer individually selected from the group consisting of copper, aluminum, copper alloys, aluminum alloys and iron-nickel alloys; an electrically conductive buffered die attach material, both bonding and electrically interconnecting said semiconductor bridge device to said primer button; and a dielectric material selected from the group consisting of polymers, ceramics and glasses disposed between said primer button and said primer cup.
Claim 17
Dependent Claim
33 words
The primer housing of claim 14 wherein said washer is formed from a copper alloy having a spring temper and is maintained in electrical contact with said semiconductor bridge device by spring tension.
Claim 18
Dependent Claim
21 words
The primer housing of claim 15 wherein said semiconductor bridge device includes bumps on the bonding site which contacts said washer.
Claim 19
Dependent Claim
21 words
The primer housing of claim 16 wherein a gold metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 20
Dependent Claim
21 words
The primer housing of claim 16 wherein a silver metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 21
Dependent Claim
21 words
The primer housing of claim 15 wherein a gold metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 22
Dependent Claim
21 words
The primer housing of claim 15 wherein a silver metallization layer is deposited on said bonding site to reduce electrical resistivity.
Claim 23
Dependent Claim
24 words
The primer housing of claim 15 wherein said copper alloy washer is selected from the group consisting of copper alloys C194, C195 and C260.
Claim 24
Dependent Claim
15 words
The primer housing of claim 21 wherein said washer is silver plated copper alloy C260.
Claim 25
Dependent Claim
23 words
The primer housing of claim 22 wherein a nickel diffusion layer is disposed between said copper alloy C260 washer and said silver plating.
Claim 26
Dependent Claim
15 words
The primer housing of claim 21 wherein said washer is gold plated copper alloy C260.
Claim 27
Dependent Claim
23 words
The primer housing of claim 24 wherein a nickel diffusion layer is disposed between said gold plating and said copper alloy C260 washer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-05-19 | 1995-11-18 | 1996-05-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-05-19 | 1999-11-18 | 2000-05-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-05-19 | 2003-11-18 | 2004-05-19 | $7700.00 | Window Closed / Lapsed |