US5113239A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated device with improved connections between the pins and the semiconductor material chip
Assignee: STMicroelectronics SRL
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Filing: 1990-09-17
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Granted: 1992-05-12
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Expires: 2010-09-17
Abstract
Abstract An integrated device with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.
Inventors
- 👤 Carlo Cini
- 👤 Angelo Massironi
- 👤 Luigi Sisti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 14:15
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/50; H10W72/90; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07552; H10W72/07553; H10W72/07555; H10W72/521; H10W72/527; H10W72/531; H10W72/5363; H10W72/537; H10W72/541; H10W72/5445; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/557; H10W72/59; H10W72/921; H10W72/926; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
81 words
Integrated device with improved connections between the pins and the semiconductor material chip, wherein said connections are constituted by wires including wires made of at least a first material for chip power connections and wires made of at least a second material for chip signal connections, said first material comprising aluminium or alloys with a prevalence of aluminium, said second material comprising gold or alloys with prevalence of gold, and wherein said pins are partially coated with a layer of gold.
Claim 2
Dependent Claim
81 words
Integrated device with improved connections between the pins and the semiconductor material chip, wherein said connections are constituted by wires including wires made of at least a first material for chip power connections and wires made of at least a second material for chip signal connections, said first material comprising aluminium or alloys with a prevalence of aluminium, said second material comprising gold or alloys with prevalence of gold, and wherein said pins are partially coated with a layer of gold.
Claim 3
Dependent Claim
15 words
Device according to claim 1, wherein said wires made of different materials have different diameters.
Claim 4
Dependent Claim
29 words
Device according to claim 1, wherein said layer of gold is provided only at the ends of the pins which are enclosed in the package of the integrated device.
Claim 5
Dependent Claim
74 words
Integrated device with improved connections between the pins and the semiconductor material chip, wherein said connections are constituted by wires made of different materials, said wires having different diameters, said different materials being constituted by aluminium or alloys with a prevalence of aluminium for the chip power connections and by gold or alloys with prevalence of gold for the chip signal connections, and wherein said pins are partially coated with a layer of gold.
Claim 6
Dependent Claim
74 words
Integrated device with improved connections between the pins and the semiconductor material chip, wherein said connections are constituted by wires made of different materials, said wires having different diameters, said different materials being constituted by aluminium or alloys with a prevalence of aluminium for the chip power connections and by gold or alloys with prevalence of gold for the chip signal connections, and wherein said pins are partially coated with a layer of gold.
Claim 7
Dependent Claim
29 words
Device according to claim 4, wherein said layer of gold is provided only at the ends of the pins which are enclosed in the package of the integrated device.
Claim 8
Dependent Claim
103 words
In an integrated device comprising pins, power pads and signal pads on a semiconductor material chip, a plurality of improved connections between said pins and respectively said power pads and said signal pads, wherein said connections are constituted by wires made of different materials, said wires having different diameters, said different materials being constituted by aluminium or alloys with a prevalence of aluminium for the connections to said power pads and by gold or alloys with prevalence of gold for the connections to said signal pads, wherein the area of said signal pads is significantly smaller than the area of said power pads.
Claim 9
Dependent Claim
103 words
In an integrated device comprising pins, power pads and signal pads on a semiconductor material chip, a plurality of improved connections between said pins and respectively said power pads and said signal pads, wherein said connections are constituted by wires made of different materials, said wires having different diameters, said different materials being constituted by aluminium or alloys with a prevalence of aluminium for the connections to said power pads and by gold or alloys with prevalence of gold for the connections to said signal pads, wherein the area of said signal pads is significantly smaller than the area of said power pads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-05-12 | 1995-11-11 | 1996-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-05-12 | 1999-11-11 | 2000-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-05-12 | 2003-11-11 | 2004-05-12 | $7700.00 | Window Closed / Lapsed |