Pluggable electronic circuit package assembly with snap together heat sink housing

Claim 2

An electronic circuit package assembly pluggable into an edge type connector, said assembly comprising: a planar printed circuit substrate having a rectangular configuration and first and second parallel major outer surfaces with first and second predetermined circuit patterns, respectively, thereon, and conductive means in said substrate for interconnecting said first and second patterns, said substrate having a predetermined first region including therein a portion of at least said first circuit pattern, said portion having at least one row of input/output printed circuit terminals, said row of input/output printed circuit terminals being in substantial proximity alignment with and located in substantial proximity to a predetermined edge of said substrate, said predetermined edge and said input/output printed circuit terminals being pluggable into a compatible edge type connector for connection thereto; at least one first row of first integrated circuit chip means mounted on said first major surface and connected to said first circuit pattern; at least one second row of second integrated circuit chip means mounted on said second major surface and connected to said second circuit pattern, said mounted first and second chip means having a predetermined first height profile, said first and second rows of mounted chip means being in substantial parallel alignment with said predetermined edge, said mounted first and second chip means further being located in a second region of said substrate; at least one row of circuit components mounted on at least a predetermined one of said major surfaces and connected to said circuit pattern on said predetermined one of said major surfaces on which said circuit components are mounted, said mounted circuit components having a predetermined second height profile larger than said first height profile, said row of said circuit components being in substantial parallel alignment with said predetermined edge, said circuit components further being located in a third region of said substrate; heat sink housing means having first and second heat sink housing members in an abutting facing relationship defining an enclosure, said enclosure enclosing therein said second and third regions of said substrate and said mounted chip means and said circuit components located respectively therein, said first region and said predetermined edge being extended outwardly from said enclosure; and retention means for retaining said first and second heat sink housing members together and said substrate in registration with said enclosure defined thereby, said retention means further comprising a first retention post extending from one of said first and second heat sink housing members and a first recess in the other of said first and second heat sink housing members for receiving therein said first post with a predetermined tolerance fit to retain said first and second heat sink housing members together, said substrate further having a first opening extending there through, said first post passing through said first opening to maintain said substrate in said registration with said enclosure.

Claim 3

An electronic circuit package assembly according to claim 1, wherein said retention means further comprises a second retention post extending from one of said first and second heat sink housing members and a second recess in the other of said first and second heat sink housing members for receiving therein said second post with a predetermined tolerance fit, said second post and said second recess coacting with said first post and said first recess to retain said first and second heat sink housing members together, said substrate further having a second opening extending there through, said second post passing through said second opening, said second post and said second opening coacting with said first post and said first opening to maintain said substrate in registration with said enclosure.

Claim 4

An electronic circuit package assembly according to claim 2 wherein said first post extends from said first heat sink housing member and said second post extends from said second heat sink housing member.

Claim 5

An electronic circuit package assembly according to claim 1 wherein said first and second heat sink housing members are in facing relationship with said first and second major surfaces, respectively, of said substrate, each of said heat sink housing members having first and second recessed chambers for receiving therein the chip means and circuit components, respectively, mounted on the particular one of the major surfaces in facing relationship therewith.

Claim 6

An electronic circuit package assembly according to claim 1 further comprising latching means for latching said assembly to said compatible edge type connector.

Claim 7

An electronic circuit package assembly according to claim 5 wherein said latching means comprises a pair of latch receiving openings located in said first region of said substrate and extending through said substrate, and a pair of latches connected to said compatible edge type connector, said pair of latches being engagable with said pair of latch receiving openings for said latching of said assembly to said connector when said predetermined edge and said input/output printed circuit terminals are plugged into said compatible edge type connector for connection thereto.

Claim 8

An electronic circuit package assembly according to claim 5 wherein said latching means comprises at least one latch member and at least one latch receiving member engagable therewith, a predetermined one of said latch member and said latch receiving member being connected in a predetermined manner to said heat sink housing means and the other of said latch member and said latch receiving member being connected in a predetermined manner to said connector.

Claim 9

An electronic circuit package assembly according to claim 7 wherein said latch receiving member is connected to said heat sink housing means and said latch member is connected to said connector.

Claim 10

An electronic circuit package assembly according to claim 8 wherein said latch member further comprises resilient means for clamping said first and second heat sink members together when said latch member engages said latch receiving member.

Claim 11

An electronic circuit package assembly according to claim 7 wherein said latch receiving member is connected to said connector and said latch member is connected to said heat sink housing means.

Claim 12

An electronic circuit package assembly according to claim 10 wherein said latch member is demountably connected to said heat sink housing means, said latch member further, having resilient means for clamping said first and second heat sink housing members together when said latch member engages said latch receiving member.

Claim 13

An electronic circuit package assembly according to claim 1, said assembly further comprising first and second sets of corresponding plurality planar cooling fins outwardly extending from said first and second heat sink housing members, respectively, each of the cooling fins of said first set being parallel to and aligned with the other cooling fins of said first set, each of the cooling fins of said second set being parallel to and aligned with the other cooling fins of said second set, each of the cooling fins of said first set being further in substantial coplanar and coextensive alignment with a mutually exclusive one of the cooling fins of said second set.

Claim 14

An electronic circuit package assembly according to claim 12 further comprising at least one U-shaped clamping means for clamping said first and second heat sink housing members together, said clamping means having first and second resilient legs and an integral base, said first leg being slidably located between two adjacent fins of said first set and said second leg being slidably located between the corresponding two adjacent fins of said second set and said base straddling said first and second heat sink housing members at the edges thereof.

Claim 15

An electronic circuit package assembly according to claim 4, wherein said second and third regions of said substrate are adjacent to each other and collectively have a composite periphery on each of said first and second major surfaces of said substrate, said assembly further comprising first and second sealing means in a predetermined sealing contacting relationship with said heat sink housing means and said substrate, said first sealing means being in said predetermined sealing contacting relationship at said composite periphery of said first major surface, said second sealing means being in said predetermined sealing contacting relationship at said composite periphery of said second major surface, said first and second sealing means environmentally sealing said chip means and said circuit components within said heat sink housing means.

Claim 16

An electronic circuit package assembly according to claim 4 wherein said first and second chambers have third and fourth height profiles, respectively, compatible to said first and second height profiles, respectively, for receiving therein said chip means and said circuit components, respectively, in a predetermined thermal contacting relationship.

Claim 17

An electronic circuit package assembly according to claim 15 further comprising compressible thermally conductive means disposed in said first and second chambers, said thermally conductive means being in contact with said first and second chambers and with the respective said chip means and said components housed respectively therein to provide said predetermined thermal contacting relationship.

Claim 18

An electronic circuit package assembly according to claim 1 wherein said chip means comprise a plurality of integrated circuit chip directly bonded to said substrate.

Claim 19

An electronic circuit package assembly according to claim 1 wherein said chip means comprise a plurality of integrated circuit chip modules bonded to said substrate.

Claim 20

An electronic circuit package assembly according to claim 4 wherein each of said first and second heat sink housing members of said heat sink housing means further comprises: a U-shape first planar surface, a ring-like second planar surface parallel to said U-shaped first planar surface and having a predetermined configuration, and a transition surface inwardly recessed from said U-shaped first planar surface at a substantially right angle thereto and being extended between said U-shaped first planar surface and said ring-like second planar surface, said first and second chambers being inwardly recessed from said ring-like second planar surface; and wherein said U-shaped first planar surfaces of said first and second heat sink housing members are in aligned abutting contact with each other in said abutting relationship, and wherein said enclosure encloses said second and third regions of said substrate between said transition surfaces of said first and second heat sink housing members and between said ring-like second planar surfaces of said first and second heat sink housing members.

Claim 21

Heat sink apparatus for an electronic circuit package assembly, said package assembly including a planar printed circuit substrate having a rectangular configuration and first and second parallel major outer surfaces with first and second predetermined circuit patterns, respectively, thereon, and conductive means in said substrate for interconnecting said first and second patterns, said substrate having a predetermined first region including therein a portion of at least said first circuit pattern, said portion having at least one row of input/output printed circuit terminals, said row of input/output printed circuit terminals being in substantial parallel alignemtn with and located in substantial proximity to a predetermined edge of said substrate, said predetermined edge and said input/output printed circuit terminals being pluggable into a compatible edge type connector for connection thereto, and said assembly further having at least one first row of first integrated circuit chip means mounted on said first major surface and connected to said first circuit pattern, at least one second row of second integrated circuit chip means mounted on said second major surface and connected to said second circuit pattern, said mounted first and second chip means having a predetermined first height profile, said first and second rows of mounted chip means being in substantial parallel alignment with said predetermined edge, said mounted first and second chip means further being located in a second region of said substrate, at least one row of circuit components mounted on at least a predetermined one of said major surfaces and connected to said circuit pattern on said major surface on which said circuit components are mounted, said mounted circuit components having a predetermined second height profile larger than said first height profile, said row of said circuit components being in substantial parallel alignment with said predetermined edge, said circuit components further being located in a third region of said substrate, said heat sink apparatus comprising: heat sink housing means having first and second heat sink housing members in an abutting facing relationship defining an enclosure for enclosing therein said second and third regions of said substrate and said mounted chip means and said circuit components located respectively therein, and said first region and said predetermined edge being extended outwardly from said enclosure; and retention means for retaining said first and second heat sink housing members together and said substrate in registration with said enclosure defined thereby, said retention means further comprising a first retention post extending from one of said first and second heat sink housing members and a first recess in the other of said first and second heat sink housing members for receiving therein said first post with a predetermined tolerance fit to retain said first and second heat sink housing members together, said substrate further having a first opening extending there through, said first post passing through said first opening to maintain said substrate in said registration with said enclosure.

Claim 22

Heat sink apparatus for an electronic circuit package assembly, said package assembly including a planar printed circuit substrate having a rectangular configuration and first and second parallel major outer surfaces with first and second predetermined circuit patterns, respectively, thereon, and conductive means in said substrate for interconnecting said first and second patterns, said substrate having a predetermined first region including therein a portion of at least said first circuit pattern, said portion having at least one row of input/output printed circuit terminals, said row of input/output printed circuit terminals being in substantial parallel alignemtn with and located in substantial proximity to a predetermined edge of said substrate, said predetermined edge and said input/output printed circuit terminals being pluggable into a compatible edge type connector for connection thereto, and said assembly further having at least one first row of first integrated circuit chip means mounted on said first major surface and connected to said first circuit pattern, at least one second row of second integrated circuit chip means mounted on said second major surface and connected to said second circuit pattern, said mounted first and second chip means having a predetermined first height profile, said first and second rows of mounted chip means being in substantial parallel alignment with said predetermined edge, said mounted first and second chip means further being located in a second region of said substrate, at least one row of circuit components mounted on at least a predetermined one of said major surfaces and connected to said circuit pattern on said major surface on which said circuit components are mounted, said mounted circuit components having a predetermined second height profile larger than said first height profile, said row of said circuit components being in substantial parallel alignment with said predetermined edge, said circuit components further being located in a third region of said substrate, said heat sink apparatus comprising: heat sink housing means having first and second heat sink housing members in an abutting facing relationship defining an enclosure for enclosing therein said second and third regions of said substrate and said mounted chip means and said circuit components located respectively therein, and said first region and said predetermined edge being extended outwardly from said enclosure; and retention means for retaining said first and second heat sink housing members together and said substrate in registration with said enclosure defined thereby, said retention means further comprising a first retention post extending from one of said first and second heat sink housing members and a first recess in the other of said first and second heat sink housing members for receiving therein said first post with a predetermined tolerance fit to retain said first and second heat sink housing members together, said substrate further having a first opening extending there through, said first post passing through said first opening to maintain said substrate in said registration with said enclosure.

Claim 23

Heat sink apparatus according to claim 20, wherein said retention means further comprises a second retention post extending from one of said first and second heat sink housing members and a 5 second recess in the other of said first and second heat sink housing members for receiving therein said second post with a predetermined tolerance fit, said second post and said second recess coacting with said first post and said first recess to retain said first and second heat sink housing members together, said substrate further having a second opening extending there through, said second post passing through said second opening, said second post and said second opening coacting with said first post and said first opening to maintain said substrate in registration with said enclosure.

Claim 24

Heat sink apparatus according to claim 21 wherein said first post extends from said first heat sink housing member and said second post extends from said second heat sink housing member.

Claim 25

Heat sink apparatus according to claim 20 wherein said first and second heat sink housing members are in facing relationship with said first and second major surfaces, respectively, of said substrate, each of said heat sink housing members having first and second recessed chambers for receiving therein the chip means and circuit components, respectively, mounted on the particular one of the major surfaces in facing relationship therewith.

Claim 26

Heat sink apparatus according to claim 20 further comprising latching means for latching said assembly to said compatible edge type connector.

Claim 27

Heat sink apparatus according to claim 24 wherein said latching means comprises a pair of latch receiving openings located in said first region of said substrate and extending through said substrate, and a pair of latches connected to said compatible edge type connector, said pair of latches being engagable with said pair of latch receiving openings for said latching of said assembly to said connector when said predetermined edge and said input/output printed circuit terminals are plugged into said compatible edge type connector for connection thereto.

Claim 28

Heat sink apparatus according to claim 24 wherein said latching means comprises at least one latch member and at least one latch receiving member engagable therewith, a predetermined one of said latch member and said latch receiving member being connected in a predetermined manner to said heat sink housing means and the other of said latch member and said latch receiving member being connected in a predetermined manner to said connector.

Claim 29

Heat sink apparatus according to claim 26 wherein said latch receiving member is connected to said heat sink housing means and said latch member is connected to said connector.

Claim 30

Heat sink apparatus according to claim 27 wherein said latch member further comprises resilient means for clamping said first and second heat sink housing members together when said latch member engages said latch receiving member.

Claim 31

Heat sink apparatus according to claim 26 wherein said latch receiving member is connected to said connector and said latch member is connected to said heat sink housing means.

Claim 32

Heat sink apparatus according to claim 29 wherein said latch member is demountably connected to said heat sink housing means, said latch member further having resilient means for clamping said first and second heat sink housing members together when said latch member engages said latch receiving member.

Claim 33

Heat sink apparatus according to claim 20, said apparatus further comprising first and second sets of corresponding plural planar cooling fins outwardly extending from said first and second heat sink housing members, respectively, each of the cooling fins of said first set being parallel to and aligned with the other cooling fins of said first set, each of the cooling fins of said second set being parallel to and aligned with the other cooling fins of said second set, each of the cooling fins of said first set being further being in substantial coplanar and coextensive alignment with a mutually exclusive one of the cooling fins of said second set.

Claim 34

Heat sink apparatus according to claim 31 further comprising at least one U-shaped clamping means for clamping said first and second heat sink housing members together, said clamping means having first and second resilient legs and an integral base, said first leg being slidably located between two adjacent fins of said first set and said second leg being slidably located between the corresponding two adjacent fins of said second set and said base straddling said first and second heat sink housing members at the edges thereof.

Claim 35

Heat sink apparatus according to claim 23, wherein said second and third regions of said substrate are adjacent to each other and collectively have a composite periphery on each of said first and second major surfaces of said substrate, said apparatus further comprising first and second sealing means in a predetermined sealing contacting relationship with said heat sink housing means and said substrate, said first sealing means being in said predetermined sealing contacting relationship at said composite periphery of said first major surface, said second sealing means being in said predetermined sealing contacting relationship at said composite periphery of said second major surface, said first and second sealing means environmentally sealing said chip means and said circuit components within said heat sink housing means.

Claim 36

Heat sink apparatus according to claim 23 wherein said first and second chambers have third and fourth height profiles, respectively, compatible to said first and second height profiles, respectively, for receiving therein said chip means and said circuit components, respectively, in a predetermined thermal contacting relationship.

Claim 37

Heat sink apparatus according to claim 34 further comprising compressible thermally conductive means disposed in said first and second chambers, said thermally conductive means being in contact with said first and second chambers and with the respective said chip means and said components housed respectively therein to provide said predetermined thermal contacting relationship.

Claim 38

Heat sink apparatus according to claim 23 wherein each of said first and second heat sink housing members of said heat sink housing means further comprises: a U-shaped first planar surface, a ring-like second planar surface parallel to said U-shaped first planar surface and having a predetermined configuration, and a transition surface inwardly recessed from said U-shaped first planar surface at a substantially right angle thereto and being extended between said U-shaped first planar surface and said ring-like second planar surface, said first and second chambers being inwardly recessed from said ring-like second planar surface; and wherein said U-shaped first planar surfaces of said first and second heat sink housing members are in aligned abutting contact with each other in said abutting relationship, and wherein said enclosure encloses said second and third regions of said substrate between said transition surfaces of said first and second heat sink housing members and between said ring-like second planar surfaces of said first and second heat sink housing members.