Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
62 words
A ceramic electronic part including, a ceramic molded product, and an external electrode formed on an outer surface of said ceramic molded product, wherein said external electrode includes, an inner layer composed of conductive material and formed on a surface of said ceramic molded product, and an outer layer composed of conductive material and glass material, and formed on said inner layer.
Claim 2
Dependent Claim
62 words
A ceramic electronic part including, a ceramic molded product, and an external electrode formed on an outer surface of said ceramic molded product, wherein said external electrode includes, an inner layer composed of conductive material and formed on a surface of said ceramic molded product, and an outer layer composed of conductive material and glass material, and formed on said inner layer.
Claim 3
Dependent Claim
32 words
A ceramic electronic part in accordance with claim 1, wherein at least about 0.1% and not more than about 3% by weight of said glass material is contained in said outer layer.
Claim 4
Dependent Claim
24 words
A ceramic electronic part in accordance with claim 2, further comprising, a cover layer formed on said external electrode made of solder or tin.
Claim 5
Dependent Claim
15 words
A ceramic electronic part in accordance with claim 1, wherein said conductive material includes copper.
Claim 6
Dependent Claim
16 words
A ceramic electronic part in accordance with claim 4, wherein said glass material includes glass frit.
Claim 7
Dependent Claim
22 words
A ceramic electronic part in accordance with claim 5, wherein said ceramic molded product comprises ceramic material having a high dielectric constant.
Claim 8
Dependent Claim
18 words
A ceramic electronic part in accordance with claim 6, wherein said ceramic material is a Ba-Si-Zr-system ceramic material.
Claim 9
Independent Claim
96 words
A method of producing a ceramic electronic part comprising the steps of: molding a green ceramic material to form a molded product; coating a first conductive paste on outer surfaces of said molded product; coating a second conductive paste containing a glass frit on the surface of said first conductive paste; and baking said molded product onto which said first conductive paste and said second conductive paste containing the glass frit are coated, to form an external electrode on an outer surface of a ceramic molded final product which is formed by baking said molded product.
Claim 10
Independent Claim
96 words
A method of producing a ceramic electronic part comprising the steps of: molding a green ceramic material to form a molded product; coating a first conductive paste on outer surfaces of said molded product; coating a second conductive paste containing a glass frit on the surface of said first conductive paste; and baking said molded product onto which said first conductive paste and said second conductive paste containing the glass frit are coated, to form an external electrode on an outer surface of a ceramic molded final product which is formed by baking said molded product.
Claim 11
Dependent Claim
26 words
A method in accordance with claim 8 wherein said second conductive paste including the glass frit is constituted by a metal material and the glass frit.
Claim 12
Dependent Claim
31 words
A method in accordance with claim 9, wherein at least about 0.1% and not more than about 3% by weight of said glass frit is contained in said second conductive paste.
Claim 13
Dependent Claim
13 words
A method in accordance with claim 6, wherein said metal material is copper.
Claim 14
Dependent Claim
23 words
A method in accordance of claim 11, further comprising, a step of covering the surface of said external electrode with solder or tin.
Claim 15
Dependent Claim
20 words
A method in accordance with claim 11, wherein said ceramic molded product comprises ceramic material having a high dielectric constant.
Claim 16
Dependent Claim
16 words
A method in accordance with claim 13, wherein said ceramic material is a Ba-Si-Zr-system ceramic material.