Patent US5098501A successfully refreshed from Google Patents.
US5098501A
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US
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Pickup method and the pickup apparatus for chip-type part
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1990-12-07
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Granted: 1992-03-24
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Expires: 2010-12-07
Abstract
Abstract The present invention has an object to provide a pickup method and the pickup apparatus for chip type part capable of storing a part of chip type part kept adhered with a sufficient adhesive strength on an adhesive layer such as an expanded tape for a storage purpose while the other part of chip type part is adhered on the adhesive layer for current use. In order to achieve the object, there is provided a pickup technique for chip type part wherein an energy beam is radiated on a part of adhesive layer fixing the chip type part.
Inventors
- 👤 Masanori Nishiguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 14:36
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/04; H10P72/0442; H05; H05K; H05K13/00; H05K13/02; H05K13/021; H05K13/04; H05K13/0417; H10P72/74; H10P72/7402; H10P72/7412; H10P72/7414; Y; Y10; Y10S; Y10S156/00; Y10S156/934; Y10S156/941; Y10T; Y10T156/00; Y10T156/19; Y10T29/00; Y10T29/49; Y10T29/49815; Y10T29/49822
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
110 words
A method of picking up a chip part fixed on an adhesive layer formed on a tape member through which an energy beam is transmitted, the adhesive layer having an adhesive strength decreased upon radiation of the energy beam, comprising the steps of: radiating the energy beam, through said tape member, onto only a predetermined portion of said adhesive layer to which said chip part is fixed, wherein said predetermined portion is less than the total surface area of the chip, for leaving the other portion thereof adhered; and causing a collet to hold and peel off said chip part from the side of the tape opposite the energy beam.
Claim 2
Independent Claim
110 words
A method of picking up a chip part fixed on an adhesive layer formed on a tape member through which an energy beam is transmitted, the adhesive layer having an adhesive strength decreased upon radiation of the energy beam, comprising the steps of: radiating the energy beam, through said tape member, onto only a predetermined portion of said adhesive layer to which said chip part is fixed, wherein said predetermined portion is less than the total surface area of the chip, for leaving the other portion thereof adhered; and causing a collet to hold and peel off said chip part from the side of the tape opposite the energy beam.
Claim 3
Dependent Claim
42 words
A method according to claim 1, wherein when a polygonal bottom surface of the chip part is fixed to said adhesive layer, said predetermined portion of said adhesive layer is an adhesive layer for fixing a corner of said polygonal bottom surface.
Claim 4
Dependent Claim
43 words
A method according to claim 1, wherein when a polygonal bottom surface of the chip part is fixed to said adhesive layer, said predetermined portion of said adhesive layer is an adhesive layer for fixing one perimetral edge of said polygonal bottom surface.
Claim 5
Dependent Claim
46 words
A method according to claim 1, wherein when a polygonal bottom surface of the chip part is fixed to said adhesive layer, said predetermined portion of said adhesive layer is an adhesive layer for fixing a portion inside an outer edge of said polygonal bottom surface.
Claim 6
Independent Claim
132 words
A method of picking up a chip part fixed to an adhesive layer formed on a tape member through which an energy beam is transmitted, the adhesive layer having an adhesive strength decreased upon radiation of the energy beam, comprising the steps of: radiating the energy beam, through said tape member, onto only a predetermined portion of said adhesive layer to which said chip part is fixed, wherein said predetermined portion is less than the total surface area of the chip, for leaving the other portion thereof adhered; and bringing a plurality of pins into contact with said tape member and pushing up the chip part from said tape member away from said adhesive layer by said plurality of pins; and causing a collet to hold and peel off said chip part.
Claim 7
Independent Claim
132 words
A method of picking up a chip part fixed to an adhesive layer formed on a tape member through which an energy beam is transmitted, the adhesive layer having an adhesive strength decreased upon radiation of the energy beam, comprising the steps of: radiating the energy beam, through said tape member, onto only a predetermined portion of said adhesive layer to which said chip part is fixed, wherein said predetermined portion is less than the total surface area of the chip, for leaving the other portion thereof adhered; and bringing a plurality of pins into contact with said tape member and pushing up the chip part from said tape member away from said adhesive layer by said plurality of pins; and causing a collet to hold and peel off said chip part.
Claim 8
Dependent Claim
84 words
A method according to claim 5, wherein when a polygonal bottom surface of the chip part is fixed to said adhesive layer, a plurality of pins are brought into contact with the chip part wherein one of the pins is positioned separated from a corner of the chip part fixed on said predetermined portion of said adhesive layer by not less than a distance corresponding to 5% of a diagonal line length of said polygonal bottom surface, and the chip part is pushed up.
Claim 9
Dependent Claim
81 words
A method according to claim 5, wherein when a polygonal bottom surface of the chip part is fixed to said adhesive layer, a distal end of at least one of the group of a pin located at said predetermined portion of said adhesive layer and a pin located at a corner farthest from said predetermined portion, is brought into contact with said tape member with a lapse of time from contact between said tape member and distal ends of other pins.
Claim 10
Independent Claim
111 words
An apparatus for picking up a chip part fixed to an adhesive layer formed on a tape member through which an energy beam is transmitted, said adhesive layer having an adhesive strength decreased upon radiation of the energy beam, comprising: radiation means radiating the energy beam, through said tape member, onto only a predetermined portion of the adhesive layer to which said chip part is fixed, wherein said predetermined portion is less than the total surface area of the chip, for leaving the other portion thereof adhered; and a collet for holding said chip part and peeling off the chip part from the side of the tape opposite the energy beam.
Claim 11
Independent Claim
111 words
An apparatus for picking up a chip part fixed to an adhesive layer formed on a tape member through which an energy beam is transmitted, said adhesive layer having an adhesive strength decreased upon radiation of the energy beam, comprising: radiation means radiating the energy beam, through said tape member, onto only a predetermined portion of the adhesive layer to which said chip part is fixed, wherein said predetermined portion is less than the total surface area of the chip, for leaving the other portion thereof adhered; and a collet for holding said chip part and peeling off the chip part from the side of the tape opposite the energy beam.
Claim 12
Dependent Claim
48 words
An apparatus according to claim 8, wherein said radiation means includes an energy source for generating the energy beam, and a mask member, located between said energy source and said adhesive tape, for causing the energy beam to transmit through only said predetermined portion of said adhesive layer.
Claim 13
Dependent Claim
39 words
An apparatus according to claim 8, wherein said mask member is made of a member which does not cause the energy beam to transmit therethrough and which has a through hole at said predetermined portion of said adhesive layer.
Claim 14
Dependent Claim
31 words
An apparatus according to claim 8, wherein said mask member is made of a material for causing the energy beam to transmit through only said predetermined portion of said adhesive layer.
Claim 15
Dependent Claim
41 words
An apparatus according to claim 8, wherein said chip part has a polygonal bottom surface fixed to said adhesive layer, and said predetermined portion of said adhesive layer is an adhesive layer for fixing a corner of said polygonal bottom surface.
Claim 16
Dependent Claim
42 words
An apparatus according to claim 8, wherein said chip part has a polygonal bottom surface fixed to said adhesive layer, and said predetermined portion of said adhesive layer is an adhesive layer for fixing one perimetral edge of said polygonal bottom surface.
Claim 17
Dependent Claim
32 words
An apparatus according to claim 8, wherein said predetermined portion of said adhesive layer is an adhesive layer for fixing a portion of said polygonal bottom surface inside an outer edge thereof.
Claim 18
Dependent Claim
23 words
An apparatus according to claim 8, further comprising push-up means for pushing up the chip part toward said collet through said tape member.
Claim 19
Dependent Claim
70 words
An apparatus according to claim 15, wherein said chip part has a polygonal bottom surface fixed to said adhesive layer, and said push-up means comprises a plurality of pins, which are located at positions corresponding to said corners of said polygonal bottom surface and distal ends of which are brought into contact with said tape member from a side opposite to said adhesive layer, for pushing up said chip part.
Claim 20
Dependent Claim
59 words
An apparatus according to claim 16, wherein of said plurality of pins, a distal end of at least one of the group of a pin located at said predetermined portion of said adhesive layer and a pin located at a corner farthest from said predetermined portion, is farther separated from said adhesive tape than distal ends of other pins.
Claim 21
Dependent Claim
67 words
An apparatus according to claim 16, wherein said plurality of pins comprise a plurality of pins which are in contact with said tape member wherein one of the pins is positioned separated from a corner of the chip part fixed on said predetermined portion of said adhesive layer by not less than a distance corresponding to 5% of a diagonal line length of said polygonal bottom surface.
Claim 22
Dependent Claim
51 words
An apparatus according to claim 15, wherein said push-up means is brought into contact with said tape member from a side opposite to said adhesive layer by means of a flat member obtained by notching said predetermined portion of said adhesive layer, and said push-up means pushes up said chip part.
References Cited (Backward Citations)
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JPS62128139A
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US4718967A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-24 | 1995-09-23 | 1996-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-24 | 1999-09-23 | 2000-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-24 | 2003-09-23 | 2004-03-24 | $7700.00 | Window Closed / Lapsed |