Patent US5097406A successfully refreshed from Google Patents.
US5097406A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame lead located for wire bonder
Assignee: Texas Instruments Inc
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Filing: 1989-10-03
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Granted: 1992-03-17
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Expires: 2009-10-03
Abstract
Abstract A lead frame locater is used to locate actual positions of lead frame leads in respect to the semiconductor chip to provide accurate wire bonding of the semiconductor chip to the lead frame leads.
Inventors
- 👤 Mandayam A. Narasimhan
- 👤 Virge W. McClure
- 👤 Anthony L. Adams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 03:42
CPC Classifications
G; G05; G05B; G05B19/00; G05B19/02; G05B19/18; G05B19/408; G05B19/4083; G05B2219/00; G05B2219/30; G05B2219/37; G05B2219/37553; G05B2219/37555; G05B2219/45; G05B2219/45033; H; H10; H10W; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
96 words
A lead finger locating system for use with a semiconductor bonder wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising: a lead frame lead locating station the position of each lead frame lead and defining a reference point on the semiconductor chip; a bonder station including a semiconductor chip alignment camera and means for mathematically rotating the semiconductor chip through an angle to align the semiconductor chip; and computer controller system for locating the lead finger lead positions with respect to the reference point on semiconductor chip.
Claim 2
Dependent Claim
96 words
A lead finger locating system for use with a semiconductor bonder wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising: a lead frame lead locating station the position of each lead frame lead and defining a reference point on the semiconductor chip; a bonder station including a semiconductor chip alignment camera and means for mathematically rotating the semiconductor chip through an angle to align the semiconductor chip; and computer controller system for locating the lead finger lead positions with respect to the reference point on semiconductor chip.
Claim 3
Dependent Claim
24 words
The lead finger locating system according to claim 1, wherein all the lead frame leads are located with respect to an ideal lead frame.
Claim 4
Dependent Claim
31 words
The lead finger locating system according to claim 1, wherein after the semiconductor chip alignment, all lead frame lead positions are updated with reference to the new semiconductor chip alignment position.
Claim 5
Dependent Claim
27 words
The lead finger locating system according to claim 1, wherein a correction factor in input to the bonder station to compensate for misaligned lead frame lead locations.
Claim 6
Dependent Claim
28 words
The lead finger locating system according to claim 1, including an interface circuit to interface the lead frame locating station and the bonder station with the computer controller.
Claim 7
Dependent Claim
16 words
The lead finger locating system according to claim 1, wherein multiple lead fingers are located simultaneously.
Claim 8
Dependent Claim
107 words
A lead finger locating system for use with a semiconductor bonder wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising: a lead frame lead locating station including a camera for locating the position of each lead frame lead; a bonder station including a semiconductor chip alignment camera and means for mathematicaly rotating the semiconductor chip through an angle to align the semiconductor chip; computer controller system for locating the lead finger lead positions with respect to the aligned semiconductor chip; and an interface circuit for interfacing the lead frame locating station, the bonder station and the computer controller.
Claim 9
Dependent Claim
107 words
A lead finger locating system for use with a semiconductor bonder wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising: a lead frame lead locating station including a camera for locating the position of each lead frame lead; a bonder station including a semiconductor chip alignment camera and means for mathematicaly rotating the semiconductor chip through an angle to align the semiconductor chip; computer controller system for locating the lead finger lead positions with respect to the aligned semiconductor chip; and an interface circuit for interfacing the lead frame locating station, the bonder station and the computer controller.
Claim 10
Dependent Claim
23 words
The lead finger locating system according to claim 7, wherein the lead frame leads are located with respect to an ideal lead frame.
Claim 11
Dependent Claim
31 words
The lead finger locating system according to claim 7, wherein after the semiconductor chip alignment, all lead frame lead positions are updated with reference to the new semiconductor chip alignment position.
Claim 12
Dependent Claim
27 words
The lead finger locating system according to claim 7, wherein a correction factor is input to the bonder station to compensate for misaligned lead frame lead locations.
Claim 13
Independent Claim
73 words
A method for locating lead finger positions for use with a semiconductor bonder, wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising the steps of: defining a reference point on a semiconductor chip; locating the lead frame leads with respect to the semiconductor chip reference point; mathematically aligning the semiconductor chip; and relocating the lead frame leads with respect to the aligned semiconductor chip.
Claim 14
Independent Claim
73 words
A method for locating lead finger positions for use with a semiconductor bonder, wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising the steps of: defining a reference point on a semiconductor chip; locating the lead frame leads with respect to the semiconductor chip reference point; mathematically aligning the semiconductor chip; and relocating the lead frame leads with respect to the aligned semiconductor chip.
Claim 15
Dependent Claim
21 words
The method according to claim 11, wherein the lead frame leads are located with respect to an ideal lead frame reference.
Claim 16
Dependent Claim
23 words
The method according to claim 11, including the step of updating the lead frame lead locations with respect to the aligned semiconductor chip.
Claim 17
Dependent Claim
27 words
The method according to claim 11 including the step of inputting a correction factor input to the bonder station to compensate for misaligned lead frame lead locations.
Claim 18
Dependent Claim
25 words
The method according to claim 11, including an interface circuit to interface the lead frame locating station and the bonder station with the computer controller.
Claim 19
Dependent Claim
15 words
The method according to claim 11, including the step of locating multiple lead fingers simultaneously.
Claim 20
Dependent Claim
109 words
A lead finger locating system for use with a semiconductor bonder wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising: a lead frame lead locating station including a camera for locating the position of each lead frame lead; a bonder station including a semiconductor chip alignment camera; means for mathematically rotating the semiconductor chip through an angle to align the semiconductor chip; computer controller system for locating the lead finger lead positions with respect to the aligned semiconductor chip; and an interface circuit for interfacing one or more lead frame locating stations and the bonder stations with the computer controller.
Claim 21
Dependent Claim
109 words
A lead finger locating system for use with a semiconductor bonder wherein a semiconductor chip and bond pads thereon are interconnected with lead frame leads by wire bonding, comprising: a lead frame lead locating station including a camera for locating the position of each lead frame lead; a bonder station including a semiconductor chip alignment camera; means for mathematically rotating the semiconductor chip through an angle to align the semiconductor chip; computer controller system for locating the lead finger lead positions with respect to the aligned semiconductor chip; and an interface circuit for interfacing one or more lead frame locating stations and the bonder stations with the computer controller.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-17 | 1995-09-16 | 1996-03-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-17 | 1999-09-16 | 2000-03-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-17 | 2003-09-16 | 2004-03-17 | $7700.00 | Window Closed / Lapsed |