Lead frame and method of producing electronic components using such improved lead frame

Claim 1

A method of producing an electronic component comprising the steps of: providing a lead frame, the lead frame comprising: an outside frame portion having a central opening formed therein and defining interior sides of the outside frame portion, a mount portion for mounting an electronic component thereon, supported by said outside frame portion and disposed within said central opening thereof with the exterior sides of the mount portion in spaced relationship from the corresponding interior sides of the outside frame portion, at least one lead element array, comprising plural lead elements, disposed along an associated one of said exterior sides of said mount portion and a common tie bar element associated with each said lead element array, said common tie bar element being integrated with the outer ends of said plural lead elements of said array and thereby connecting together all of said plural lead elements thereof, and at least two expandable tie bar elements associated with each said lead element array, extending between and interconnecting said outside frame portion and said associated lead element array thereby to support said lead element array on said outside frame portion, each of said expandable tie bar elements being connected at one end thereof to said outside frame portion and at the other end thereof to said common tie bar element and including a shaped portion which can be expanded by deformation thereof; mounting an electronic element on the mount portion of said lead frame; sealing the mount portion of said lead frame, said electronic element mounted thereon, and the inner end portions of the lead elements of said lead frame with a suitable material; bending outer portions of the lead elements extending from the sealed portion by a press, the shaped portions of said expandable tie bar elements for supporting said lead element array from said outside frame portion being expanded to maintain the connection between the lead element array and said outside frame portion; performing an electrolytic-plating process, utilizing an electrolyte and an electrical source having a connection terminal, to plate the bent lead elements of said lead frame with a suitable alloy layer including completely submerging the bent lead elements of said lead frame in the electrolyte while maintaining a portion of the lead frame above the surface of the electrolyte and thus protruding upwardly from the surface, and connecting the upwardly protruding portion of said lead frame to the electrical source terminal; and trimming the bent and plated lead elements of said lead frame.

Claim 2

A method of producing an electronic component comprising the steps of: providing a lead frame, the lead frame comprising: an outside frame portion having a central opening formed therein and defining interior sides of the outside frame portion, a mount portion for mounting an electronic component thereon, supported by said outside frame portion and disposed within said central opening thereof with the exterior sides of the mount portion in spaced relationship from the corresponding interior sides of the outside frame portion, at least one lead element array, comprising plural lead elements, disposed along an associated one of said exterior sides of said mount portion and a common tie bar element associated with each said lead element array, said common tie bar element being integrated with the outer ends of said plural lead elements of said array and thereby connecting together all of said plural lead elements thereof, and at least two expandable tie bar elements associated with each said lead element array, extending between and interconnecting said outside frame portion and said associated lead element array thereby to support said lead element array on said outside frame portion, each of said expandable tie bar elements being connected at one end thereof to said outside frame portion and at the other end thereof to said common tie bar element and including a shaped portion which can be expanded by deformation thereof; mounting an electronic element on the mount portion of said lead frame; sealing the mount portion of said lead frame, said electronic element mounted thereon, and the inner end portions of the lead elements of said lead frame with a suitable material; bending outer portions of the lead elements extending from the sealed portion by a press, the shaped portions of said expandable tie bar elements for supporting said lead element array from said outside frame portion being expanded to maintain the connection between the lead element array and said outside frame portion; performing an electrolytic-plating process, utilizing an electrolyte and an electrical source having a connection terminal, to plate the bent lead elements of said lead frame with a suitable alloy layer including completely submerging the bent lead elements of said lead frame in the electrolyte while maintaining a portion of the lead frame above the surface of the electrolyte and thus protruding upwardly from the surface, and connecting the upwardly protruding portion of said lead frame to the electrical source terminal; and trimming the bent and plated lead elements of said lead frame.