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US5093986A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of forming bump electrodes

Assignee: Murata Manufacturing Co Ltd
•
Filing: 1991-02-04
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Granted: 1992-03-10
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Expires: 2011-02-04
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Abstract

Abstract A method of forming bump electrodes, which is characterized in that conductive pastes are applied to a surface on which bump electrodes are to be formed, metal balls are made to adhere to the applied conductive pastes utilizing the viscosity of the conductive pastes before the conductive pastes are dried, and the conductive pastes and the metal balls are cofired.

Inventors

  • 👤 Harufumi Mandai
  • 👤 Yoshikazu Chigodo
  • 👤 Atsushi Tojyo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 20:55
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K3/4015; H10; H10W; H10W70/00; H10W70/099; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49204; Y10T29/49208; Y10T29/4921

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 56 words
A method of forming bump electrodes, comprising the steps of: applying conductive pastes to a surface on which bump electrodes are to be formed; making metal balls adhere to the applied conductive pastes utilizing the viscosity of the conductive pastes before the conductive pastes are dried; and firing the conductive pastes integrally with the metal balls.
Claim 2
Independent Claim 56 words
A method of forming bump electrodes, comprising the steps of: applying conductive pastes to a surface on which bump electrodes are to be formed; making metal balls adhere to the applied conductive pastes utilizing the viscosity of the conductive pastes before the conductive pastes are dried; and firing the conductive pastes integrally with the metal balls.
Claim 3
Dependent Claim 20 words
The method according to claim 1, wherein the surfaces of said metal balls are plated so as to prevent rust.
Claim 4
Dependent Claim 15 words
The method according to claim 1, wherein the surfaces of said metal balls are solder-plated.
Claim 5
Dependent Claim 33 words
The method according to claim 1, which further comprises the step of grinding the metal balls so as to make the heights of the metal balls equal to each other after the firing.
Claim 6
Dependent Claim 45 words
The method according to claim 1, wherein the step of applying conductive pastes to a surface on which bump electrodes are to be formed comprises the steps of applying and drying first conductive pastes and applying second conductive pastes to the first conductive pastes dried.
Claim 7
Dependent Claim 20 words
The method according to claim 5, wherein the surfaces of said metal balls are plated so as to prevent rust.
Claim 8
Dependent Claim 15 words
The method according to claim 5, wherein the surfaces of said metal balls are solder-plated.
Claim 9
Dependent Claim 33 words
The method according to claim 5, which further comprises the step of grinding the metal balls so as to make the heights of the metal balls equal to each other after the firing.

References Cited (Backward Citations)

US3795047A Cited
US4829664A Cited
JPS6484992A Cited
US4857482A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-03-10 1995-09-09 1996-03-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-03-10 1999-09-09 2000-03-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-03-10 2003-09-09 2004-03-10 $7700.00 Window Closed / Lapsed

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